Recent Trends In Vlsi And Semiconductor Packaging
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Recent Trends In Vlsi And Semiconductor Packaging
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Author : T. Vasudeva Reddy
language : en
Publisher: CRC Press
Release Date : 2025-05-06
Recent Trends In Vlsi And Semiconductor Packaging written by T. Vasudeva Reddy and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-05-06 with Computers categories.
The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies (“SMART-2024”) aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. “SMART-2024” seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.
Electronics Engineer S Reference Book
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Author : F. F. Mazda
language : en
Publisher: Butterworth-Heinemann
Release Date : 2013-10-22
Electronics Engineer S Reference Book written by F. F. Mazda and has been published by Butterworth-Heinemann this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-22 with Technology & Engineering categories.
Electronics Engineer's Reference Book, Sixth Edition is a five-part book that begins with a synopsis of mathematical and electrical techniques used in the analysis of electronic systems. Part II covers physical phenomena, such as electricity, light, and radiation, often met with in electronic systems. Part III contains chapters on basic electronic components and materials, the building blocks of any electronic design. Part IV highlights electronic circuit design and instrumentation. The last part shows the application areas of electronics such as radar and computers.
Semiconductor Packaging
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Author : Andrea Chen
language : en
Publisher: CRC Press
Release Date : 2016-04-19
Semiconductor Packaging written by Andrea Chen and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-19 with Technology & Engineering categories.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Vlsi And Chip Design
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Author : Dr. M. Maheswaran
language : en
Publisher: RK Publication
Release Date : 2024-05-23
Vlsi And Chip Design written by Dr. M. Maheswaran and has been published by RK Publication this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-05-23 with Technology & Engineering categories.
VLSI and Chip Design exploration of Very Large-Scale Integration (VLSI) technology and the intricacies of modern chip design. It fundamental principles, advanced methodologies, and the latest innovations in circuit design, fabrication, and testing. With a focus on digital and analog systems, this integrates theoretical concepts with practical applications, catering to both beginners and professionals. It emphasizes design optimization, power efficiency, and scalability, making it an essential resource for engineers, researchers, and students aspiring to excel in semiconductor technology and integrated circuit design.
Microelectronics Packaging Handbook
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Author : R.R. Tummala
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Microelectronics Packaging Handbook written by R.R. Tummala and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Computers categories.
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Semiconductor Advanced Packaging
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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2021-05-17
Semiconductor Advanced Packaging written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-05-17 with Technology & Engineering categories.
The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Guidebook For Managing Silicon Chip Reliability
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Author : Michael Pecht
language : en
Publisher: CRC Press
Release Date : 2017-11-22
Guidebook For Managing Silicon Chip Reliability written by Michael Pecht and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-11-22 with Technology & Engineering categories.
Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
Advances In Industry 4 0
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Author : M. Niranjanamurthy
language : en
Publisher: Walter de Gruyter GmbH & Co KG
Release Date : 2022-07-05
Advances In Industry 4 0 written by M. Niranjanamurthy and has been published by Walter de Gruyter GmbH & Co KG this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-07-05 with Technology & Engineering categories.
This book presents the emerging technologies of Industry 4.0. It describes the growing trend towards automation and data exchange in the manufacturing industry, with a focus on the internet of things (IoT), the industrial internet of things (IIoT), cyberphysical systems (CPS), smart factories, cloud computing, cognitive computing, and artificial intelligence.
Ibm Journal Of Research And Development
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Author :
language : en
Publisher:
Release Date : 2005
Ibm Journal Of Research And Development written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Computers categories.
Ieee Chmt International Electronic Manufacturing Technology Symposium
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Author :
language : en
Publisher:
Release Date : 1992
Ieee Chmt International Electronic Manufacturing Technology Symposium written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with Electronic apparatus and appliances categories.