Simulation Techniques And Solutions For Mixed Signal Coupling In Integrated Circuits

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Simulation Techniques And Solutions For Mixed Signal Coupling In Integrated Circuits
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Author : Nishath K. Verghese
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Simulation Techniques And Solutions For Mixed Signal Coupling In Integrated Circuits written by Nishath K. Verghese and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
The goal of putting `systems on a chip' has been a difficult challenge that is only recently being met. Since the world is `analog', putting systems on a chip requires putting analog interfaces on the same chip as digital processing functions. Since some processing functions are accomplished more efficiently in analog circuitry, chips with a large amount of analog and digital circuitry are being designed. Whether a small amount of analog circuitry is combined with varying amounts of digital circuitry or the other way around, the problem encountered in marrying analog and digital circuitry are the same but with different scope. Some of the most prevalent problems are chip/package capacitive and inductive coupling, ringing on the RLC tuned circuits that form the chip/package power supply rails and off-chip drivers and receivers, coupling between circuits through the chip substrate bulk, and radiated emissions from the chip/package interconnects. To aggravate the problems of designers who have to deal with the complexity of mixed-signal coupling there is a lack of verification techniques to simulate the problem. In addition to considering RLC models for the various chip/package/board level parasitics, mixed-signal circuit designers must also model coupling through the common substrate when simulating ICs to obtain an accurate estimate of coupled noise in their designs. Unfortunately, accurate simulation of substrate coupling has only recently begun to receive attention, and techniques for the same are not widely known. Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits addresses two major issues of the mixed-signal coupling problem -- how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques, and suggests possible solutions. Readers of this book should come away with a clear directive to simulate their design for interactions prior to building the design, versus a `build it and see' mentality.
Eda For Ic Implementation Circuit Design And Process Technology
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Author : Luciano Lavagno
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Eda For Ic Implementation Circuit Design And Process Technology written by Luciano Lavagno and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.
Medical Imaging
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Author : Krzysztof Iniewski
language : en
Publisher: John Wiley & Sons
Release Date : 2009-02-18
Medical Imaging written by Krzysztof Iniewski and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-02-18 with Science categories.
A must-read for anyone working in electronics in the healthcare sector This one-of-a-kind book addresses state-of-the-art integrated circuit design in the context of medical imaging of the human body. It explores new opportunities in ultrasound, computed tomography (CT), magnetic resonance imaging (MRI), nuclear medicine (PET, SPECT), emerging detector technologies, circuit design techniques, new materials, and innovative system approaches. Divided into four clear parts and with contributions from a panel of international experts, Medical Imaging systematically covers: X-ray imaging and computed tomography–X-ray and CT imaging principles; Active Matrix Flat Panel Imagers (AMFPI) for diagnostic medical imaging applications; photon counting and integrating readout circuits; noise coupling in digital X-ray imaging Nuclear medicine–SPECT and PET imaging principles; low-noise electronics for radiation sensors Ultrasound imaging–Electronics for diagnostic ultrasonic imaging Magnetic resonance imaging–Magnetic resonance imaging principles; MRI technology
Computer Aided Design Of Analog Integrated Circuits And Systems
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Author : Rob A. Rutenbar
language : en
Publisher: John Wiley & Sons
Release Date : 2002-05-06
Computer Aided Design Of Analog Integrated Circuits And Systems written by Rob A. Rutenbar and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-05-06 with Technology & Engineering categories.
The tools and techniques you need to break the analog design bottleneck! Ten years ago, analog seemed to be a dead-end technology. Today, System-on-Chip (SoC) designs are increasingly mixed-signal designs. With the advent of application-specific integrated circuits (ASIC) technologies that can integrate both analog and digital functions on a single chip, analog has become more crucial than ever to the design process. Today, designers are moving beyond hand-crafted, one-transistor-at-a-time methods. They are using new circuit and physical synthesis tools to design practical analog circuits; new modeling and analysis tools to allow rapid exploration of system level alternatives; and new simulation tools to provide accurate answers for analog circuit behaviors and interactions that were considered impossible to handle only a few years ago. To give circuit designers and CAD professionals a better understanding of the history and the current state of the art in the field, this volume collects in one place the essential set of analog CAD papers that form the foundation of today's new analog design automation tools. Areas covered are: * Analog synthesis * Symbolic analysis * Analog layout * Analog modeling and analysis * Specialized analog simulation * Circuit centering and yield optimization * Circuit testing Computer-Aided Design of Analog Integrated Circuits and Systems is the cutting-edge reference that will be an invaluable resource for every semiconductor circuit designer and CAD professional who hopes to break the analog design bottleneck.
