The Age Of Interconnection
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The Age Of Interconnection
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Author : Jonathan Sperber
language : en
Publisher: Oxford University Press
Release Date : 2023
The Age Of Interconnection written by Jonathan Sperber and has been published by Oxford University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023 with History categories.
A monumental and accessible global history of the second half of the twentieth century, from the end of World War Two to the terrorist attack on the Twin Towers, offering readers the most complete portrait of the age available.
Making Humanities And Social Sciences Come Alive
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Author : Deborah Green
language : en
Publisher: Cambridge University Press
Release Date : 2019-02-14
Making Humanities And Social Sciences Come Alive written by Deborah Green and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-02-14 with Education categories.
Prepares readers to become high-quality humanities and social sciences educators for early childhood and primary contexts.
Telecommunications In The Age Of Information
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Author : DIANE Publishing Company
language : en
Publisher: DIANE Publishing
Release Date : 1994-12
Telecommunications In The Age Of Information written by DIANE Publishing Company and has been published by DIANE Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994-12 with Technology & Engineering categories.
The landmark report issued in late 1991 which examines the significance of telecommunications and evaluates how telecommunications services improve both the international competitiveness of U.S. businesses and the quality of life of U.S. citizens. Considers the technological and marketplace trends driving telecommunications development in this country and elsewhere. Assesses the role of regulatory and other government policies in promoting the development of a telecommunications infrastructure to support present and future national needs. 40 charts and tables.
The Malthusian Moment
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Author : Thomas Robertson
language : en
Publisher: Rutgers University Press
Release Date : 2012-05-07
The Malthusian Moment written by Thomas Robertson and has been published by Rutgers University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-05-07 with Nature categories.
Although Rachel Carson’s Silent Spring (1962) is often cited as the founding text of the U.S. environmental movement, in The Malthusian Moment Thomas Robertson locates the origins of modern American environmentalism in twentieth-century adaptations of Thomas Malthus’s concerns about population growth. For many environmentalists, managing population growth became the key to unlocking the most intractable problems facing Americans after World War II—everything from war and the spread of communism overseas to poverty, race riots, and suburban sprawl at home. Weaving together the international and the domestic in creative new ways, The Malthusian Moment charts the explosion of Malthusian thinking in the United States from World War I to Earth Day 1970, then traces the just-as-surprising decline in concern beginning in the mid-1970s. In addition to offering an unconventional look at World War II and the Cold War through a balanced study of the environmental movement’s most contentious theory, the book sheds new light on some of the big stories of postwar American life: the rise of consumption, the growth of the federal government, urban and suburban problems, the civil rights and women’s movements, the role of scientists in a democracy, new attitudes about sex and sexuality, and the emergence of the “New Right.”
Interconnected
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Author : Ogyen Trinley Dorje Karmapa
language : en
Publisher: Simon and Schuster
Release Date : 2017-02-28
Interconnected written by Ogyen Trinley Dorje Karmapa and has been published by Simon and Schuster this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-02-28 with Psychology categories.
Plucked from a humble nomad family to become the leader of one of Tibet’s oldest Buddhist lineages, the young Seventeenth Karmapa draws on timeless values to create an urgent ethic for today’s global community. We have always been, and will always be, interconnected—through family, community, and shared humanity. As our planet changes and our world grows smaller, it is vital we not only recognize our connections to one another and to the earth but also begin actively working together as interdependent individuals to create a truly global society. The Karmapa, Ogyen Trinley Dorje, is uniquely positioned to guide us in this process. Drawing on years of intensive Buddhist training and a passionate commitment to social issues, he teaches how we can move from a merely intellectual understanding to a fully lived experience of connection. By first seeing, then feeling, and finally living these connections, we can become more effective agents of social and ethical change. The Karmapa shows us how gaining emotional awareness of our connectedness can fundamentally reshape the human race. He then guides us to action, showing step by step how we can change the way we use the earth’s resources and can continue to better our society. In clear language, the Karmapa draws connections between such seemingly far-flung issues as consumer culture, loneliness, animal protection, and self-reliance. In the process, he helps us move beyond theory to practical and positive social and ethical change.
Interconnected Universe The Conceptual Foundations Of Transdisciplinary Unified Theory
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Author : Ervin Laszlo
language : en
Publisher: World Scientific
Release Date : 1995-08-31
Interconnected Universe The Conceptual Foundations Of Transdisciplinary Unified Theory written by Ervin Laszlo and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995-08-31 with Science categories.
This book offers an original hypothesis capable of unifying evolution in the physical universe with evolution in biology; herewith it lays the conceptual foundations of “transdisciplinary unified theory”. The rationale for the hypothesis is presented first; then the theoretical framework is outlined, and thereafter it is explored in regard to quantum physics, physical cosmology, micro- and macro-biology, and the cognitive sciences (neurophysiology, psychology, with attention to anomalous phenomena as well). The book closes with a variety of studies, both by the author and his collaborators, sketching out the implications of the hypothesis in regard to brain dynamics, cosmology, the concept of space, phenomena of creativity, and the prospects for the elaboration of a mature transdisciplinary unified theory. The Foreword is written by philosopher of science Arne Naess, and the Afterword is contributed by neuroscientist Karl Pribram.
Handbook Of Semiconductor Interconnection Technology
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Author : Geraldine Cogin Shwartz
language : en
Publisher: CRC Press
Release Date : 2006-02-22
Handbook Of Semiconductor Interconnection Technology written by Geraldine Cogin Shwartz and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-02-22 with Technology & Engineering categories.
First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first ed
Interconnections
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Author : Radia Perlman
language : en
Publisher: Addison-Wesley Professional
Release Date : 2000
Interconnections written by Radia Perlman and has been published by Addison-Wesley Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Computers categories.
Perlman, a bestselling author and senior consulting engineer for Sun Microsystems, provides insight for building more robust, reliable, secure and manageable networks. Coverage also includes routing and addressing strategies, VLANs, multicasting, IPv6, and more.
Local Area Network Interconnection
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Author : Raif O. Onvural
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Local Area Network Interconnection written by Raif O. Onvural and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
There are many exciting trends and developments in the communications industry, several of which are related to advances in fast packet switching, multi media services, asynchronous transfer mode (ATM) and high-speed protocols. It seems fair to say that the face of networking has been rapidly changing and the distinction between LANs, MANs, and WANs is becoming more and more blurred. It is commonly believed in the industry that ATM represents the next generation in networking. The adoption of ATM standards by the research and development community as a unifying technology for communications that scales from local to wide area has been met with great enthusiasm from the business community and end users. Reflecting these trends, the technical program of the First International Conference on LAN Interconnection consists of papers addressing a wide range of technical challenges and state of the art reviews. We are fortunate to have assembled a strong program committee, expert speakers, and panelists. We would like to thank Professor Schwartz for his keynote speech. We would like to thank Professor Yannis Viniotis and his students for the preparation of the index. We gratefully acknowledge the generous financial support of Dr. Jon Fjeld, Mr. Rick McGee, and Mr. David Witt, all of IBM-Research Triangle Park. We also would like to thank Ms. Mary Safford, our editor, and Mr. John Matzka, both at Plenum Press, for the publication of the proceedings.
Direct Copper Interconnection For Advanced Semiconductor Technology
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Author : Dongkai Shangguan
language : en
Publisher: CRC Press
Release Date : 2024-06-28
Direct Copper Interconnection For Advanced Semiconductor Technology written by Dongkai Shangguan and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-06-28 with Technology & Engineering categories.
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.