Silicon Processing
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Silicon Processing For The Vlsi Era Process Technology
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Author : Stanley Wolf
language : en
Publisher:
Release Date : 2000
Silicon Processing For The Vlsi Era Process Technology written by Stanley Wolf and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Technology & Engineering categories.
Silicon Processing
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Author : SYMPOSIUM ON SILICON PROCESSING. (1982 : SAN JOSE) AUTOR
language : en
Publisher: ASTM International
Release Date : 1983
Silicon Processing written by SYMPOSIUM ON SILICON PROCESSING. (1982 : SAN JOSE) AUTOR and has been published by ASTM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 1983 with categories.
Chemical Mechanical Polishing In Silicon Processing
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Author :
language : en
Publisher: Academic Press
Release Date : 1999-10-29
Chemical Mechanical Polishing In Silicon Processing written by and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999-10-29 with Technology & Engineering categories.
Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded. Reflecting the truly interdisciplinary nature of the field that the series covers, the volumes in Semiconductors and Semimetals have been and will continue to be of great interest to physicists, chemists, materials scientists, and device engineers in modern industry.
Characterization In Silicon Processing
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Author : Yale Strausser
language : en
Publisher: Elsevier
Release Date : 2013-10-22
Characterization In Silicon Processing written by Yale Strausser and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-22 with Technology & Engineering categories.
This volume is devoted to the consideration of the use use of surface, thin film and interface characterization tools in support of silicon-based semiconductor processing. The approach taken is to consider each of the types of films used in silicon devices individually in its own chapter and to discuss typical problems seen throughout that films' history, including characterization tools which are most effectively used to clarifying and solving those problems.
Advances In Silicon Carbide Processing And Applications
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Author : Stephen E. Saddow
language : en
Publisher: Artech House
Release Date : 2004
Advances In Silicon Carbide Processing And Applications written by Stephen E. Saddow and has been published by Artech House this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Science categories.
Learn the latest advances in SiC (Silicon Carbide) technology from the leading experts in the field with this new cutting-edge resource. The book is your single source for in-depth information on both SiC device fabrication and system-level applications. This comprehensive reference begins with an examination of how SiC is grown and how defects in SiC growth can affect working devices. Key issues in selective doping of SiC via ion implantation are covered with special focus on implant conditions and electrical activation of implants. SiC applications discussed include chemical sensors, motor-control components, high-temperature gas sensors, and high-temperature electronics. By cutting through the arcane data and jargon surrounding the hype on SiC, this book gives an honest assessment of today's SiC technology and shows you how SiC can be adopted in developing tomorrow's applications.
Black Silicon
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Author : Nuggehalli M. Ravindra
language : en
Publisher:
Release Date : 2016-05-31
Black Silicon written by Nuggehalli M. Ravindra and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-05-31 with Silicon categories.
The ability to tailor the properties of silicon, by controlling its surface morphology in the form of black silicon, is anticipated to revolutionize silicon photonics. Black Silicon (BSi), one of the approaches to counter the inherent disadvantages of Si, is a surface modification of crystalline Si (c-Si). This book presents a discussion on manufacturing BSi by various methods for morphing the surface of the material, which are economical and easily applicable for mass production. Comparisons of the surfaces of BSi fabricated by various techniques are presented and thermal, electrical, electronic, and optical properties of black silicon are described. Some major applications of BSi have been given and possible future directions in the research and development of BSi and its applications are identified.
Techniques And Challenges For 300 Mm Silicon
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Author : H. Richter
language : en
Publisher: Elsevier Science Limited
Release Date : 1999
Techniques And Challenges For 300 Mm Silicon written by H. Richter and has been published by Elsevier Science Limited this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Technology & Engineering categories.
The activities of the semiconductor industry to introduce a new, large wafer diameter were triggered by expected potential overall savings - cost and resource - and an anticipated increasing demand for Silicon wafers. In the beginning, around 1994, agreement on the diameter of the next wafer generation had to be achieved and finally 300 mm was globally accepted to be the next wafer diameter, a decision obtained at international summits in 1994/1995, based on the work of a SEMI task force. Several workshops on 300 mm wafers have been held by SEMI, JSNM and other organizations during the past few years. However, the present E-MRS conference on Techniques and Challenges for 300 mm Silicon: Processing, Characterization, Modeling and Equipment was the first international scientific conference about this subject. The papers - invited as well as submitted - cover a wide range of subjects, financial issues, fab concepts, crystal growth, wafer process development, material and defect issues, wafer characterization and provide an excellent review of the present status of 300 mm technology.
Silicon Processing For Photovoltaics Ii
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Author : C.P. Khattak
language : en
Publisher: Elsevier
Release Date : 2012-12-02
Silicon Processing For Photovoltaics Ii written by C.P. Khattak and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-02 with Technology & Engineering categories.
The processing of semiconductor silicon for manufacturing low cost photovoltaic products has been a field of increasing activity over the past decade and a number of papers have been published in the technical literature. This volume presents comprehensive, in-depth reviews on some of the key technologies developed for processing silicon for photovoltaic applications. It is complementary to Volume 5 in this series and together they provide the only collection of reviews in silicon photovoltaics available.The volume contains papers on: the effect of introducing grain boundaries in silicon; the commercial production for multicrystalline silicon ingots and ribbon; epitaxial solar cell fabrication; metallurgical approaches to producing low-cost meltstock; the non-conventional bifacial solar cell approach.
Silicon Device Processing
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Author : Charles P. Marsden
language : en
Publisher:
Release Date : 1970
Silicon Device Processing written by Charles P. Marsden and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1970 with Electronics categories.
The objective of the Symposium was to provide an opportunity for engineers and applied scientists actively engaged in the silicon device technology field to discuss the most advanced measurement methods for process control and materials characterization.The basic theme of the meeting was to stress the interdependence of measurements techniques, facilities, and materials as they relate to the overall problems of improving and advancing silicon device sciences and technologies.(Author).
Ultraclean Surface Processing Of Silicon Wafers
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Author : Takeshi Hattori
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-09
Ultraclean Surface Processing Of Silicon Wafers written by Takeshi Hattori and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-09 with Technology & Engineering categories.
A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.