Signal Integrity Analysis On Materials And Via Structures Modeling And Characterization
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Signal Integrity Analysis On Materials And Via Structures Modeling And Characterization
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Author : Qian Li
language : en
Publisher:
Release Date : 2011
Signal Integrity Analysis On Materials And Via Structures Modeling And Characterization written by Qian Li and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with categories.
The development of modern digital communication systems has been entered a new era with faster signal transmission and processing capability, called high-speed circuit systems. As their clock frequencies have increased and rise times of signals have decreased, the signal integrity of interconnects in the packaging and printed circuit boards plays a more and more important role. In high-speed circuit systems, the well-designed logic functions most likely will not work well if their interconnects are not taken into account. This dissertation addresses to profoundly understand the signal integrity knowledge, be proficient in calculation, simulation and measurements, and be capable of solving related signal integrity problems. The research mainly emphasizes on three aspects. First of all, the impact of on-wafer calibration methods on the measured results of coplanar waveguide circuits is comprehensively investigated, with their measurement repeatability and accuracy. Furthermore, a method is presented to characterize the physically-consistent broadband material properties for both rigid and flexible dielectric materials. Last but not least, a hybrid method for efficient modeling of three dimensional via structures is developed, in order to simplify the traditional 3D full-length via simulations and dramatically reduce the via build and simulation time and complexity.
Power Integrity Modeling And Design For Semiconductors And Systems
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Author : Madhavan Swaminathan
language : en
Publisher: Pearson Education
Release Date : 2007-11-19
Power Integrity Modeling And Design For Semiconductors And Systems written by Madhavan Swaminathan and has been published by Pearson Education this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-11-19 with Technology & Engineering categories.
The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
Power Integrity Modeling And Design For Semiconductors And Systems
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Author : Madhavan Swaminathan
language : en
Publisher:
Release Date : 2007
Power Integrity Modeling And Design For Semiconductors And Systems written by Madhavan Swaminathan and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Integrated circuits categories.
The First Comprehensive, Example-Rich Guide to Power Integrity Modeling Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art. Using realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise. The authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications. The authors Introduce power delivery network components, analysis, high-frequency measurement, and modeling requirements Thoroughly explain modeling of power/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more Offer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis Introduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages Present the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures This book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.
Development Of Modeling Simulation And Measurement Methodologies For Signal Integrity Analysis Of High Speed Packaging Interconnects
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Author :
language : en
Publisher:
Release Date : 2006
Development Of Modeling Simulation And Measurement Methodologies For Signal Integrity Analysis Of High Speed Packaging Interconnects written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with categories.
As chip complexity and speed continue to increase, the packaging interconnects increasingly affect the performance of the electrical systems. Signal integrity analysis becomes exceedingly complex and important. The primary goal of this research is in-depth understanding of the signal integrity issue in high-speed chips and electronic systems, and development of modeling, simulation, and measurement methodologies for accurate and efficient characterization or prediction of the electrical characteristics of these on-chip and on-substrate packaging interconnects. The research is focused on three parts. First, a new broadband measurement method is proposed to determine the complex material properties of the dielectric materials in"as-packaged"environments, and to extract the frequency dependant RLGC parameters of the packaging interconnects. Second, a broadband CPW to microstrip via-less transition is developed to facilitate on-wafer measurement of microstrip based packaging structures. Third, microstrip lines over gridded ground plane are studied. Methodologies are proposed to efficiently simulate these structures in the frequency domain and time domain. SPICE compatible lumped-element models are developed. The methodologies and the lumped element models are verified by frequency domain and time domain measurement.
Signal Integrity Characterization Techniques
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Author : Mike Resso
language : en
Publisher: Intl. Engineering Consortiu
Release Date : 2009
Signal Integrity Characterization Techniques written by Mike Resso and has been published by Intl. Engineering Consortiu this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009 with Science categories.
Cogently addressing the future of signal integrity and the effect it will have on the data transmission industry as a whole, this all-inclusive guide addresses a wide array of technologies, from traditional digital data transmission to microwave measurements, and accessibly examines the gap between the two. Focusing on real world applications and providing a wide array of case studies that show how each technology can be used—from backplane design challenges to advanced error correction techniques—this guide addresses many of today’s high-speed technologies while also providing excellent insight into their future direction. With numerous valuable lessons pertaining to the signal integrity industry, this resource is the ultimate must-read guide for any specialist in the design engineering field.
Signal Integrity And Keep Out Zone Modeling Of Through Silicon Via Structures In 3d Ics
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Author : 白君彥
language : en
Publisher:
Release Date : 2014
Signal Integrity And Keep Out Zone Modeling Of Through Silicon Via Structures In 3d Ics written by 白君彥 and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014 with categories.
The Proceedings Of The 16th Annual Conference Of China Electrotechnical Society
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Author : Qingxin Yang
language : en
Publisher: Springer Nature
Release Date : 2022-04-17
The Proceedings Of The 16th Annual Conference Of China Electrotechnical Society written by Qingxin Yang and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-04-17 with Technology & Engineering categories.
This book gathers outstanding papers presented at the 16th Annual Conference of China Electrotechnical Society, organized by China Electrotechnical Society (CES), held in Beijing, China, from September 24 to 26, 2021. It covers topics such as electrical technology, power systems, electromagnetic emission technology, and electrical equipment. It introduces the innovative solutions that combine ideas from multiple disciplines. The book is very much helpful and useful for the researchers, engineers, practitioners, research students, and interested readers.
Three Dimensional System Integration
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Author : Antonis Papanikolaou
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-12-07
Three Dimensional System Integration written by Antonis Papanikolaou and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-12-07 with Architecture categories.
Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.
Through Silicon Vias
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Author : Brajesh Kumar Kaushik
language : en
Publisher: CRC Press
Release Date : 2016-11-30
Through Silicon Vias written by Brajesh Kumar Kaushik and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-30 with Science categories.
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.
Handbook Of 3d Integration Volume 1
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Author : Philip Garrou
language : en
Publisher: John Wiley & Sons
Release Date : 2011-09-22
Handbook Of 3d Integration Volume 1 written by Philip Garrou and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-09-22 with Technology & Engineering categories.
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.