Thin Films Stresses And Mechanical Properties X
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Thin Films Volume 875
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Author : Thomas E. Buchheit
language : en
Publisher: Cambridge University Press
Release Date : 2005
Thin Films Volume 875 written by Thomas E. Buchheit and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Technology & Engineering categories.
This book has a long tradition of representing current topics in thin-film properties and how they are related to the performance and reliability of thin-film structures. Several emerging and well-developed technologies rely on understanding the behavior of these structures. This book provides a forum for an exchange of ideas among researchers who are interested in the mechanical behavior of thin films, broadly applied to their materials choice or methodology. The book focuses on stress-related phenomena in thin films for a wide range of materials. Of particular interest are studies that explore the frontiers of thin-film materials science with regard to materials selection or size scale. Topics include: elasticity in thin films; characterizing thin films by nanoindentation; mechanical behavior of nanostructured films; mechanical properties of thin; thin-film plasticity; thin-film plasticity; thin-film plasticity; novel testing techniques; in situ characterization techniques; adhesion and fracture of thin films; fatigue and stress in interconnect and metallization; deformation, growth and microstructure in thin films and thin-film processing.
Thin Films Stresses And Mechanical Properties X
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Author : Sean G. Corcoran
language : en
Publisher: Cambridge University Press
Release Date : 2014-06-05
Thin Films Stresses And Mechanical Properties X written by Sean G. Corcoran and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-06-05 with Technology & Engineering categories.
Understanding the mechanical behavior of thin films is crucial for a wide variety of technologies. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. However, the performance of these devices is often limited by the mechanical properties of both the films and the structures to which they are attached. The concepts, models and techniques developed for bulk materials often do not apply to small dimensions, and the mechanisms controlling behavior are not well defined. This book, first published in 2004, brings together an international group of researchers and students from industry, academia and national laboratories to address the mechanical behavior of thin films. Of particular interest are those studies that cut across length scales such as atomistic-to-nanometer or nanometer-to-submicron scale. Topics include: stress evolution; modeling stresses and film instability; deformation and adhesion; film fracture and fatigue; processing and structure; indentation testing; mechanical properties; properties and performance; and multilayers and nanolaminates.
Thin Films Stresses And Mechanical Properties
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Author :
language : en
Publisher:
Release Date : 1997
Thin Films Stresses And Mechanical Properties written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Thin films categories.
Thin Films Stresses And Mechanical Properties Ix Volume 695
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Author : Materials Research Society. Meeting
language : en
Publisher:
Release Date : 2002-04
Thin Films Stresses And Mechanical Properties Ix Volume 695 written by Materials Research Society. Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-04 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Modeling The Mechanical Properties Of Thin Films Copper Under Induced Stresses
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Author : Chingho Richard Lee
language : en
Publisher:
Release Date : 1994
Modeling The Mechanical Properties Of Thin Films Copper Under Induced Stresses written by Chingho Richard Lee and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with categories.
Metallic Films For Electronic Optical And Magnetic Applications
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Author : Katayun Barmak
language : en
Publisher: Woodhead Publishing
Release Date : 2014-02-13
Metallic Films For Electronic Optical And Magnetic Applications written by Katayun Barmak and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-02-13 with Technology & Engineering categories.
Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties
Thin Films Stresses And Mechanical Properties Ix
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Author : Cengiz S. Ozkan
language : en
Publisher: Cambridge University Press
Release Date : 2014-06-05
Thin Films Stresses And Mechanical Properties Ix written by Cengiz S. Ozkan and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-06-05 with Technology & Engineering categories.
This book, the ninth in a popular series from the Materials Research Society, is strengthened by invited and contributed papers covering a wide range of subjects, from processing-microstructure-mechanical property relationships, strain effects and self-organization in thin films, nanoscale defects and thermomechanical behavior of materials, to novel nanscale materials testing. While the collection continues the series theme of materials science related modeling and characterization of mechanical properties of materials, special focus is given to: strain relaxation and strengthening mechanisms; defects formation; mechanical properties and nanoscale testing; adhesion and fracture; thin-film applications in MEMS; computational modeling and experiments; and film deposition, microstructure, evolution and intrinsic stress.
Thin Films Stresses And Mechanical Properties Viii
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Author : Richard Vinci
language : en
Publisher: Cambridge University Press
Release Date : 2014-06-05
Thin Films Stresses And Mechanical Properties Viii written by Richard Vinci and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-06-05 with Technology & Engineering categories.
An understanding of mechanical behavior is crucial for a wide variety of thin-film technologies such as semiconductor devices and packaging (including advanced interconnects, dielectrics and silicides), information storage media, hard coatings, microelectromechanical systems (MEMS), and biomedical devices. The influence of mechanical behavior is seen in thin-film performance and reliability, as well as morphology development during processing and service. The increased need for understanding of these properties has challenged modern materials science because concepts, models and techniques developed for bulk materials often do not apply in small dimensions. This book addresses key issues in the still growing field of thin-film mechanical behavior. Topics include: multilayer thin films; metallic thin films; epitaxy, deposition parameters, microstructure and stresses; thin films for applications in MEMS; polymer thin films; mechanical properties of amorphous and crystalline carbon; adhesion and fracture; reliability in microelectronics; and nanoindentation and advanced testing techniques.
Mechanical Properties Of Structural Films
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Author : Christopher L. Muhlstein
language : en
Publisher: ASTM International
Release Date : 2001
Mechanical Properties Of Structural Films written by Christopher L. Muhlstein and has been published by ASTM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Gold films categories.
Recent advances in the mechanical properties of structural films are described in these papers from a November 2000 symposium held in Orlando, Florida. Papers are organized in sections on fracture and fatigue of structural films, elastic behavior and residual stress in thin films, tensile testing of
Thin Films Stresses And Mechanical Properties X
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Author : Sean G. Corcoran
language : en
Publisher:
Release Date : 2004
Thin Films Stresses And Mechanical Properties X written by Sean G. Corcoran and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Thin films categories.
This work contains experimental, theoretical, and modeling research papers from a December 2003 symposium on the mechanical behavior of thin films, touching on topics in stress evolution, modeling stresses and film instability, deformation and adhesion, film fracture and fatigue, processing and structure, indentation testing, mechanical properties, properties and performance, and multilayers and nanolaminates. Some specific topics include fracture patterns in thin films and multilayers, thin film herringbone buckling patterns, the effect of oxygen on adhesion of thin copper films to silicon nitride, and the effects of stress amplitude on the fatigue of polysilicon. Annotation : 2004 Book News, Inc., Portland, OR (booknews.com)