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Thermal And Structural Electronic Packaging Analysis For Space And Extreme Environments


Thermal And Structural Electronic Packaging Analysis For Space And Extreme Environments
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Thermal And Structural Electronic Packaging Analysis For Space And Extreme Environments


Thermal And Structural Electronic Packaging Analysis For Space And Extreme Environments
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Author : Juan Cepeda-Rizo
language : en
Publisher: CRC Press
Release Date : 2021-12-21

Thermal And Structural Electronic Packaging Analysis For Space And Extreme Environments written by Juan Cepeda-Rizo and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-12-21 with Technology & Engineering categories.


"Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASA's Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus. Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space"--



Thermal And Structural Electronic Packaging Analysis For Space And Extreme Environments


Thermal And Structural Electronic Packaging Analysis For Space And Extreme Environments
DOWNLOAD
Author : Juan Cepeda-Rizo
language : en
Publisher: CRC Press
Release Date : 2021-12-29

Thermal And Structural Electronic Packaging Analysis For Space And Extreme Environments written by Juan Cepeda-Rizo and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-12-29 with Technology & Engineering categories.


Have you ever wondered how NASA designs, builds, and tests spacecrafts and hardware for space? How is it that wildly successful programs such as the Mars Exploration Rovers could produce a rover that lasted over ten times the expected prime mission duration? Or build a spacecraft designed to visit two orbiting destinations and last over 10 years when the fuel ran out? This book was written by NASA/JPL engineers with experience across multiple projects, including the Mars rovers, Mars helicopter, and Dawn ion propulsion spacecraft in addition to many more missions and technology demonstration programs. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for design spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars. This is done without losing sight of the fundamental and classical theories of thermodynamics and structural mechanics that paved the way to more pragmatic and applied methods such finite element analysis and Monte Carlo ray tracing, for example. Features: Includes case studies from NASA’s Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flyting the first cubeSAT to Mars. Enables spacecraft designer engineers to create a design that is structurally and thermally sound, and reliable, in the quickest time afforded. Examines innovative low-cost thermal and power systems. Explains how to design to survive rocket launch, the surfaces of Mars and Venus. Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, and analyze, and test in the fast-paced and low-cost small satellite environment and learn techniques to reduce the design and test cycles without compromising reliability. It serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space.



Seismic Analysis And Design Using The Endurance Time Method


Seismic Analysis And Design Using The Endurance Time Method
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Author : Homayoon E. Estekanchi
language : en
Publisher: CRC Press
Release Date : 2021-10-07

Seismic Analysis And Design Using The Endurance Time Method written by Homayoon E. Estekanchi and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-10-07 with Technology & Engineering categories.


The endurance time method (ETM) is a seismic analysis procedure in which intensifying dynamic excitations are used as the loading function, and it provides many unique benefits in the design of structures. It can largely reduce the computational effort needed for the response history analysis of structures. This aids in the practical application of response history-based analysis in problems involving very large models and/or requiring numerous analyses to achieve optimal design goals. A single response history analysis through ETM provides an estimate of the system response at the entire range of seismic intensities of interest, thus making it ideal for applications such as seismic risk assessment, life-cycle cost analysis, and value-based seismic design. Conceptual simplicity also makes ETM a useful tool for preliminary response history analysis of structural systems. Features: Presents full coverage of the subject from basic concepts to advanced applied topics. Provides a coherent text on endurance time excitation functions that are essential in endurance time analysis. Seismic Analysis and Design using the Endurance Time Method serves as a comprehensive resource for students, researchers, and practicing structural engineers who want to familiarize themselves with the concepts and applications of the endurance time method (ETM) as a useful tool for dynamic structural analysis.



Automation In Construction Toward Resilience


Automation In Construction Toward Resilience
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Author : Ehsan Noroozinejad Farsangi
language : en
Publisher: CRC Press
Release Date : 2023-09-29

Automation In Construction Toward Resilience written by Ehsan Noroozinejad Farsangi and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-09-29 with Technology & Engineering categories.


While the word "automation" may conjure images of robots taking over jobs, the reality is much more nuanced. In construction, for instance, automation is less likely to diminish employment opportunities than it is to increase productivity. Indeed, automation alongside the global need for new and updated infrastructure and better and more affordable housing can help shape the direction of the construction industry. The key will be anticipating and preparing for the shift, in part by developing new skills in the current and future workforce. This book presents all aspects of automation in construction pertaining to the use of information technologies in design, engineering, construction technologies, and maintenance and management of constructed facilities. The broad scope encompasses all stages of the construction life cycle from initial planning and design, through the construction of the facility, its operation, and maintenance, to the eventual dismantling and recycling of buildings and engineering structures. Features: Examines Building Information Management systems, allowing on-site execution of construction more efficient, and for project teams to eliminate mistakes and better coordinate the workforce Presents the latest information on the automation of modular construction, production in factories, including 3-D printing of components such as facades, or even load-bearing and essential components



Sustainable Development For The Americas


Sustainable Development For The Americas
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Author : E. William Colglazier
language : en
Publisher: CRC Press
Release Date : 2021-12-14

Sustainable Development For The Americas written by E. William Colglazier and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-12-14 with Law categories.


Environmental sustainability efforts require a great deal of engagement and political will, ranging from local communities to state departments. Science diplomats—from experts and scientists to spokespersons and ambassadors—can help facilitate at all levels and yield valued resources from technology sharing, capacity building, and knowledge exchanges. This book explores the importance of sustained international scientific cooperation, building community resilience, and the role of political will in sustainability and diplomacy. It shows how even small diplomatic efforts can influence myriad issues, from overfishing to human rights negotiations to global carbon emission reduction. Features: • Examines various topics such as global climate change, arid environments, water security and governance, trans-boundary conflict and cooperation, urban and rural resilience, and public health. • Presents case studies from various geographic regions through the lens of diplomacy, including the US–Mexico border, the Gulf of California, South America, Europe, the Middle East, Central and South Asia, and China. • Discusses how building networks of people, organizations, and countries engaged in science diplomacy is crucial for mutual growth and for overcoming conflicting political stances. Sustainable Development for the Americas: Science, Health and Engineering Policy and Diplomacy provides a useful resource for diplomats, policymakers, students, and decision-makers. It provides numerous examples of how using science and technology for policy and diplomacy is essential to finding common ground among nations for a collective global benefit.



Proceedings Of The Technical Program


Proceedings Of The Technical Program
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Author :
language : en
Publisher:
Release Date : 1965

Proceedings Of The Technical Program written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1965 with Electronic apparatus and appliances categories.




Power Electronic Packaging


Power Electronic Packaging
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Author : Yong Liu
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-02-15

Power Electronic Packaging written by Yong Liu and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-15 with Technology & Engineering categories.


Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.



Electronics


Electronics
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Author :
language : en
Publisher:
Release Date : 1962

Electronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1962 with Electronics categories.


June issues, 1941-44 and Nov. issue, 1945, include a buyers' guide section.



Electronic Industries


Electronic Industries
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Author :
language : en
Publisher:
Release Date : 1962

Electronic Industries written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1962 with Electronics categories.




Electronic Industries Tele Tech


Electronic Industries Tele Tech
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Author :
language : en
Publisher:
Release Date : 1962

Electronic Industries Tele Tech written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1962 with categories.