Problems And Solutions In Integrated Electronics
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Problems And Solutions In Integrated Electronics
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Author : R. Gopal
language : en
Publisher:
Release Date : 2006-02-01
Problems And Solutions In Integrated Electronics written by R. Gopal and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-02-01 with categories.
Device Electronics For Integrated Circuits
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Author : Richard S. Muller
language : en
Publisher: Wiley
Release Date : 1986
Device Electronics For Integrated Circuits written by Richard S. Muller and has been published by Wiley this book supported file pdf, txt, epub, kindle and other format this book has been release on 1986 with categories.
Problems In Electronics With Solutions
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Author : F. A. Benson
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Problems In Electronics With Solutions written by F. A. Benson and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Science categories.
Many changes have been made in this edition, first to the nomenclature so that the book is in agreement with the International System of Units (S. I. ) and secondly to the circuit diagrams so that they conform to B. S. S. 3939. The book has been enlarged and now has 546 problems. Much more emphasis has been given to semiconductor devices and transistor circuits, additional topics and references for further reading have been introduced, some of the original problems and solutions have been taken out and several minor modifications and corrections have been made. It could be argued that thermionic-valve circuits should not have been mentioned since valves are no longer considered important by most electronic designers except possibly for very high power or voltage applications. Some of the original problems on valves and valve circuits have been retained, however, for completeness because the material is still present in many syllabuses and despite the advent and prolification of solid-state devices in recent years the good old-fashioned valve looks like being in existence for a long time. There are still some topics readers may expect to find included which have had to be omitted; others have had less space devoted to them than one would have liked. A new feature of this edition is that some problems with answers, given at the end of each chapter, are left as student exercises so the solutions are not included. The author wishes to thank his colleagues Professor P. N.
Simulation Techniques And Solutions For Mixed Signal Coupling In Integrated Circuits
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Author : Nishath K. Verghese
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Simulation Techniques And Solutions For Mixed Signal Coupling In Integrated Circuits written by Nishath K. Verghese and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
The goal of putting `systems on a chip' has been a difficult challenge that is only recently being met. Since the world is `analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuit designers must also model coupling through the common substrate when simulating ICs to obtain an accurate estimate of coupled noise in their designs. Unfortunately, accurate simulation of substrate coupling has only recently begun to receive attention, and techniques for the same are not widely known. Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits addresses two major issues of the mixed-signal coupling problem -- how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques, and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a `build it and see' mentality.
Three Dimensional Integrated Circuit Design
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Author : Yuan Xie
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-12-02
Three Dimensional Integrated Circuit Design written by Yuan Xie and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-12-02 with Technology & Engineering categories.
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
Fundamentals Of Solid State Electronics
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Author : Chih-Tang Sah
language : en
Publisher: World Scientific
Release Date : 1996
Fundamentals Of Solid State Electronics written by Chih-Tang Sah and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Technology & Engineering categories.
This Solution Manual, a companion volume of the book, Fundamentals of Solid-State Electronics, provides the solutions to selected problems listed in the book. Most of the solutions are for the selected problems that had been assigned to the engineering undergraduate students who were taking an introductory device core course using this book.This Solution Manual also contains an extensive appendix which illustrates the application of the fundamentals to solutions of state-of-the-art transistor reliability problems which have been taught to advanced undergraduate and graduate students.
Linear Integrated Circuits Analysis Design Applications
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Author : B. Somanathan Nair
language : en
Publisher: John Wiley & Sons
Release Date : 2009-02
Linear Integrated Circuits Analysis Design Applications written by B. Somanathan Nair and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-02 with categories.
Special Features: " Explanation of theories involved in each case in a simple and clear manner." Explanations based on fundamental circuit theory." Theory followed by analysis." Step-by-step practical designs are given wherever needed." Practical solutions to problems." Numerical problems and solutions in all cases. " Excellent study text for beginners and experienced engineers." Three-dimensional illustrations." A major feature of the text is the step-by-step design procedure of opamp circuits which renders a great help in practical design problems." Excellent pedagogy and student-friendly format having:ü 260+ illustrationsü 160+ multiple-choice questionsü 400+ summary and review questionsü 150+ solved and unsolved problems About The Book: The new precise text from Wiley India deals with the theory, analysis, practical design, and applications of Bipolar and CMOS linear integrated circuits. It is written to cater the needs of sophomore and junior students of undergraduate programs in engineering, specifically in the areas of Electronics and Communication, Applied Electronics, Instrumentation, Biomedical, Electrical, Computer Science and Engineering, and Information Technology. It can also be used for students of undergraduate and graduate programs in the Applied-Sciences Category, especially, Electronics, Computer Science, Information Technology, and Physics. Two appendices (A and B) cover: A (Linear ICs) provides the classification of integration levels, types of linear-IC packages, basic temperature grades in which ICs are manufactured, designation of operational amplifiers, representation of IC manufacturing companies, identification of devices and manufacturing company and B (Some special circuits)- cover generalized impedance converter, negative-impedance converter (NIC), precision full wave rectifier, absolute-value output circuit, analog multiplier, applications of phase-locked loop (PLL).
Solutions Manual To Accompany Integrated Electronics
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Author : Jacob Millman
language : en
Publisher:
Release Date : 1972
Solutions Manual To Accompany Integrated Electronics written by Jacob Millman and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1972 with categories.
Counterfeit Integrated Circuits
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Author : Mark (Mohammad) Tehranipoor
language : en
Publisher: Springer
Release Date : 2015-02-12
Counterfeit Integrated Circuits written by Mark (Mohammad) Tehranipoor and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-02-12 with Technology & Engineering categories.
This timely and exhaustive study offers a much-needed examination of the scope and consequences of the electronic counterfeit trade. The authors describe a variety of shortcomings and vulnerabilities in the electronic component supply chain, which can result in counterfeit integrated circuits (ICs). Not only does this book provide an assessment of the current counterfeiting problems facing both the public and private sectors, it also offers practical, real-world solutions for combatting this substantial threat. · Helps beginners and practitioners in the field by providing a comprehensive background on the counterfeiting problem; · Presents innovative taxonomies for counterfeit types, test methods, and counterfeit defects, which allows for a detailed analysis of counterfeiting and its mitigation; · Provides step-by-step solutions for detecting different types of counterfeit ICs; · Offers pragmatic and practice-oriented, realistic solutions to counterfeit IC detection and avoidance, for industry and government.
Design For High Performance Low Power And Reliable 3d Integrated Circuits
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Author : Sung Kyu Lim
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-11-27
Design For High Performance Low Power And Reliable 3d Integrated Circuits written by Sung Kyu Lim and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-11-27 with Technology & Engineering categories.
This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.