Structural Integrity And Reliability In Electronics

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Structural Integrity And Reliability In Electronics

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Author : W.J. Plumbridge
language : en
Publisher: Springer Science & Business Media
Release Date : 2003-12-31

Structural Integrity And Reliability In Electronics written by W.J. Plumbridge and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-12-31 with Mathematics categories.

The World's largest industrial sector, Electronics, is facing twin challenges arising from the transition to environmentally-benign solder alloys and the necessity to maintain structural integrity and reliability in the face of continuing miniaturisation. This book is probably the first to address the situation from a multidisciplinary teaching perspective. The authors' expertise in Materials, Electronics Manufacture and Design are integrated throughout to establish a common platform and language for practitioners from the many fields involved. Communication is facilitated by a dual-level of presentation of the subject principles and the latest developments in industry and in research. Electronic routes for monitoring current and future progress are also provided. The book will appeal both to specialists wanting to update or increase their appreciation of related topics, and the generalist seeking relevant applications. It represents a major contribution to the field.

Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging

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Author : Ephraim Suhir
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-05-26

Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging written by Ephraim Suhir and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-05-26 with Technology & Engineering categories.

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Structural Dynamics Of Electronic And Photonic Systems

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Author : Ephraim Suhir
language : en
Publisher: John Wiley & Sons
Release Date : 2011-04-04

Structural Dynamics Of Electronic And Photonic Systems written by Ephraim Suhir and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-04-04 with Technology & Engineering categories.

The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.

Computational Methods In Engineering Science

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Author : Zhenhan Yao
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-12-31

Computational Methods In Engineering Science written by Zhenhan Yao and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-12-31 with Technology & Engineering categories.

The 9th EPMESC was successfully held in Macao in November of 2003. At the end of the conference the Board of the EPMESC series decided that the next conference would be held in a city of the mainland of China. Also I was assigned to be the Chair person of the Conference. No doubt this is a great honor to me and also a challenge because there are so many professional international conferences in computational mechanics happening frequently in the world. After the successful organizing of WCCM6 in Beijing, September of 2004,1 engaged to organize the 10th EPMESC. First of all, I had to choose the venue of the Conference. After some investigation and a lot of negotiation we went to see the site of the venue in Sanya, Hainan Island, the south-most city in China. Finally we made the decision. The most important reason for the choice was the ecological environment of this city. It is beneficial to our health after hard work. We scientists and engineers need a good relaxing place after working hard- a place to enjoy life with friends and family. Sanya is an ideal place and a real green city. Blue sky and white clouds, the peaceful sea and the long beach with white sand, shells and pearls, no pollution and no industry. Everything is so beautiful.

Advances In Fracture Research

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Author : K. Salama
language : en
Publisher: Elsevier
Release Date : 2013-10-22

Advances In Fracture Research written by K. Salama and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-22 with Technology & Engineering categories.

Held every four years, the International Congress on Fracture is the premier international forum for the exchange of ideas between scientists and engineers involved in producing and using materials resistant to fracture and fatigue. This major six-volume work which forms the proceedings of the Seventh International Congress on Fracture therefore provides the most comprehensive account available of the current status of research into fracture and fatigue, and the application of this knowledge to the design, fabrication and operation of materials and structures. As such, it will be an essential reference for materials scientists and mechanical, structural, aeronautical and design engineers with an interest in fracture and its prevention.

Lead Free Electronic Solders

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Author : KV Subramanian
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-06-28

Lead Free Electronic Solders written by KV Subramanian and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-06-28 with Technology & Engineering categories.

Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.

Hybrid Bonding Advanced Substrates Failure Mechanisms And Thermal Management For Chiplets And Heterogeneous Integration

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Author : John Lau
language : en
Publisher: Springer Nature
Release Date : 2025-05-18

Hybrid Bonding Advanced Substrates Failure Mechanisms And Thermal Management For Chiplets And Heterogeneous Integration written by John Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-05-18 with Technology & Engineering categories.

The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as hybrid bonding, advanced substrates, failure mechanisms, and modeling due to thermal stresses, moisture absorption, impact loading such as drop as well as electric current driven electromigration, and the fundamentals of thermal management. Each topic is treated with in-depth analysis to bridge foundational principles with real-world engineering challenges. This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.

Handbook Of Materials Failure Analysis

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Author : Abdel Salam Hamdy Makhlouf
language : en
Publisher: Butterworth-Heinemann
Release Date : 2019-10-25

Handbook Of Materials Failure Analysis written by Abdel Salam Hamdy Makhlouf and has been published by Butterworth-Heinemann this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-10-25 with Technology & Engineering categories.

Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance. It then proceeds to discussions on the types of failure analysis, specific tools and techniques, and an analysis of materials failure from various causes. As failure can occur for several reasons, including materials defects-related failure, materials design-related failure, or corrosion-related failures, the topics covered in this comprehensive source are an important tool for practitioners.

Advances In Electronics Computer Physical And Chemical Sciences

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Author : Saiyed Salim Sayeed
language : en
Publisher: CRC Press
Release Date : 2025-04-29

Advances In Electronics Computer Physical And Chemical Sciences written by Saiyed Salim Sayeed and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-04-29 with Technology & Engineering categories.

The conference aimed to provide a platform for researchers, scientists, technocrats, academicians and engineers to exchange their innovative ideas and new challenges being faced in the field of emerging technologies. It provided an opportunity to exchange ideas among global leaders and experts from academia and industry in developing domains such as machine learning, intelligence systems, smart infrastructure, advanced power technology, and so forth. It covered all broad disciplines of electronics, computer, physical and chemical science engineering.

Engineering Design Under Uncertainty And Health Prognostics

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Author : Chao Hu
language : en
Publisher: Springer
Release Date : 2018-06-16

Engineering Design Under Uncertainty And Health Prognostics written by Chao Hu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-06-16 with Technology & Engineering categories.

This book presents state-of-the-art probabilistic methods for the reliability analysis and design of engineering products and processes. It seeks to facilitate practical application of probabilistic analysis and design by providing an authoritative, in-depth, and practical description of what probabilistic analysis and design is and how it can be implemented. The text is packed with many practical engineering examples (e.g., electric power transmission systems, aircraft power generating systems, and mechanical transmission systems) and exercise problems. It is an up-to-date, fully illustrated reference suitable for both undergraduate and graduate engineering students, researchers, and professional engineers who are interested in exploring the fundamentals, implementation, and applications of probabilistic analysis and design methods.