The Materials Science Of Microelectronics
DOWNLOAD
Download The Materials Science Of Microelectronics PDF/ePub or read online books in Mobi eBooks. Click Download or Read Online button to get The Materials Science Of Microelectronics book now. This website allows unlimited access to, at the time of writing, more than 1.5 million titles, including hundreds of thousands of titles in various foreign languages. If the content not found or just blank you must refresh this page
Materials Science Of Microelectronics
DOWNLOAD
Author : Klaus J. Bachman
language : en
Publisher:
Release Date : 1994-06-01
Materials Science Of Microelectronics written by Klaus J. Bachman and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994-06-01 with categories.
Materials Science In Microelectronics Ii
DOWNLOAD
Author : Eugene Machlin
language : en
Publisher: Elsevier
Release Date : 2010-07-07
Materials Science In Microelectronics Ii written by Eugene Machlin and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-07-07 with Technology & Engineering categories.
The subject matter of thin-films – which play a key role in microelectronics – divides naturally into two headings: the processing / structure relationship, and the structure / properties relationship. Part II of 'Materials Science in Microelectronics' focuses on the latter of these relationships, examining the effect of structure on the following: •Electrical properties•Magnetic properties•Optical properties•Mechanical properties•Mass transport properties•Interface and junction properties•Defects and properties - Captures the importance of thin films to microelectronic development - Examines the cause / effect relationship of structure on thin film properties
The Materials Science Of Semiconductors
DOWNLOAD
Author : Angus Rockett
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-11-20
The Materials Science Of Semiconductors written by Angus Rockett and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-11-20 with Technology & Engineering categories.
This book describes semiconductors from a materials science perspective rather than from condensed matter physics or electrical engineering viewpoints. It includes discussion of current approaches to organic materials for electronic devices. It further describes the fundamental aspects of thin film nucleation and growth, and the most common physical and chemical vapor deposition techniques. Examples of the application of the concepts in each chapter to specific problems or situations are included, along with recommended readings and homework problems.
Materials Science In Microelectronics
DOWNLOAD
Author : E. S. Machlin
language : en
Publisher:
Release Date : 2005
Materials Science In Microelectronics written by E. S. Machlin and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with categories.
Microelectronic Materials
DOWNLOAD
Author : C.R.M. Grovenor
language : en
Publisher: Routledge
Release Date : 2017-10-05
Microelectronic Materials written by C.R.M. Grovenor and has been published by Routledge this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-10-05 with Science categories.
This practical book shows how an understanding of structure, thermodynamics, and electrical properties can explain some of the choices of materials used in microelectronics, and can assist in the design of new materials for specific applications. It emphasizes the importance of the phase chemistry of semiconductor and metal systems for ensuring the long-term stability of new devices. The book discusses single-crystal and polycrystalline silicon, aluminium- and gold-based metallisation schemes, packaging semiconductor devices, failure analysis, and the suitability of various materials for optoelectronic devices and solar cells. It has been designed for senior undergraduates, graduates, and researchers in physics, electronic engineering, and materials science.
Materials Science In Microelectronics I
DOWNLOAD
Author : Eugene Machlin
language : en
Publisher: Elsevier
Release Date : 2010-07-07
Materials Science In Microelectronics I written by Eugene Machlin and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-07-07 with Technology & Engineering categories.
Thin films play a key role in the material science of microelectronics, and the subject matter of thin-films divides naturally into two headings: processing / structure relationship, and structure / properties relationship.The first volume of Materials Science in Microelectronics focuses on the first relationship – that between processing and the structure of the thin-film. The state of the thin film's surface during the period that one monolayer exists - before being buried in the next layer – determines the ultimate structure of the thin film, and thus its properties. This volume takes into consideration the following potential influencing factors: crystal defects, void structure, grain structure, interface structure in epitaxial films, the structure of amorphous films, and reaction-induced structure.An ideal text or reference work for students and researchers in material science, who need to learn the basics of thin films.
Microelectronic Materials And Processes
DOWNLOAD
Author : R.A. Levy
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Microelectronic Materials And Processes written by R.A. Levy and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.
Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging
DOWNLOAD
Author : Ephraim Suhir
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-05-26
Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging written by Ephraim Suhir and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-05-26 with Technology & Engineering categories.
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Microelectronic Interconnections And Assembly
DOWNLOAD
Author : G.G. Harman
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Microelectronic Interconnections And Assembly written by G.G. Harman and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Handbook Of Lead Free Solder Technology For Microelectronic Assemblies
DOWNLOAD
Author : Karl J. Puttlitz
language : en
Publisher: CRC Press
Release Date : 2004-02-27
Handbook Of Lead Free Solder Technology For Microelectronic Assemblies written by Karl J. Puttlitz and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-02-27 with Technology & Engineering categories.
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif