Proceedings Of The International Microelectronics Symposium
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Proceedings Of The International Microelectronics Symposium
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Author : International Society for Hybrid Microelectronics
language : en
Publisher:
Release Date : 1983*
Proceedings Of The International Microelectronics Symposium written by International Society for Hybrid Microelectronics and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1983* with Microelectronics categories.
Proceedings
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Author :
language : en
Publisher:
Release Date : 1984
Proceedings written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1984 with Electronic apparatus and appliances categories.
Proceedings Of The International Symposium On Microelectronics
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Author :
language : en
Publisher:
Release Date : 2000
Proceedings Of The International Symposium On Microelectronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Hybrid integrated circuits categories.
Index Of Conference Proceedings
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Author : British Library. Document Supply Centre
language : en
Publisher:
Release Date : 2001
Index Of Conference Proceedings written by British Library. Document Supply Centre and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Conference proceedings categories.
Current Serials Received
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Author : British Library. Document Supply Centre
language : en
Publisher:
Release Date : 1998
Current Serials Received written by British Library. Document Supply Centre and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Periodicals categories.
Materials For Advanced Packaging
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Author : Daniel Lu
language : en
Publisher: Springer
Release Date : 2016-11-18
Materials For Advanced Packaging written by Daniel Lu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-18 with Technology & Engineering categories.
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Electronics Packaging Forum
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Author : James E. Morris
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Electronics Packaging Forum written by James E. Morris and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.
Advances In Electrochemical Science And Engineering
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Author : Heinz Gerischer
language : en
Publisher: John Wiley & Sons
Release Date : 2008-09-26
Advances In Electrochemical Science And Engineering written by Heinz Gerischer and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-09-26 with Science categories.
Like its predecessors, volume three of this meanwhile well-established series covers selected topics from electrochemical science and its applications. The authors have been carefully selected among the leaders in the respective fields. Their authoritative and comprehensive contributions represent the latest state-of-the-art. Special attention is paid to recent developments, which are critically and thoroughly discussed. Each contribution of the present volume continues the high standards of this series. This new series has been warmly welcomed by scientists world-wide, which is reflected by the following review of the second volume: 'All the contributions in this volume are well up to the standard of this excellent series and will be of great value to electrochemists... The editors again deserve to be congratulated on this fine collection of reviews.' Journal of Electroanalytical Chemistry and Interfacial Chemistry
Ceramic Integration And Joining Technologies
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Author : Mrityunjay Singh
language : en
Publisher: John Wiley & Sons
Release Date : 2011-10-11
Ceramic Integration And Joining Technologies written by Mrityunjay Singh and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-10-11 with Technology & Engineering categories.
This book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage. This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators. The engineering challenge of designing and manufacturing complex structural, functional, and smart components and devices for the above applications from smaller, geometrically simpler units requires innovative development of new integration technology and skillful adaptation of existing technology.
Semiconductor Advanced Packaging
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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2021-05-17
Semiconductor Advanced Packaging written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-05-17 with Technology & Engineering categories.
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.