Principles Of Reliable Soldering Techniques
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Principles Of Reliable Soldering Techniques
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Author : R. Sengupta
language : en
Publisher: New Age International
Release Date : 1997
Principles Of Reliable Soldering Techniques written by R. Sengupta and has been published by New Age International this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with categories.
Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical Requirements Essential To Ensure Its Reliability. The Four M'S; Material, Machine, Method And Man, Necessary For Designing A Solder Joint Have Been Described In Detail. Further, Process Control, Solder Joint Inspection Criteria, Solder Joint Defect Analysis And Its Repair/Rework Are Also Discussed.Additionally, Brief Introductions To Surface Mount Devices (Smd) And Surface Mount Technology (Smt) Have Been Included A Annexures. The Book Will Be Useful In Industry, And To Design Production, Process Planning And Quality Control Engineers, As Well As In Engineering/Technical Colleges To Students As A Reference Book For The Present And, Hopefully, Future Modified Courses. The Academicians May Find This Book Useful For Redesigning The Present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. And M.E. / M.Tech (Electrical, Electronic, Instrumentation) Syllabus.
Principles Of Soldering
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Author : Giles Humpston
language : en
Publisher: ASM International
Release Date : 2004
Principles Of Soldering written by Giles Humpston and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Technology & Engineering categories.
Principles Of Soldering
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Author : Giles Humpston
language : en
Publisher: ASM International(OH)
Release Date : 2004
Principles Of Soldering written by Giles Humpston and has been published by ASM International(OH) this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Science categories.
If you work with soldering processes or soldered components, Principles of Soldering will help you understand and solve practical engineering challenges. Clearly written and well referenced, this book takes you from the fundamental characteristics of solders, fluxes, and joining environments to the impact these have in the selection and successful use of soldering processes. Priority is given to the fundamental principles that underlie this field of technology rather than recipes for making joints. Striking a balance between being unduly simplistic or overly mathematical in their approach, the authors provide the critical analysis that is missing from much of the literature on soldering. An entire section is devoted to the difficult art of fluxless soldering and includes strategies for devising successful processes. The final chapter is devoted to recent advances in soldering technology and covers a variety of topics including lead-free solders, flip-chip interconnection, diffusion soldering, amalgams as solders, composite solders and other "hot" areas of research. Containing approximately 200 figures and 60 tables, this book updates and greatly expands the soldering content in the book Principles of Soldering and Brazing (1993) by the same authors. A companion volume, Principles of Brazing, is in development.
Solder Joint Reliability
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Author : John H. Lau
language : en
Publisher: Springer Science & Business Media
Release Date : 1991-05-31
Solder Joint Reliability written by John H. Lau and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991-05-31 with Computers categories.
Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation copyrighted by Book News, Inc., Portland, OR
Principles Of Brazing
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Author : David M. Jacobson
language : en
Publisher: ASM International
Release Date : 2005
Principles Of Brazing written by David M. Jacobson and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Technology & Engineering categories.
Lead Free Soldering Process Development And Reliability
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Author : Jasbir Bath
language : en
Publisher: John Wiley & Sons
Release Date : 2020-07-28
Lead Free Soldering Process Development And Reliability written by Jasbir Bath and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-07-28 with Technology & Engineering categories.
Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
Reflow Soldering Processes
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Author : Ning-Cheng Lee
language : en
Publisher: Newnes
Release Date : 2002-01-11
Reflow Soldering Processes written by Ning-Cheng Lee and has been published by Newnes this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-01-11 with Technology & Engineering categories.
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Modern Solder Technology For Competitive Electronics Manufacturing
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Author : Jennie S. Hwang
language : en
Publisher: McGraw Hill Professional
Release Date : 1996
Modern Solder Technology For Competitive Electronics Manufacturing written by Jennie S. Hwang and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Technology & Engineering categories.
Introduction Advanced Surface Mount Technology and Die Attach Techniques Solder Material Soldering Chemistry Solderability Microstructure of Solders Aqueous-Cleaning Manufacture No-Clean Manufacture Protective and Reactive Atmosphere Soldering Surface Mount Fine Pitch Technology Surface Mount-BGA/PAC Technology Soldering Methodology and Equipment Soldering and Soldering Related Issues Strengthened Solders Lead-Free Solders Solder Joint Failure Mode Solder Joint Failure Assessment-Case Studies Solder Joint Quality and Reliability New and Emerging Specifications and Standards Future Trends.
Smt Soldering Handbook
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Author : RUDOLF STRAUSS
language : en
Publisher: Elsevier
Release Date : 1998-02-24
Smt Soldering Handbook written by RUDOLF STRAUSS and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-02-24 with Technology & Engineering categories.
Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. - Written by founding father of SMT technology - Standard specifications have been fully updated - New chapter covering Ball Grid Array (BGA) technology
Army Rd A
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Author :
language : en
Publisher:
Release Date : 1995
Army Rd A written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Military research categories.
Professional publication of the RD & A community.