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Power Thermal Noise And Signal Integrity Issues On Substrate Interconnects Entanglement


Power Thermal Noise And Signal Integrity Issues On Substrate Interconnects Entanglement
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Power Thermal Noise And Signal Integrity Issues On Substrate Interconnects Entanglement


Power Thermal Noise And Signal Integrity Issues On Substrate Interconnects Entanglement
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Author : Yue Ma
language : en
Publisher: CRC Press
Release Date : 2019-03-08

Power Thermal Noise And Signal Integrity Issues On Substrate Interconnects Entanglement written by Yue Ma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-03-08 with Computers categories.


As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.



Power Thermal Noise And Signal Integrity Issues On Substrate Interconnects Entanglement


Power Thermal Noise And Signal Integrity Issues On Substrate Interconnects Entanglement
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Author : Yue Ma
language : en
Publisher: CRC Press
Release Date : 2019-03-08

Power Thermal Noise And Signal Integrity Issues On Substrate Interconnects Entanglement written by Yue Ma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-03-08 with Computers categories.


As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.



Smart Power Integration


Smart Power Integration
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Author : Mohamed Abouelatta
language : en
Publisher: John Wiley & Sons
Release Date : 2022-09-14

Smart Power Integration written by Mohamed Abouelatta and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-09-14 with Technology & Engineering categories.


Smart power integration is at the crossroads of different fields of electronics such as high and low power, engine control and electrothermal studies of devices and circuits. These circuits are complex and are heavily influenced by substrate coupling, especially where 3D integration is concerned. This book provides an overview of smart power integration, including high voltage devices, dedicated and compatible processes, as well as isolation techniques. Two types of integration are highlighted: modular or hybrid integration, together with compatible devices such as the insulated gate bipolar transistor (IGBT); and monolithic integration, specifically through the paradigm of functional integration. Smart Power Integration outlines the main MOS devices for high voltage integrated circuits, and explores into the fields of codesign, coupling hardware and software design, including applications to motor control. Studies focusing on heat pipes for electronics cooling are also outlined.



Analog Devices And Circuits 2


Analog Devices And Circuits 2
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Author : Christian Gontrand
language : en
Publisher: John Wiley & Sons
Release Date : 2024-02-23

Analog Devices And Circuits 2 written by Christian Gontrand and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-02-23 with Technology & Engineering categories.


At the end of the Second World War, a new technological trend was born: integrated electronics. This trend relied on the enormous rise of integrable electronic devices. Analog Devices and Circuits is composed of two volumes: the first deals with analog components, and the second with associated analog circuits. The goal here is not to create an overly comprehensive analysis, but rather to break it down into smaller sections, thus highlighting the complexity and breadth of the field. This first volume, after a brief history, describes the two main devices, namely bipolar transistors and MOS, with particular importance given to the modeling aspect. In doing so, we deal with new devices dedicated to radio frequency, which touches on nanoelectronics. We will also address some of the notions related to quantum mechanics. Finally, Monte Carlo methods, by essence statistics, will be introduced, which have become more and more important since the middle of the twentieth century. The second volume deals with the circuits that "use" the analog components that were introduced in Volume 1. Here, a particular emphasis is placed on the main circuit: the operational amplifier.



Composants Et Circuits Analogiques 2


Composants Et Circuits Analogiques 2
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Author : Christian Gontrand
language : fr
Publisher: ISTE Group
Release Date : 2024-10-30

Composants Et Circuits Analogiques 2 written by Christian Gontrand and has been published by ISTE Group this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-10-30 with Science categories.


La micro-électronique couvre un large éventail de domaines, allant du matériau à l’architecture des systèmes, en passant par les processus, le dispositif et le circuit. Depuis deux décennies, on parle aussi de nanoélectronique. La modélisation et les simulations afférentes sont devenues, dans la décennie 1980, un outil indispensable dans le domaine de la fabrication des systèmes intégrés. Ces simulations, devenues assez robustes, ont permis de réduire drastiquement les coûts de recherche et développement. Cet ouvrage complète le volume dédié aux modèles compacts. Ces modèles – sous forme de bibliothèques contenant des paramètres électriques modélisés et souvent obtenus parallèlement par des mesures – sont utilisés pour la simulation de circuits analogiques, en particulier pour l’amplificateur opérationnel, considéré comme le navire amiral de ces simulations.



Int Gration En Lectronique De Puissance


Int Gration En Lectronique De Puissance
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Author : Mohamed Abouelatta
language : fr
Publisher: ISTE Group
Release Date : 2022-11-29

Int Gration En Lectronique De Puissance written by Mohamed Abouelatta and has been published by ISTE Group this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-11-29 with Science categories.


