Thermal Management Of Microelectronic Equipment
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Thermal Management Of Microelectronic Equipment
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Author : Lian-Tuu Yeh
language : en
Publisher: Asme Press Book Series on Elec
Release Date : 2002
Thermal Management Of Microelectronic Equipment written by Lian-Tuu Yeh and has been published by Asme Press Book Series on Elec this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Technology & Engineering categories.
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
Cooling Of Microelectronic And Nanoelectronic Equipment
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Author : Madhusudan Iyengar
language : en
Publisher: World Scientific
Release Date : 2014-08-25
Cooling Of Microelectronic And Nanoelectronic Equipment written by Madhusudan Iyengar and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-08-25 with Technology & Engineering categories.
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging. Contents:A Review of Cooling Road Maps for 3D Chip Packages (Dereje Agonafer)Thermal Performance Mapping of Direct Liquid Cooled 3D Chip Stacks (Karl J L Geisler and Avram Bar-Cohen)Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency (Bing Shi and Ankur Srivastava)Energy Reduction and Performance Maximization Through Improved Cooling (David Copeland)Optimal Choice of Heat Sinks from an Industrial Point of View (Clemens J M Lasance)Synthetic Jets for Heat Transfer Augmentation in Microelectronics Systems (Mehmet Arik and Enes Tamdogan)Recent Advance in Thermoelectric Devices for Electronics Cooling (Peng Wang)Energy Efficient Solid-State Cooling for Hot Spot Removal (Kazuaki Yazawa, Andrei Fedorov, Yogendra Joshi and Ali Shakouri)An Overview of the Use of Phase Change Materials for the Thermal Management of Transient Portable Electronics: Benefits and Challenges (Amy S Fleischer)Estimation of Cooling Performance of Phase Change Material (PCM) Module (Masaru Ishizuka and Tomoyuki Hatakeyama)Optimization Under Uncertainty for Electronics Cooling Design (Karthik K Bodla, Jayathi Y Murthy and Suresh V Garimella)Hydrophilic CNT-Sintered Copper Composite Wick for Enhanced Cooling (Glen A Powell, Anuradha Bulusu, Justin A Weibel, Sungwon S Kim, Suresh V Garimella and Timothy S Fisher)A Cabinet Level Thermal Test Vehicle to Evaluate Hybrid Double-Sided Cooling Schemes (Qihong Nie and Yogendra Joshi)Energy Efficiency and Reliability Risk Mitigation of Data Centers Through Prognostics and Health Management (Jun Dai, Michael Ohadi and Michael Pecht)Damage Pre-Cursors Based Assessment of Accrued Thermomechanical Damage and Remaining Useful Life in Field Deployed Electronics (Pradeep Lall, Mahendra Harsha, Kai Goebel and Jim Jones)Towards Embedded Cooling — Gen 3 Thermal Packaging Technology (Avram Bar-Cohen) Readership: Researchers, practitioners, and postgraduates in mechanical engineering, nanoelectronics, computer engineering, and electrical & electronic engineering. Keywords:Electronics Cooling;Electronics Packaging;Thermal Management;Thermal Sciences;Electronics Reliability;Thermoelectrics;Computational Heat Transfer;Liquid Cooling
Cooling Of Electronic Systems
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Author : Sadik Kakaç
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Cooling Of Electronic Systems written by Sadik Kakaç and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Thermal Management Handbook For Electronic Assemblies
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Author : Jerry E. Sergent
language : en
Publisher: McGraw Hill Professional
Release Date : 1998
Thermal Management Handbook For Electronic Assemblies written by Jerry E. Sergent and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Science categories.
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.
Heat Transfer In Microelectronic Equipment
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Author : John H. Seely
language : en
Publisher: Marcel Dekker
Release Date : 1972
Heat Transfer In Microelectronic Equipment written by John H. Seely and has been published by Marcel Dekker this book supported file pdf, txt, epub, kindle and other format this book has been release on 1972 with Science categories.
Advanced Materials For Thermal Management Of Electronic Packaging
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Author : Xingcun Colin Tong
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-01-05
Advanced Materials For Thermal Management Of Electronic Packaging written by Xingcun Colin Tong and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-01-05 with Technology & Engineering categories.
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Thermal Management Concepts In Microelectronic Packaging
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Author : Stephen S. Furkay
language : en
Publisher:
Release Date : 1984
Thermal Management Concepts In Microelectronic Packaging written by Stephen S. Furkay and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1984 with Electronic apparatus and appliances categories.
Heat Transfer
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Author : Younes Shabany
language : en
Publisher: CRC Press
Release Date : 2009-12-17
Heat Transfer written by Younes Shabany and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-12-17 with Science categories.
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Thermal Design Of Liquid Cooled Microelectronic Equipment
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Author : Lian-Tuu Yeh
language : en
Publisher:
Release Date : 2019
Thermal Design Of Liquid Cooled Microelectronic Equipment written by Lian-Tuu Yeh and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019 with Technology & Engineering categories.
"With the demands of increased system functionalities and performance, the system power density of microelectronics equipment is continuously increased at a fast pace. This is especially true for the telecommunications systems because the network traffic in the industry has grown very rapidly every year. For the high power air cooled systems, large high performance fans are becoming a must for the systems in order to provide the necessary air flow rates. Two major concerns about these large fans are the power consumption and the acoustic noise of the fans. In addition, the increase in the system power results in a significant increase in the operation cost of the equipment as well as its host facilities such as the date centers. Liquid cooling can not only resolve the above mentioned issues related to high power air-cooled systems but also enhance its system performance and reliability. For some cases, the system power is too high to be cooled by air thermally. The only solution to such situations is adopting the liquid cooling"--
Heat Transfer In Microelectronic Equipment
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Author : John H. Seely
language : en
Publisher:
Release Date : 1972
Heat Transfer In Microelectronic Equipment written by John H. Seely and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1972 with categories.