Semiconductor Wafer Bonding Vii Science Technology And Applications
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Semiconductor Wafer Bonding Vii Science Technology And Applications
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Author :
language : en
Publisher: The Electrochemical Society
Release Date : 2003
Semiconductor Wafer Bonding Vii Science Technology And Applications written by and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Technology & Engineering categories.
Semiconductor Wafer Bonding Science Technology And Applications V
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Author : Charles E. Hunt
language : en
Publisher: The Electrochemical Society
Release Date : 2001
Semiconductor Wafer Bonding Science Technology And Applications V written by Charles E. Hunt and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Technology & Engineering categories.
Semiconductor Wafer Bonding Viii Science Technology And Applications
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Author :
language : en
Publisher: The Electrochemical Society
Release Date : 2005
Semiconductor Wafer Bonding Viii Science Technology And Applications written by and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Microelectromechanical systems categories.
Wafer Bonding
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Author : Marin Alexe
language : en
Publisher: Springer Science & Business Media
Release Date : 2004-05-14
Wafer Bonding written by Marin Alexe and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-05-14 with Science categories.
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Handbook Of Silicon Based Mems Materials And Technologies
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Author : Markku Tilli
language : en
Publisher: William Andrew
Release Date : 2015-09-02
Handbook Of Silicon Based Mems Materials And Technologies written by Markku Tilli and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-09-02 with Technology & Engineering categories.
The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures - Geared towards practical applications rather than theory
Semiconductor Wafer Bonding Vii Science Technology And Applications
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Author :
language : en
Publisher:
Release Date : 2003
Semiconductor Wafer Bonding Vii Science Technology And Applications written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Electronic apparatus and appliances categories.
Wafer Bonding
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Author : Marin Alexe
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-09
Wafer Bonding written by Marin Alexe and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-09 with Science categories.
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Handbook Of Wafer Bonding
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Author : Peter Ramm
language : en
Publisher: John Wiley & Sons
Release Date : 2012-02-13
Handbook Of Wafer Bonding written by Peter Ramm and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-13 with Technology & Engineering categories.
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Handbook Of Semiconductor Manufacturing Technology
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Author : Yoshio Nishi
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Handbook Of Semiconductor Manufacturing Technology written by Yoshio Nishi and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
High Purity Silicon Vii
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Author : Cor L. Claeys
language : en
Publisher: The Electrochemical Society
Release Date : 2002
High Purity Silicon Vii written by Cor L. Claeys and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Science categories.