Thermal Management Of Electronic Systems
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Thermal Management Of Electronic Systems
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Author : C.J. Hoogendoorn
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Thermal Management Of Electronic Systems written by C.J. Hoogendoorn and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.
Thermal Management Of Electronic Systems
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Author : Cohen
language : en
Publisher: Academic Press
Release Date : 2000-02-28
Thermal Management Of Electronic Systems written by Cohen and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-02-28 with categories.
Cooling Of Electronic Systems
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Author : Sadik Kakaç
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Cooling Of Electronic Systems written by Sadik Kakaç and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Thermal Management Of Electronic Systems Ii
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Author : E. Beyne
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Thermal Management Of Electronic Systems Ii written by E. Beyne and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.
Thermal Management Handbook For Electronic Assemblies
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Author : Jerry E. Sergent
language : en
Publisher: McGraw Hill Professional
Release Date : 1998
Thermal Management Handbook For Electronic Assemblies written by Jerry E. Sergent and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Science categories.
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.
Thermal Management Of Microelectronic Equipment
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Author : Lian-Tuu Yeh
language : en
Publisher: Asme Press Book Series on Elec
Release Date : 2002
Thermal Management Of Microelectronic Equipment written by Lian-Tuu Yeh and has been published by Asme Press Book Series on Elec this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Technology & Engineering categories.
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
Heat Transfer
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Author : Younes Shabany
language : en
Publisher:
Release Date : 2010
Heat Transfer written by Younes Shabany and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with Electronic apparatus and appliances categories.
Thermal Management Of Electronic Systems Iii
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Author : J. P. Bardon
language : en
Publisher: Elsevier Science Limited
Release Date : 1998
Thermal Management Of Electronic Systems Iii written by J. P. Bardon and has been published by Elsevier Science Limited this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Electronic apparatus and appliances categories.
Heat Transfer
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Author : Younes Shabany
language : en
Publisher: CRC Press
Release Date : 2009-12-17
Heat Transfer written by Younes Shabany and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-12-17 with Science categories.
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Advanced Materials For Thermal Management Of Electronic Packaging
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Author : Xingcun Colin Tong
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-01-05
Advanced Materials For Thermal Management Of Electronic Packaging written by Xingcun Colin Tong and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-01-05 with Technology & Engineering categories.
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.