1993 International Workshop On Vlsi Process And Device Modeling
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1993 International Workshop On Vlsi Process And Device Modeling
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Author :
language : en
Publisher: Business Center for Academic Societies
Release Date : 1993
1993 International Workshop On Vlsi Process And Device Modeling written by and has been published by Business Center for Academic Societies this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Computers categories.
International Workshop On Vlsi Process And Device Modeling 1993
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Author :
language : en
Publisher:
Release Date : 1993
International Workshop On Vlsi Process And Device Modeling 1993 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Electrical & Computer Engineering categories.
3 Dimensional Process Simulation
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Author : J. Lorenz
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
3 Dimensional Process Simulation written by J. Lorenz and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Computers categories.
Whereas two-dimensional semiconductor process simulation has achieved a certain degree of maturity, three-dimensional process simulation is a newly emerging field in which most efforts are dedicated to necessary basic developments. Research in this area is promoted by the growing demand to obtain reliable information on device geometries and dopant distributions needed for three-dimensional device simulation, and challenged by the great algorithmic problems caused by moving interfaces and by the requirement to limit computation times and memory requirements. A workshop (Erlangen, September 5, 1995) provided a forum to discuss the industrial needs, technical problems, and solutions being developed in the field of three-dimensional semiconductor process simulation. Invited presentations from leading semiconductor companies and research Centers of Excellence from Japan, the USA, and Europe outlined novel numerical algorithms, physical models, and applications in this rapidly emerging field.
Vpad 93
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Author :
language : en
Publisher:
Release Date : 1993
Vpad 93 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with categories.
Technology Cad Systems
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Author : Franz Fasching
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Technology Cad Systems written by Franz Fasching and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Computers categories.
As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's business. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a "virtual fab" S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with "robust", "proven" tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.
Simulation Of Semiconductor Devices And Processes
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Author : Siegfried Selberherr
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Simulation Of Semiconductor Devices And Processes written by Siegfried Selberherr and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Computers categories.
The "Fifth International Conference on Simulation of Semiconductor Devices and Processes" (SISDEP 93) continues a series of conferences which was initiated in 1984 by K. Board and D. R. J. Owen at the University College of Wales, Swansea, where it took place a second time in 1986. Its organization was succeeded by G. Baccarani and M. Rudan at the University of Bologna in 1988, and W. Fichtner and D. Aemmer at the Federal Institute of Technology in Zurich in 1991. This year the conference is held at the Technical University of Vienna, Austria, September 7 - 9, 1993. This conference shall provide an international forum for the presentation of out standing research and development results in the area of numerical process and de vice simulation. The miniaturization of today's semiconductor devices, the usage of new materials and advanced process steps in the development of new semiconduc tor technologies suggests the design of new computer programs. This trend towards more complex structures and increasingly sophisticated processes demands advanced simulators, such as fully three-dimensional tools for almost arbitrarily complicated geometries. With the increasing need for better models and improved understand ing of physical effects, the Conference on Simulation of Semiconductor Devices and Processes brings together the simulation community and the process- and device en gineers who need reliable numerical simulation tools for characterization, prediction, and development.
Simulation Of Semiconductor Devices And Processes Vol 5
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Author : Siegfried Selberherr
language : en
Publisher: Springer
Release Date : 1993
Simulation Of Semiconductor Devices And Processes Vol 5 written by Siegfried Selberherr and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Science categories.
Plasma Etching Processes For Cmos Devices Realization
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Author : Nicolas Posseme
language : en
Publisher: Elsevier
Release Date : 2017-01-25
Plasma Etching Processes For Cmos Devices Realization written by Nicolas Posseme and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-01-25 with Technology & Engineering categories.
Plasma etching has long enabled the perpetuation of Moore's Law. Today, etch compensation helps to create devices that are smaller than 20 nm. But, with the constant downscaling in device dimensions and the emergence of complex 3D structures (like FinFet, Nanowire and stacked nanowire at longer term) and sub 20 nm devices, plasma etching requirements have become more and more stringent. Now more than ever, plasma etch technology is used to push the limits of semiconductor device fabrication into the nanoelectronics age. This will require improvement in plasma technology (plasma sources, chamber design, etc.), new chemistries (etch gases, flows, interactions with substrates, etc.) as well as a compatibility with new patterning techniques such as multiple patterning, EUV lithography, Direct Self Assembly, ebeam lithography or nanoimprint lithography. This book presents these etch challenges and associated solutions encountered throughout the years for transistor realization. - Helps readers discover the master technology used to pattern complex structures involving various materials - Explores the capabilities of cold plasmas to generate well controlled etched profiles and high etch selectivities between materials - Teaches users how etch compensation helps to create devices that are smaller than 20 nm
Level Set Methods And Fast Marching Methods
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Author : J. A. Sethian
language : en
Publisher: Cambridge University Press
Release Date : 1999-06-13
Level Set Methods And Fast Marching Methods written by J. A. Sethian and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999-06-13 with Computers categories.
This new edition of Professor Sethian's successful text provides an introduction to level set methods and fast marching methods, which are powerful numerical techniques for analyzing and computing interface motion in a host of settings. They rely on a fundamental shift in how one views moving boundaries; rethinking the natural geometric Lagrangian perspective and exchanging it for an Eulerian, initial value partial differential equation perspective. For this edition, the collection of applications provided in the text has been expanded, including examples from physics, chemistry, fluid mechanics, combustion, image processing, material science, fabrication of microelectronic components, computer vision, computer-aided design, and optimal control theory. This book will be a useful resource for mathematicians, applied scientists, practising engineers, computer graphic artists, and anyone interested in the evolution of boundaries and interfaces.
Simulation Of Semiconductor Devices And Processes
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Author : Heiner Ryssel
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Simulation Of Semiconductor Devices And Processes written by Heiner Ryssel and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Computers categories.
SISDEP ’95 provides an international forum for the presentation of state-of-the-art research and development results in the area of numerical process and device simulation. Continuously shrinking device dimensions, the use of new materials, and advanced processing steps in the manufacturing of semiconductor devices require new and improved software. The trend towards increasing complexity in structures and process technology demands advanced models describing all basic effects and sophisticated two and three dimensional tools for almost arbitrarily designed geometries. The book contains the latest results obtained by scientists from more than 20 countries on process simulation and modeling, simulation of process equipment, device modeling and simulation of novel devices, power semiconductors, and sensors, on device simulation and parameter extraction for circuit models, practical application of simulation, numerical methods, and software.