Microelectronic Materials And Processes
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Microelectronic Materials And Processes
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Author : R.A. Levy
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Microelectronic Materials And Processes written by R.A. Levy and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.
Microelectronic Materials And Processes
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Author : R a Levy
language : en
Publisher:
Release Date : 1989-01-31
Microelectronic Materials And Processes written by R a Levy and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989-01-31 with categories.
Defects In Microelectronic Materials And Devices
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Author : Daniel M Fleetwood
language : en
Publisher: CRC Press
Release Date : 2019-08-30
Defects In Microelectronic Materials And Devices written by Daniel M Fleetwood and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-08-30 with categories.
Uncover the Defects that Compromise Performance and Reliability As microelectronics features and devices become smaller and more complex, it is critical that engineers and technologists completely understand how components can be damaged during the increasingly complicated fabrication processes required to produce them. A comprehensive survey of defects that occur in silicon-based metal-oxide semiconductor field-effect transistor (MOSFET) technologies, this book also discusses flaws in linear bipolar technologies, silicon carbide-based devices, and gallium arsenide materials and devices. These defects can profoundly affect the yield, performance, long-term reliability, and radiation response of microelectronic devices and integrated circuits (ICs). Organizing the material to build understanding of the problems and provide a quick reference for scientists, engineers and technologists, this text reviews yield- and performance-limiting defects and impurities in the device silicon layer, in the gate insulator, and/or at the critical Si/SiO2 interface. It then examines defects that impact production yield and long-term reliability, including: Vacancies, interstitials, and impurities (especially hydrogen) Negative bias temperature instabilities Defects in ultrathin oxides (SiO2 and silicon oxynitride) Take A Proactive Approach The authors condense decades of experience and perspectives of noted experimentalists and theorists to characterize defect properties and their impact on microelectronic devices. They identify the defects, offering solutions to avoid them and methods to detect them. These include the use of 3-D imaging, as well as electrical, analytical, computational, spectroscopic, and state-of-the-art microscopic methods. This book is a valuable look at challenges to come from emerging
Chemical Mechanical Planarization Of Microelectronic Materials
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Author : Joseph M. Steigerwald
language : en
Publisher: John Wiley & Sons
Release Date : 1997
Chemical Mechanical Planarization Of Microelectronic Materials written by Joseph M. Steigerwald and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Science categories.
The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry.
Mems Materials And Processes Handbook
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Author : Reza Ghodssi
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-03-18
Mems Materials And Processes Handbook written by Reza Ghodssi and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-03-18 with Technology & Engineering categories.
MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
Microelectronics Manufacturing Diagnostics Handbook
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Author : Abraham Landzberg
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Microelectronics Manufacturing Diagnostics Handbook written by Abraham Landzberg and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.
Materials For Information Technology
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Author : Ehrenfried Zschech
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-07-02
Materials For Information Technology written by Ehrenfried Zschech and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-07-02 with Technology & Engineering categories.
This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.
Microelectronic Materials
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Author : C.R.M. Grovenor
language : en
Publisher: Routledge
Release Date : 2017-10-05
Microelectronic Materials written by C.R.M. Grovenor and has been published by Routledge this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-10-05 with Science categories.
This practical book shows how an understanding of structure, thermodynamics, and electrical properties can explain some of the choices of materials used in microelectronics, and can assist in the design of new materials for specific applications. It emphasizes the importance of the phase chemistry of semiconductor and metal systems for ensuring the long-term stability of new devices. The book discusses single-crystal and polycrystalline silicon, aluminium- and gold-based metallisation schemes, packaging semiconductor devices, failure analysis, and the suitability of various materials for optoelectronic devices and solar cells. It has been designed for senior undergraduates, graduates, and researchers in physics, electronic engineering, and materials science.
Handbook Of Contamination Control In Microelectronics
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Author : Donald L. Tolliver
language : en
Publisher: William Andrew
Release Date : 1988-12-31
Handbook Of Contamination Control In Microelectronics written by Donald L. Tolliver and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988-12-31 with Computers categories.
Covers the basics of contamination control for the beginner, while also focusing in depth on critical issues of process engineering and circuit manufacturing for the more advanced reader. Stresses to readers that what makes the area of contamination control unique is its ubiquitous nature, across all facets of semiconductor manufacturing. Clean room technology, well-recognized as a fundamental requirement in modern day circuit manufacturing, barely scratches the surface in total contamination control.
3d Microelectronic Packaging
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Author : Yan Li
language : en
Publisher: Springer Nature
Release Date : 2020-11-23
3d Microelectronic Packaging written by Yan Li and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-11-23 with Technology & Engineering categories.
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.