Synthesis Of Power Distribution To Manage Signal Integrity In Mixed Signal Ics
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Author : Balsha R. Stanisic
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Synthesis Of Power Distribution To Manage Signal Integrity In Mixed Signal Ics written by Balsha R. Stanisic and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
In the early days of VLSI, the design of the power distribution for an integrated cir cuit was rather simple. Power distribution --the design of the geometric topology for the network of wires that connect the various power supplies, the widths of the indi vidual segments for each of these wires, the number and location of the power I/O pins around the periphery of the chip --was simple because the chips were simpler. Few available wiring layers forced floorplans that allowed simple, planar (non-over lapping) power networks. Lower speeds and circuit density made the choice of the wire widths easier: we made them just fat enough to avoid resistive voltage drops due to switching currents in the supply network. And we just didn't need enormous num bers of power and ground pins on the package for the chips to work. It's not so simple any more. Increased integration has forced us to focus on reliability concerns such as metal elec tromigration, which affects wire sizing decisions in the power network. Extra metal layers have allowed more flexibility in the topological layout of the power networks.
High Speed Integrated Circuit Technology
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Author : Mark J. W. Rodwell
language : en
Publisher: World Scientific
Release Date : 2001
High Speed Integrated Circuit Technology written by Mark J. W. Rodwell and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Technology & Engineering categories.
This book reviews the state of the art of very high speed digital integrated circuits. Commercial applications are in fiber optic transmission systems operating at 10, 40, and 100 Gb/s, while the military application is ADCs and DACs for microwave radar. The book contains detailed descriptions of the design, fabrication, and performance of wideband Si/SiGe-, GaAs-, and InP-based bipolar transistors. The analysis, design, and performance of high speed CMOS, silicon bipolar, and III-V digital ICs are presented in detail, with emphasis on application in optical fiber transmission and mixed signal ICs. The underlying physics and circuit design of rapid single flux quantum (RSFQ) superconducting logic circuits are reviewed, and there is extensive coverage of recent integrated circuit results in this technology. Contents: Preface (M J W Rodwell); High-Speed and High-Data-Bandwidth Transmitter and Receiver for Multi-Channel Serial Data Communication with CMOS Technology (M Fukaishi et al.); High-Performance Si and SiGe Bipolar Technologies and Circuits (M Wurzer et al.); Self-Aligned Si BJT/SiGe HBT Technology and Its Application to High-Speed Circuits (K Washio); Small-Scale InGaP/GaAs Heterojunction Bipolar Transistors for High-Speed and Low-Power Integrated-Circuit Applications (T Oka et al.); Prospects of InP-Based IC Technologies for 100-Gbit/S-Class Lightwave Communications Systems (T Enoki et al.); Scaling of InGaAs/InAlAs HBTs for High Speed Mixed-Signal and mm-Wave ICs (M J W Rodwell); Progress Toward 100 GHz Logic in InP HBT IC Technology (C H Fields et al.); Cantilevered Base InP DHBT for High Speed Digital Applications (A L Gutierrez-Aitken et al.); RSFQ Technology: Physics and Devices (P Bunyk et al.); RSFQ Technology: Circuits and Systems (D K Brock). Readership: Researchers, industrialists and academics in electrical and electronic engineering.
Fields Networks Computational Methods And Systems In Modern Electrodynamics
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Author : Peter Russer
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-04-17
Fields Networks Computational Methods And Systems In Modern Electrodynamics written by Peter Russer and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-04-17 with Science categories.
On June 1St 2004 the Faculty of Electrical Engineering and Information Technology of the Technische Universitat Miinchen bestowed the degree of the doctor honoris causa to Leopold B. Felsen, for extraordinary achievements in the theory of electromag netic fields. On this occasion on June 1St and 2nd 2004 at the Technische Universitat Miinchen a symposium on "Fields, Networks, Computational Methods, and Systems: A Modern View of Engineering Electrodynamics" in honor of Leopold B. Felsen was organized. The symposium topic focused on an important area of Leopold Felsen research interests and, as the title emphasizes, on a modern view of applied Electro dynamics. While the fundamental physical laws of electrodynamics are well known, research in this field is experiencing a steady continuous growth. The problem -solving approaches of, say, twenty years ago may seem now fairly obsolete since considerable progress has been made in the meantime. In this monograph we collect samples of present day state of the art in dealing with electromagnetic fields, their network theory representation, their computation and, finally, on system applications. The network formulation of field problems can improve the problem formulation and also contribute to the solution methodology. Network theory systematic approaches for circuit analysis are based on the separation of the circuit into the connection circuit and the circuit elements. Many applications in science and technology rely on computations of the electromagnetic field in either man-made or natural complex structures.
Substrate Noise Coupling In Mixed Signal Asics
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Author : Stéphane Donnay
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-05-31
Substrate Noise Coupling In Mixed Signal Asics written by Stéphane Donnay and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-05-31 with Technology & Engineering categories.
This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.
Scientific Computing In Electrical Engineering
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Author : Wilhelmus H. Schilders
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Scientific Computing In Electrical Engineering written by Wilhelmus H. Schilders and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Mathematics categories.
Interconnect Centric Design For Advanced Soc And Noc
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Author : Jari Nurmi
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-03-20
Interconnect Centric Design For Advanced Soc And Noc written by Jari Nurmi and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-03-20 with Technology & Engineering categories.
In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.