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2012 Ieee International Conference On Ic Design Technology Icicdt 2012


2012 Ieee International Conference On Ic Design Technology Icicdt 2012
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2012 Ieee International Conference On Ic Design Technology Icicdt 2012


2012 Ieee International Conference On Ic Design Technology Icicdt 2012
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Author :
language : en
Publisher:
Release Date : 2012

2012 Ieee International Conference On Ic Design Technology Icicdt 2012 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012 with categories.




2012 Ieee International Conference On Ic Design And Technology


2012 Ieee International Conference On Ic Design And Technology
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Author : IEEE Staff
language : en
Publisher:
Release Date : 2012-06-02

2012 Ieee International Conference On Ic Design And Technology written by IEEE Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-06-02 with categories.




International Symposium On Functional Diversification Of Semiconductor Electronics 3 More Than Moore 3


International Symposium On Functional Diversification Of Semiconductor Electronics 3 More Than Moore 3
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Author : Y. Obeng
language : en
Publisher: The Electrochemical Society
Release Date :

International Symposium On Functional Diversification Of Semiconductor Electronics 3 More Than Moore 3 written by Y. Obeng and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.




Development Of Hfo2 Based Ferroelectric Memories For Future Cmos Technology Nodes


Development Of Hfo2 Based Ferroelectric Memories For Future Cmos Technology Nodes
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Author : Stefan Ferdinand Müller
language : en
Publisher: BoD – Books on Demand
Release Date : 2016-04-08

Development Of Hfo2 Based Ferroelectric Memories For Future Cmos Technology Nodes written by Stefan Ferdinand Müller and has been published by BoD – Books on Demand this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-08 with Technology & Engineering categories.


This thesis evaluates the viability of ferroelectric Si:HfO2 and its derived FeFET application for non-volatile data storage. At the beginning, the ferroelectric effect is explained briefly such that the applications that make use of it can be understood. Afterwards, the latest findings on ferroelectric HfO2 are reviewed and their potential impact on future applications is discussed. Experimental data is presented afterwards focusing on the ferroelectric material characteristics of Si:HfO2 that are most relevant for memory applications. Besides others, the stability of the ferroelectric switching effect could be demonstrated in a temperature range of almost 400 K. Moreover, nanosecond switching speed and endurance in the range of 1 million to 10 billion cycles could be proven. Retention and imprint characteristics have furthermore been analyzed and are shown to be stable for 1000 hours bake time at 125 oC. Derived from the ferroelectric effect in HfO2, a 28 nm FeFET memory cell is introduced as the central application of this thesis. Based on numerical simulations, the memory concept is explained and possible routes towards an optimized FeFET cell are discussed. Subsequently, the results from electrical characterization of FeFET multi-structures are presented and discussed. By using Si:HfO2 it was possible to realize the world's first 28 nm FeFET devices possessing i.a. 10k cycling endurance and an extrapolated 10 year data retention at room temperature. The next step towards a FeFET memory is represented by connecting several memory cells into matrix-type configurations. A cell concept study illustrates the different ways in which FeFET cells can be combined together to give high density memory arrays. For the proposed architectures, operational schemes are theoretically discussed and analyzed by both electrical characterization of FeFET multi-structures and numerical simulations. The thesis concludes with the electrical characterization of small FeFET memory arrays. First results show that a separation between memory states can be achieved by applying poling and incremental step pulse programming (ISPP) sequences. These results represent an important cornerstone for future studies on Si:HfO2 and its related applications.



Physical Design For 3d Integrated Circuits


Physical Design For 3d Integrated Circuits
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Author : Aida Todri-Sanial
language : en
Publisher: CRC Press
Release Date : 2017-12-19

Physical Design For 3d Integrated Circuits written by Aida Todri-Sanial and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.


Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.



Handbook Of 3d Integration Volume 3


Handbook Of 3d Integration Volume 3
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Author : Philip Garrou
language : en
Publisher: John Wiley & Sons
Release Date : 2014-07-21

Handbook Of 3d Integration Volume 3 written by Philip Garrou and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-07-21 with Technology & Engineering categories.


Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.



2012 Ieee International Conference On Circuits And Systems


2012 Ieee International Conference On Circuits And Systems
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Author : IEEE Staff
language : en
Publisher:
Release Date : 2012-10-03

2012 Ieee International Conference On Circuits And Systems written by IEEE Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-10-03 with Electronic circuits categories.




Innovative Research And Applications In Next Generation High Performance Computing


Innovative Research And Applications In Next Generation High Performance Computing
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Author : Hassan, Qusay F.
language : en
Publisher: IGI Global
Release Date : 2016-07-05

Innovative Research And Applications In Next Generation High Performance Computing written by Hassan, Qusay F. and has been published by IGI Global this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-07-05 with Computers categories.


High-performance computing (HPC) describes the use of connected computing units to perform complex tasks. It relies on parallelization techniques and algorithms to synchronize these disparate units in order to perform faster than a single processor could, alone. Used in industries from medicine and research to military and higher education, this method of computing allows for users to complete complex data-intensive tasks. This field has undergone many changes over the past decade, and will continue to grow in popularity in the coming years. Innovative Research Applications in Next-Generation High Performance Computing aims to address the future challenges, advances, and applications of HPC and related technologies. As the need for such processors increases, so does the importance of developing new ways to optimize the performance of these supercomputers. This timely publication provides comprehensive information for researchers, students in ICT, program developers, military and government organizations, and business professionals.



Vlsi


Vlsi
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Author : Tomasz Wojcicki
language : en
Publisher: CRC Press
Release Date : 2017-12-19

Vlsi written by Tomasz Wojcicki and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.


Recently the world celebrated the 60th anniversary of the invention of the first transistor. The first integrated circuit (IC) was built a decade later, with the first microprocessor designed in the early 1970s. Today, ICs are a part of nearly every aspect of our daily lives. They help us live longer and more comfortably, and do more, faster. All this is possible because of the relentless search for new materials, circuit designs, and ideas happening on a daily basis at industrial and academic institutions around the globe. Showcasing the latest advances in very-large-scale integrated (VLSI) circuits, VLSI: Circuits for Emerging Applications provides a balanced view of industrial and academic developments beyond silicon and complementary metal–oxide–semiconductor (CMOS) technology. From quantum-dot cellular automata (QCA) to chips for cochlear implants, this must-have resource: Investigates the trend of combining multiple cores in a single chip to boost performance of the overall system Describes a novel approach to enable physically unclonable functions (PUFs) using intrinsic features of a VLSI chip Examines the VLSI implementations of major symmetric and asymmetric key cryptographic algorithms, hash functions, and digital signatures Discusses nonvolatile memories such as resistive random-access memory (Re-RAM), magneto-resistive RAM (MRAM), and floating-body RAM (FB-RAM) Explores organic transistors, soft errors, photonics, nanoelectromechanical (NEM) relays, reversible computation, bioinformatics, asynchronous logic, and more VLSI: Circuits for Emerging Applications presents cutting-edge research, design architectures, materials, and uses for VLSI circuits, offering valuable insight into the current state of the art of micro- and nanoelectronics.



High Performance Ad And Da Converters Ic Design In Scaled Technologies And Time Domain Signal Processing


High Performance Ad And Da Converters Ic Design In Scaled Technologies And Time Domain Signal Processing
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Author : Pieter Harpe
language : en
Publisher: Springer
Release Date : 2014-07-23

High Performance Ad And Da Converters Ic Design In Scaled Technologies And Time Domain Signal Processing written by Pieter Harpe and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-07-23 with Technology & Engineering categories.


This book is based on the 18 tutorials presented during the 23rd workshop on Advances in Analog Circuit Design. Expert designers present readers with information about a variety of topics at the frontier of analog circuit design, serving as a valuable reference to the state-of-the-art, for anyone involved in analog circuit research and development.