L’intégration en électronique de puissance fait partie des défis scientifiques que l’automobile, l’industrie ou les entreprises de technologie doivent relever. Cet ouvrage analyse les points fondamentaux de ce domaine par des exemples concrets et détaillés. Les auteurs visent à l’intégration de systèmes de chaînes de puissance. Après avoir fait quelques rappels sur des composants de puissance de base, en particulier haute tension, Intégration en électronique de puissance traite des étapes de conception de commande de moteurs, adoptant pour cela une implémentation mixte (matérielle et/ou logicielle) d’algorithmes de commande de machines électriques. L’accent est porté sur la validation de la partie numérique (algorithme de contrôle-commande) et de la partie analogique de puissance (onduleur et moteur). In fine, plusieurs choix d’architecture sont proposés, à base de circuits programmables (FPGA) et de microprocesseurs (DSP). Enfin, le couplage avec le substrat est pris en compte, d’un point de vue proprement électronique, mais aussi par son aspect électrothermique.



Behavior Of Lizards


Behavior Of Lizards
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Author : Vincent Bels
language : en
Publisher: CRC Press
Release Date : 2019-02-06

Behavior Of Lizards written by Vincent Bels and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-02-06 with Nature categories.


Key features: Presents a contemporary snapshot of the mechanisms underlying the evolution and adaptation of behavior Explores how genetics, epigenetics, development, and environment shape behavior Discusses a broad range of behavioral repertoires and responses, including those related to thermoregulatory, foraging, predatory, displaying, social and escape strategies. Examines physiological and sensory mechanisms Covers the effects of various aspects of global change on behavior, with chapters that focus on the impacts of climate change on hydroregulatory behavior and behavioral responses to the effects of habitat alteration resulting from human-mediated change and colonization by invasive species. Lizards serve as focal organisms for many of biological questions related to evolution, ecology, physiology, and morphology. They are studied at multiple spatial and temporal scales, from the individual to the community level. This book, authored by expert contributors from around the world, explores behaviors underlying the evolution and adaptation of these organisms. It covers conceptual, empirical, and methodological approaches to the understanding of the role that natural and sexual selection play in molding the behavioral traits of lizards. This thorough, illustrated reference should stimulate discussion of the conceptual and methodological approaches for studying the behavioral traits of these fascinating and highly diverse vertebrates.



Phase Noise In Signal Sources


Phase Noise In Signal Sources
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Author : W. P. Robins
language : en
Publisher: IET
Release Date : 1984

Phase Noise In Signal Sources written by W. P. Robins and has been published by IET this book supported file pdf, txt, epub, kindle and other format this book has been release on 1984 with Technology & Engineering categories.


This book contains a thorough treatment of phase noise, its relationship to thermal noise and associated subjects such as frequency stability. The design of low phase noise signal sources, including oscillators and synthesisers, is explained and in many cases the measured phase noise characteristics are compared with the theoretical predictions. Full theoretical treatments are combined with physical explanations, helpful comments, examples of manufactured equipment and practical tips. Overall system performance degradations due to unwanted phase noise are fully analysed for radar systems and for both analogue and digital communications systems. Specifications for the acceptable phase noise performance of signal sources to be used in such systems are derived after allowing for both technical and economic optimisation. The mature engineer whose mathematics may be somewhat rusty will find that every effort has been made to use the lowest level of mathematical sophistication that is compatible with a full analysis and every line of each mathematical argument has been set out so that the book may be read and understood even in an armchair. Due to a novel approach to the analytical treatment of narrow band noise, the book is simple to understand while simultaneously carrying the analysis further in several areas than any existing publication.



Principles Of Power Integrity For Pdn Design Simplified


Principles Of Power Integrity For Pdn Design Simplified
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Author : Larry D. Smith
language : en
Publisher: Pearson
Release Date : 2017

Principles Of Power Integrity For Pdn Design Simplified written by Larry D. Smith and has been published by Pearson this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017 with Electromagnetic compatibility categories.


This guide's authors are the industry's leading experts in signal integrity and PDN. Smith has over 30 years' experience in electronics, system and PDN design at IBM, Sun Microsystems and Altera Corporation, and has architected today's most popular systematic approach to PDN design. Bogatin also has more than 30 years' experience in signal integrity, and has written the field's most popular SI text book, Signal and Power Integrity-Simplified. Here, they thoroughly illuminate the core principles at the foundation of PDN performance, including impedance, resonance, inductance, and signal propagation. They offer practical insights for understanding noise sources, and show how design features affect noise. Next, they help readers strengthen their intuition about how physical design decisions affect electrical performance, and complement their intuition with detailed analysis to carefully balance cost and robustness. Readers will find valuable rules of thumb, analytical approximations, examples of numerical simulations, and practical coverage of all PDN elements, from chip features to package, board, and voltage regulator module (VRM). The authors show to use measurement to anchor your designs to reality, characterizing components in the frequency domain, and characterizing systems in the time domain. They review the principles behind each measurement technique, as present multiple examples of measured performance of real world components and systems.



Carbon Nanotubes For Interconnects


Carbon Nanotubes For Interconnects
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Author : Aida Todri-Sanial
language : en
Publisher: Springer
Release Date : 2018-05-30

Carbon Nanotubes For Interconnects written by Aida Todri-Sanial and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-05-30 with Technology & Engineering categories.


This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.