Routing In The Third Dimension

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Routing In The Third Dimension

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Author : Naveed A. Sherwani
language : en
Publisher: John Wiley & Sons
Release Date : 1995-03

Routing In The Third Dimension written by Naveed A. Sherwani and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995-03 with Education categories.

This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. You'll find an insightful approach to the algorithmic, cell design issues in chip and MCM routing with an emphasis on techniques for eliminating routing area.

Three Dimensional Design Methodologies For Tree Based Fpga Architecture

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Author : Vinod Pangracious
language : en
Publisher: Springer
Release Date : 2015-06-25

Three Dimensional Design Methodologies For Tree Based Fpga Architecture written by Vinod Pangracious and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-06-25 with Technology & Engineering categories.

This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.

Three Dimensional Integrated Circuit Design

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Author : Vasilis F. Pavlidis
language : en
Publisher: Newnes
Release Date : 2017-07-04

Three Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and has been published by Newnes this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-07-04 with Technology & Engineering categories.

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization

Three Dimensional Integrated Circuit Design

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Author : Yuan Xie
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-12-02

Three Dimensional Integrated Circuit Design written by Yuan Xie and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-12-02 with Technology & Engineering categories.

We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

3d Integration For Vlsi Systems

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Author : Chuan Seng Tan
language : en
Publisher: CRC Press
Release Date : 2016-04-19

3d Integration For Vlsi Systems written by Chuan Seng Tan and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-19 with Science categories.

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th

Designing 2d And 3d Network On Chip Architectures

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Author : Konstantinos Tatas
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-10-08

Designing 2d And 3d Network On Chip Architectures written by Konstantinos Tatas and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-08 with Technology & Engineering categories.

This book covers key concepts in the design of 2D and 3D Network-on-Chip interconnect. It highlights design challenges and discusses fundamentals of NoC technology, including architectures, algorithms and tools. Coverage focuses on topology exploration for both 2D and 3D NoCs, routing algorithms, NoC router design, NoC-based system integration, verification and testing, and NoC reliability. Case studies are used to illuminate new design methodologies.

Physical Design For 3d Integrated Circuits

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Author : Aida Todri-Sanial
language : en
Publisher: CRC Press
Release Date : 2017-12-19

Physical Design For 3d Integrated Circuits written by Aida Todri-Sanial and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

Routes To Language

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Author :
language : en
Publisher: Psychology Press
Release Date :

Routes To Language written by and has been published by Psychology Press this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.

Wireless Algorithms Systems And Applications

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Author : Yingshu Li
language : en
Publisher: Springer
Release Date : 2008-10-15

Wireless Algorithms Systems And Applications written by Yingshu Li and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-10-15 with Computers categories.

This book constitutes the refereed proceedings of the Third Annual International Conference on Wireless Algorithms, Systems, and Applications, WASA 2008, held in Dallas, TX, USA, in October 2008. The 35 revised full papers presented together with 3 keynote talks and 15 invited lectures were carefully reviewed and selected from numerous submissions. Providing a forum for researchers and practitioners, from the academic, industrial and governmental sectors, the papers address current research and development efforts of various issues in the area of algorithms, systems and applications for current and next generation infrastructure and infrastructureless wireless networks.

Handbook Of 3d Integration Volume 1

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Author : Philip Garrou
language : en
Publisher: John Wiley & Sons
Release Date : 2011-09-22

Handbook Of 3d Integration Volume 1 written by Philip Garrou and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-09-22 with Technology & Engineering categories.

The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.