Soldering In Electronics Assembly
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Soldering In Electronics Assembly
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Author : Mike Judd
language : en
Publisher: Elsevier
Release Date : 2013-09-24
Soldering In Electronics Assembly written by Mike Judd and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-09-24 with Technology & Engineering categories.
Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assemblies.
Newnes Electronics Assembly Handbook
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Author : Keith Brindley
language : en
Publisher: Elsevier
Release Date : 2016-06-30
Newnes Electronics Assembly Handbook written by Keith Brindley and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-06-30 with Technology & Engineering categories.
Newnes Electronics Assembly Handbook
Soldering In Electronics Assembly
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Author : MIKE JUDD
language : en
Publisher: Newnes
Release Date : 1999-04-14
Soldering In Electronics Assembly written by MIKE JUDD and has been published by Newnes this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999-04-14 with Technology & Engineering categories.
Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. A practical guide for the industry covering all the main soldering processes currently in use Cleaning, faults, troubleshooting and standards are all major topics Considers safety and solder process quality assessment
The Electronics Assembly Handbook
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Author : Frank Riley
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-06-29
The Electronics Assembly Handbook written by Frank Riley and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-06-29 with Technology & Engineering categories.
The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.
Modern Solder Technology For Competitive Electronics Manufacturing
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Author : Jennie S. Hwang
language : en
Publisher: McGraw Hill Professional
Release Date : 1996
Modern Solder Technology For Competitive Electronics Manufacturing written by Jennie S. Hwang and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Technology & Engineering categories.
Introduction Advanced Surface Mount Technology and Die Attach Techniques Solder Material Soldering Chemistry Solderability Microstructure of Solders Aqueous-Cleaning Manufacture No-Clean Manufacture Protective and Reactive Atmosphere Soldering Surface Mount Fine Pitch Technology Surface Mount-BGA/PAC Technology Soldering Methodology and Equipment Soldering and Soldering Related Issues Strengthened Solders Lead-Free Solders Solder Joint Failure Mode Solder Joint Failure Assessment-Case Studies Solder Joint Quality and Reliability New and Emerging Specifications and Standards Future Trends.
Handbook Of Electronic Assembly And A Guide To Smta Certification
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Author : Ronald Lasky
language : en
Publisher:
Release Date : 2014-01-01
Handbook Of Electronic Assembly And A Guide To Smta Certification written by Ronald Lasky and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-01-01 with categories.
Originally conceived as a supplement to the SMTA Certification Program, this book is a must-have reference manual for all process engineers working in the electronics industry as well as anyone just entering the industry. The book provides an in-depth understanding of the entire electronic assembly process. Chapter topics include soldering and materials, printed wiring boards, components, paste-print stencil, component placement, assembly line design and optimization, solder reflow, wave soldering, dispensing, and inspection and test.
Soldering
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Author : Mel Schwartz
language : en
Publisher: ASM International
Release Date : 2014-03-01
Soldering written by Mel Schwartz and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-03-01 with Technology & Engineering categories.
Covers various soldering methods and techniques as well as the latest on solder alloys, solder films, surface preparation, fluxes and cleaning methods, heating methods, inspection techniques, and quality control and reliability. Geared to scientists, material engineers, designers, manufacturing engineers, and technologists who need immediate practical guidance rather than theoretical instruction.
Connections In Electronic Assemblies
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Author : Anthony J. Bilotta
language : en
Publisher: CRC Press
Release Date : 1985-12-03
Connections In Electronic Assemblies written by Anthony J. Bilotta and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1985-12-03 with Technology & Engineering categories.
Assembly And Reliability Of Lead Free Solder Joints
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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2020-05-29
Assembly And Reliability Of Lead Free Solder Joints written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-05-29 with Technology & Engineering categories.
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Solder Paste In Electronics Packaging
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Author : Jennie Hwang
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Solder Paste In Electronics Packaging written by Jennie Hwang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.