Thermal Management Of Electronics
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Advanced Materials For Thermal Management Of Electronic Packaging
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Author : Xingcun Colin Tong
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-01-05
Advanced Materials For Thermal Management Of Electronic Packaging written by Xingcun Colin Tong and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-01-05 with Technology & Engineering categories.
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Thermal Management Of Electronic Components
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Author : Ravi Kandasamy
language : en
Publisher: LAP Lambert Academic Publishing
Release Date : 2010-05
Thermal Management Of Electronic Components written by Ravi Kandasamy and has been published by LAP Lambert Academic Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-05 with categories.
Thermal design in electronics cooling is to achieve effective heat removal to increase reliability and life of the components and systems. This book focuses on cooling of a Flip Chip (FC) package without the use of phase change materials(PCM). A numerical thermal model was developed and validated. CFD Simulation is performed for PCM and non-PCM based material studies. Relevant thermal performance data were obtained to show the effects of thermal interface material, lid, heat sink and process variables. Excellent agreement found between the numerical and the measured data. A novel PCM-based passive thermal control of electronic devices was investigated experimentally. A tall enclosure with uniform/discrete heat sources applied on sides for PCM melting and another with a PCM-filled heat sink setup developed and tested. PCM-based cooling technique is attractive thermal concept for transient applications. Effects of various parameters on melting/freezing times were studied. Flow visualization experiments were also made to determine the PCM melting rates. Finally, a 2D numerical study was conducted to compare simulation results with experimental data.
Qpedia Thermal Management Electronics Cooling Book Volume 2
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Author : Advanced Thermal Solutions
language : en
Publisher: Advanced Thermal Solutions
Release Date : 2008
Qpedia Thermal Management Electronics Cooling Book Volume 2 written by Advanced Thermal Solutions and has been published by Advanced Thermal Solutions this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Science categories.
The complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.
Thermal Management Of Electronics Volume Ii
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Author : Rajesh Baby
language : en
Publisher: Momentum Press
Release Date : 2019-04-03
Thermal Management Of Electronics Volume Ii written by Rajesh Baby and has been published by Momentum Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-04-03 with Technology & Engineering categories.
Phase change material (PCM)-based composite heat sinks have attracted great interest in recent decades, especially in the context of thermal management of portable electronic devices such as mobile phones, digital cameras, personal digital assistants, and notebooks. In this monograph, a detailed analysis of plate fin heat sinks and plate fin heat sink matrix is presented, based on in-house experiments. Performance benchmarks are articulated and presented for these heat sinks. The state of the art in the development of PCM-based heat sinks and the challenges are outlined, and directions on future development are provided. It is our sincere hope and trust that this book will not only be informative but also awaken curiosity and inspire thermal management solution seekers to delve deep into the ocean of research in PCM-based heat sinks and discover their own pearls and diamonds.
Thermal Management Of Electronic Systems Ii
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Author : E. Beyne
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Thermal Management Of Electronic Systems Ii written by E. Beyne and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.
Thermal Management Of Electronic Systems
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Author : C.J. Hoogendoorn
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Thermal Management Of Electronic Systems written by C.J. Hoogendoorn and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.
Thermal Management For Opto Electronics Packaging And Applications
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Author : Xiaobing Luo
language : en
Publisher: John Wiley & Sons
Release Date : 2024-08-12
Thermal Management For Opto Electronics Packaging And Applications written by Xiaobing Luo and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-08-12 with Technology & Engineering categories.
Thermal Management for Opto-electronics Packaging and Applications A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.
Understanding Heat Transport At Interfaces For Thermal Management Of Electronics
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Author : Lenan Zhang
language : en
Publisher:
Release Date : 2022
Understanding Heat Transport At Interfaces For Thermal Management Of Electronics written by Lenan Zhang and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022 with categories.
The discovery and development of two-dimensional (2D) materials offer new opportunities for high-performance nanoscale electronics. However, new material systems involve new device architectures, which leads to new challenges on both the electronic and thermal design. While significant progress has been made to understand and engineer the electrical properties of 2D devices, the thermal problems remain relatively poorly understood. Since many 2D electronics can reach very high-power density (>104 W/cm2 ), the dense vertical integration of multilayers within a few nanometers leads to a significant temperature rise (>150 °C), which becomes the bottleneck of device performance. These thermal challenges are associated with two critical thermophysical properties of 2D materials, i.e., the thermal expansion and the interfacial thermal transport. In addition, to address the thermal management of 2D electronics, novel cooling approaches with insights gained from 2D thermal interfaces are in high demands. This thesis performed a systematic study on the thermal expansion and thermal transport of the van der Waals (vdW) bonded 2D interfaces, and developed highly efficient thermal management solutions based on two-phase cooling. First, we developed for the first time a pure experimental approach to accurately measure the thermal expansion coefficients(TECs) of various 2D materials. Our measurements confirmed the correct physical range of 2D monolayer TECs and hence addressed the more than two orders of magnitude discrepancies in literature. Second, we investigated the thermal transport across various 2D interfaces. In particular, we elucidated the role of vdW interaction in the anisotropic thermal transport of substrate-supported 2D monolayers and identified an optimal vdW interaction toward the maximum total heat transfer. On the other hand, we explored the twist-angle dependence of 2D interfacial thermal transport. We observed that depending on different material systems, the thermal transport of 2D materials can exhibit both strong and weak twist-angle dependences, which creates a new degree of freedom to manipulate heat at the atomic level. Lastly, with fundamental understanding of 2D thermal interfaces, we designed and optimized a liquid-vapor thin film evaporator based on microstructured surfaces, enabling high-performance thermal management of 2D electronics. This thesis provides a holistic understanding for the fundamental thermal properties of 2D materials and interfaces, which are critical to address the thermal crisis of 2D electronics. We believe the simulation, experimental, and design approaches developed in this thesis can serve as a guideline for the next-generation 2D electronics with unprecedented reliability and performance.
Qpedia Thermal Management Electronics Cooling Book Volume 3
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Author : Advanced Thermal Solutions
language : en
Publisher: Advanced Thermal Solutions
Release Date : 2009
Qpedia Thermal Management Electronics Cooling Book Volume 3 written by Advanced Thermal Solutions and has been published by Advanced Thermal Solutions this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009 with Science categories.
The complete editorial contents of Qpedia Thermal eMagazine, Volume 3, Issues 1 - 12 features in-depth, technical articles covering the most critical areas of electronics cooling.
Qpedia Thermal Management Electronics Cooling Book Volume 1
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Author :
language : en
Publisher: Advanced Thermal Solutions
Release Date :
Qpedia Thermal Management Electronics Cooling Book Volume 1 written by and has been published by Advanced Thermal Solutions this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.