Through Silicon Vias
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Through Silicon Vias For 3d Integration
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Author : John H. Lau
language : en
Publisher: McGraw Hill Professional
Release Date : 2012-08-05
Through Silicon Vias For 3d Integration written by John H. Lau and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-08-05 with Technology & Engineering categories.
A comprehensive guide to TSV and other enabling technologies for 3D integration Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes: Nanotechnology and 3D integration for the semiconductor industry TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing TSVs: mechanical, thermal, and electrical behaviors Thin-wafer strength measurement Wafer thinning and thin-wafer handling Microbumping, assembly, and reliability Microbump electromigration Transient liquid-phase bonding: C2C, C2W, and W2W 2.5D IC integration with interposers 3D IC integration with interposers Thermal management of 3D IC integration 3D IC packaging
Through Silicon Vias
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Author : Brajesh Kumar Kaushik
language : en
Publisher: CRC Press
Release Date : 2016-11-30
Through Silicon Vias written by Brajesh Kumar Kaushik and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-30 with Science categories.
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.
Arbitrary Modeling Of Tsvs For 3d Integrated Circuits
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Author : Khaled Salah
language : en
Publisher: Springer
Release Date : 2014-08-21
Arbitrary Modeling Of Tsvs For 3d Integrated Circuits written by Khaled Salah and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-08-21 with Technology & Engineering categories.
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.
Through Silicon Vias In Sige Bicmos And Interposer Technologies For Sub Thz Applications
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Author : Matthias Wietstruck
language : en
Publisher:
Release Date : 2023-11-30
Through Silicon Vias In Sige Bicmos And Interposer Technologies For Sub Thz Applications written by Matthias Wietstruck and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-11-30 with categories.
Designing Tsvs For 3d Integrated Circuits
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Author : Nauman Khan
language : en
Publisher: Springer
Release Date : 2012-09-23
Designing Tsvs For 3d Integrated Circuits written by Nauman Khan and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-09-23 with Technology & Engineering categories.
This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.
Electromagnetic Modeling And Optimization Of Through Silicon Vias
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Author : David Dahl
language : en
Publisher:
Release Date : 2018
Electromagnetic Modeling And Optimization Of Through Silicon Vias written by David Dahl and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018 with categories.
Design For Test And Test Optimization Techniques For Tsv Based 3d Stacked Ics
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Author : Brandon Noia
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-19
Design For Test And Test Optimization Techniques For Tsv Based 3d Stacked Ics written by Brandon Noia and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-19 with Technology & Engineering categories.
This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
Stress Management For 3d Ics Using Through Silicon Vias
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Author : Ehrenfried Zschech
language : en
Publisher: American Institute of Physics
Release Date : 2011-11-23
Stress Management For 3d Ics Using Through Silicon Vias written by Ehrenfried Zschech and has been published by American Institute of Physics this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-11-23 with Science categories.
Scientist and engineers as well as graduate students in the fields of This conference will be of interest to anyone involved in Physics, Electrical Engineering, Materials Science and Engineering, Reliability and Quality Management, both in industry and academia. One current challenge to micro- and nanoelectronics is the understanding of stress-related phenomena in 3D IC integration. Stresses arising in 3D TSV interconnects and in the surrounding materials due to thermal mismatch, microstructure changes or process integration can lead to performance reduction, reliability-limiting degradation and failure of microelectronic products. Understanding stress-related phenomena in new materials used for 3D integration and packaging, particularly using through silicon vias and microbumps, is critical for future microelectronic products. Management of mechanical stress is one of the key enablers for the successful implementation of 3D-integrated circuits using through silicon vias (TSVs). The potential stress-related impact of the 3D integration process on the device characteristics must be understood and shared, and designers need a solution for managing stress. The Proceedings summarize new research results and advances in basic understanding of stress-induced phenomena in 3D IC integration. Modelling and simulation capabilities as well as materials characterization are demonstrated to evaluate the effect of stress on product performance.
Stress Management For 3d Ics Using Through Silicon Vias
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Author : Ehrenfried Zschech
language : en
Publisher:
Release Date : 2011
Stress Management For 3d Ics Using Through Silicon Vias written by Ehrenfried Zschech and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with categories.
Three Dimensional Integrated Circuit Design
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Author : Vasilis F. Pavlidis
language : en
Publisher: Newnes
Release Date : 2017-07-04
Three Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and has been published by Newnes this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-07-04 with Technology & Engineering categories.
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization