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Soldering Processes And Equipment


Soldering Processes And Equipment
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Soldering Processes And Equipment


Soldering Processes And Equipment
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Author : Michael Pecht
language : en
Publisher: John Wiley & Sons
Release Date : 1993-08-30

Soldering Processes And Equipment written by Michael Pecht and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993-08-30 with Technology & Engineering categories.


Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.



Principles Of Reliable Soldering Techniques


Principles Of Reliable Soldering Techniques
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Author : R. Sengupta
language : en
Publisher: New Age International
Release Date : 1997

Principles Of Reliable Soldering Techniques written by R. Sengupta and has been published by New Age International this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with categories.


Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical Requirements Essential To Ensure Its Reliability. The Four M'S; Material, Machine, Method And Man, Necessary For Designing A Solder Joint Have Been Described In Detail. Further, Process Control, Solder Joint Inspection Criteria, Solder Joint Defect Analysis And Its Repair/Rework Are Also Discussed.Additionally, Brief Introductions To Surface Mount Devices (Smd) And Surface Mount Technology (Smt) Have Been Included A Annexures. The Book Will Be Useful In Industry, And To Design Production, Process Planning And Quality Control Engineers, As Well As In Engineering/Technical Colleges To Students As A Reference Book For The Present And, Hopefully, Future Modified Courses. The Academicians May Find This Book Useful For Redesigning The Present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. And M.E. / M.Tech (Electrical, Electronic, Instrumentation) Syllabus.



Soldering Handbook For Printed Circuits And Surface Mounting


Soldering Handbook For Printed Circuits And Surface Mounting
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Author : Howard H. Manko
language : en
Publisher: Springer Science & Business Media
Release Date : 1995-10-31

Soldering Handbook For Printed Circuits And Surface Mounting written by Howard H. Manko and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995-10-31 with Computers categories.


Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.



Solders And Soldering


Solders And Soldering
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Author : Howard H. Manko
language : en
Publisher: McGraw Hill Professional
Release Date : 2001-03-01

Solders And Soldering written by Howard H. Manko and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-03-01 with Technology & Engineering categories.


Get the latest developments in solder technology You can't work in electronics without solder -- and you shouldn’t work with solder without Solders and Soldering, Fourth Edition. Profusely illustrated, this book by the world's top solder educator has been the leader in its field for two decades. You’ll learn 29 different methods for soldering and heating (for both automatic and manual procedures), and learn about the strengths and weaknesses of each method for varying applications. This up-to-date edition deals at length with modern cleaning materials and processes, emphasizing EPA and OSHA guidelines and regulations, and provides you with state-of-the-art techniques for soldering with miniaturized circuit boards.



Solder Materials


Solder Materials
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Author : Lin Kwang-lung
language : en
Publisher: World Scientific
Release Date : 2001-06-21

Solder Materials written by Lin Kwang-lung and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-06-21 with Technology & Engineering categories.


This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.



The Handbook Of Machine Soldering


The Handbook Of Machine Soldering
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Author : Ralph W. Woodgate
language : en
Publisher: John Wiley & Sons
Release Date : 1996-09-27

The Handbook Of Machine Soldering written by Ralph W. Woodgate and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-09-27 with Technology & Engineering categories.


Sound electrical connections are the operational backbone of every piece of electronic equipment--and the key to success in electronics manufacturing. The Handbook of Machine Soldering is dedicated to excellence in the machine soldering of electrical connections. Self-contained, comprehensive, and down-to-earth, it cuts through jargon, peels away outdated notions, and presents all the information needed to select, install, and operate machine soldering equipment.



Soldering


Soldering
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Author : Mel Schwartz
language : en
Publisher: ASM International
Release Date : 2014-03-01

Soldering written by Mel Schwartz and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-03-01 with Technology & Engineering categories.


Covers various soldering methods and techniques as well as the latest on solder alloys, solder films, surface preparation, fluxes and cleaning methods, heating methods, inspection techniques, and quality control and reliability. Geared to scientists, material engineers, designers, manufacturing engineers, and technologists who need immediate practical guidance rather than theoretical instruction.



Surface Mount Technology


Surface Mount Technology
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Author : Carmen Capillo
language : en
Publisher: McGraw-Hill Companies
Release Date : 1989

Surface Mount Technology written by Carmen Capillo and has been published by McGraw-Hill Companies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with Computers categories.




Principles Of Soldering


Principles Of Soldering
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Author : Giles Humpston
language : en
Publisher: ASM International
Release Date : 2004

Principles Of Soldering written by Giles Humpston and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Technology & Engineering categories.




Reflow Soldering Processes


Reflow Soldering Processes
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Author : Ning-Cheng Lee
language : en
Publisher: Newnes
Release Date : 2002-01-11

Reflow Soldering Processes written by Ning-Cheng Lee and has been published by Newnes this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-01-11 with Technology & Engineering categories.


Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process