Reliability Of Microtechnology


Reliability Of Microtechnology
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Reliability Of Microtechnology


Reliability Of Microtechnology
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Author : Johan Liu
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-02-07

Reliability Of Microtechnology written by Johan Liu and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-02-07 with Technology & Engineering categories.


Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also includes exercises and detailed solutions at the end of each chapter.



Reliability Of Microtechnology


Reliability Of Microtechnology
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Author : Johan Liu
language : en
Publisher:
Release Date : 2011-03-30

Reliability Of Microtechnology written by Johan Liu and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-03-30 with categories.




Microsystems Technology


Microsystems Technology
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Author : Jumana Boussey
language : en
Publisher: Elsevier Science & Technology
Release Date : 2003

Microsystems Technology written by Jumana Boussey and has been published by Elsevier Science & Technology this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Microelectromechanical systems categories.


Table of contents



Analog Ic Reliability In Nanometer Cmos


Analog Ic Reliability In Nanometer Cmos
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Author : Elie Maricau
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-01-11

Analog Ic Reliability In Nanometer Cmos written by Elie Maricau and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-01-11 with Technology & Engineering categories.


This book focuses on modeling, simulation and analysis of analog circuit aging. First, all important nanometer CMOS physical effects resulting in circuit unreliability are reviewed. Then, transistor aging compact models for circuit simulation are discussed and several methods for efficient circuit reliability simulation are explained and compared. Ultimately, the impact of transistor aging on analog circuits is studied. Aging-resilient and aging-immune circuits are identified and the impact of technology scaling is discussed. The models and simulation techniques described in the book are intended as an aid for device engineers, circuit designers and the EDA community to understand and to mitigate the impact of aging effects on nanometer CMOS ICs.



Emerging Nanotechnologies


Emerging Nanotechnologies
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Author :
language : en
Publisher:
Release Date : 2008

Emerging Nanotechnologies written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Microtechnology categories.




Emerging Nanotechnologies


Emerging Nanotechnologies
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Author : Mohammad Tehranipoor
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-12-08

Emerging Nanotechnologies written by Mohammad Tehranipoor and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-12-08 with Technology & Engineering categories.


Emerging Nanotechnologies: Test, Defect Tolerance and Reliability covers various technologies that have been developing over the last decades such as chemically assembled electronic nanotechnology, Quantum-dot Cellular Automata (QCA), and nanowires and carbon nanotubes. Each of these technologies offers various advantages and disadvantages. Some suffer from high power, some work in very low temperatures and some others need indeterministic bottom-up assembly. These emerging technologies are not considered as a direct replacement for CMOS technology and may require a completely new architecture to achieve their functionality. Emerging Nanotechnologies: Test, Defect Tolerance and Reliability brings all of these issues together in one place for readers and researchers who are interested in this rapidly changing field.



Interfacial Compatibility In Microelectronics


Interfacial Compatibility In Microelectronics
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Author : Tomi Laurila
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-01-10

Interfacial Compatibility In Microelectronics written by Tomi Laurila and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-01-10 with Technology & Engineering categories.


Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.



Safety And Reliability Methodology And Applications


Safety And Reliability Methodology And Applications
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Author : Tomasz Nowakowski
language : en
Publisher: CRC Press
Release Date : 2014-09-01

Safety And Reliability Methodology And Applications written by Tomasz Nowakowski and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-09-01 with Technology & Engineering categories.


Within the last fifty years the performance requirements for technical objects and systems were supplemented with: customer expectations (quality), abilities to prevent the loss of the object properties in operation time (reliability and maintainability), protection against the effects of undesirable events (safety and security) and the ability to



3d Microelectronic Packaging


3d Microelectronic Packaging
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Author : Yan Li
language : en
Publisher: Springer Nature
Release Date : 2020-11-23

3d Microelectronic Packaging written by Yan Li and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-11-23 with Technology & Engineering categories.


This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.



Microsystems Dynamics


Microsystems Dynamics
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Author : Vytautas Ostasevicius
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-11-01

Microsystems Dynamics written by Vytautas Ostasevicius and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-11-01 with Technology & Engineering categories.


In recent years microelectromechanical systems (MEMS) have emerged as a new technology with enormous application potential. MEMS manufacturing techniques are essentially the same as those used in the semiconductor industry, therefore they can be produced in large quantities at low cost. The added benefits of lightweight, miniature size and low energy consumption make MEMS commercialization very attractive. Modeling and simulation is an indispensable tool in the process of studying these new dynamic phenomena, development of new microdevices and improvement of the existing designs. MEMS technology is inherently multidisciplinary since operation of microdevices involves interaction of several energy domains of different physical nature, for example, mechanical, fluidic and electric forces. Dynamic behavior of contact-type electrostatic microactuators, such as a microswitches, is determined by nonlinear fluidic-structural, electrostatic-structural and vibro-impact interactions. The latter is particularly important: Therefore it is crucial to develop accurate computational models for numerical analysis of the aforementioned interactions in order to better understand coupled-field effects, study important system dynamic characteristics and thereby formulate guidelines for the development of more reliable microdevices with enhanced performance, reliability and functionality.