Thermal And Structural Electronic Packaging Analysis For Space And Extreme Environments
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Thermal And Structural Electronic Packaging Analysis For Space And Extreme Environments
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Author : Juan Cepeda-Rizo
language : en
Publisher: CRC Press
Release Date : 2021-12-29
Thermal And Structural Electronic Packaging Analysis For Space And Extreme Environments written by Juan Cepeda-Rizo and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-12-29 with Technology & Engineering categories.
Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASA’s Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus. Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space.
Thermal And Structural Electronic Packaging Analysis For Space And Extreme Environments
DOWNLOAD
Author : Juan Cepeda-Rizo
language : en
Publisher: CRC Press
Release Date : 2021-12-29
Thermal And Structural Electronic Packaging Analysis For Space And Extreme Environments written by Juan Cepeda-Rizo and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-12-29 with Technology & Engineering categories.
Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASA’s Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus. Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space.
Mechanical Analysis Of Electronic Packaging Systems
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Author : Mckeown
language : en
Publisher: CRC Press
Release Date : 1999-04-06
Mechanical Analysis Of Electronic Packaging Systems written by Mckeown and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999-04-06 with Technology & Engineering categories.
"Fills the niche between purely technical engineering texts and sophisticated engineering software guides-providing a pragmatic, common sense approach to analyzing and remedying electronic packaging configuration problems. Combines classical engineering techniques with modern computing to achieve optimum results in assessment cost and accuracy."
Electronic Packaging And Production
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Author :
language : en
Publisher:
Release Date : 1986
Electronic Packaging And Production written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1986 with Electronic apparatus and appliances categories.
Advanced Materials For Thermal Management Of Electronic Packaging
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Author : Xingcun Colin Tong
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-01-05
Advanced Materials For Thermal Management Of Electronic Packaging written by Xingcun Colin Tong and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-01-05 with Technology & Engineering categories.
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Proceedings Of The Technical Program
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Author :
language : en
Publisher:
Release Date : 1965
Proceedings Of The Technical Program written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1965 with Electronic apparatus and appliances categories.
Electronics
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Author :
language : en
Publisher:
Release Date : 1962-03
Electronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1962-03 with Electronics categories.
June issues, 1941-44 and Nov. issue, 1945, include a buyers' guide section.
Electronic Industries
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Author :
language : en
Publisher:
Release Date : 1962
Electronic Industries written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1962 with Electronics categories.
Edn
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Author :
language : en
Publisher:
Release Date : 1987
Edn written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1987 with Electrical engineering categories.
Aero Space Engineering
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Author :
language : en
Publisher:
Release Date : 1962
Aero Space Engineering written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1962 with Aeronautics categories.