2015 Ieee 22nd International Symposium On The Physical And Failure Analysis Of Integrated Circuits Ipfa 2015
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2015 Ieee 22nd International Symposium On The Physical And Failure Analysis Of Integrated Circuits Ipfa 2015
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Author :
language : en
Publisher:
Release Date : 2015
2015 Ieee 22nd International Symposium On The Physical And Failure Analysis Of Integrated Circuits Ipfa 2015 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015 with categories.
2015 Ieee 22nd International Symposium On The Physical And Failure Analysis Of Integrated Circuits Ipfa
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Author : IEEE Staff
language : en
Publisher:
Release Date : 2015-06-29
2015 Ieee 22nd International Symposium On The Physical And Failure Analysis Of Integrated Circuits Ipfa written by IEEE Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-06-29 with categories.
IPFA 2015 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures and issues related to semiconductor device reliability and yield, especially those related to advanced process technologies, which include Sample Preparation, Metrology and Material Characterization Advanced Failure Analysis Techniques Die Level Package Level Failure Analysis Case Study & Failure Mechanisms Novel CMOS Gate Stack Dielectrics and FEOL Reliability and Failure Mechanisms Product Reliability Evaluation and Approaches Device (Ge, III V, TFT, Memory, MEMS, LED etc ) Reliability and Failure Mechanisms Advanced Interconnects and BEOL Reliability and Failure Mechanism
Istfa 2017 Proceedings From The 43rd International Symposium For Testing And Failure Analysis
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Author : ASM International
language : en
Publisher: ASM International
Release Date : 2017-12-01
Istfa 2017 Proceedings From The 43rd International Symposium For Testing And Failure Analysis written by ASM International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-01 with Technology & Engineering categories.
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Istfa 2019 Proceedings Of The 45th International Symposium For Testing And Failure Analysis
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Author : ASM International
language : en
Publisher: ASM International
Release Date : 2019-12-01
Istfa 2019 Proceedings Of The 45th International Symposium For Testing And Failure Analysis written by ASM International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-12-01 with Technology & Engineering categories.
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Harsh Environment Electronics
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Author : Ahmed Sharif
language : en
Publisher: John Wiley & Sons
Release Date : 2019-08-05
Harsh Environment Electronics written by Ahmed Sharif and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-08-05 with Technology & Engineering categories.
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
Circadian Rhythms For Future Resilient Electronic Systems
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Author : Xinfei Guo
language : en
Publisher: Springer
Release Date : 2019-06-12
Circadian Rhythms For Future Resilient Electronic Systems written by Xinfei Guo and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-06-12 with Technology & Engineering categories.
This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware; Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow; Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems; Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both; Includes coverage of resilient aspects of emerging applications such as IoT.
Emerging Materials
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Author : Laxman Raju Thoutam
language : en
Publisher: Springer Nature
Release Date : 2022-05-13
Emerging Materials written by Laxman Raju Thoutam and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-13 with Science categories.
This book serves as a quick guide on the latest material systems including their synthesis, fabrication and characterization techniques. It discusses recent developments in different material systems and discusses their novel applications in various branches of science and engineering. The book briefs latest computational tools and techniques that are used to discover new material systems. The book also briefs applications of new emerging materials in various fields including, healthcare, sensors, opto-electronics, high power devices and nano-electronics. This book helps to create a synergy between computational and experimental research methods to better understand a particular material system.
Solid State Lighting Reliability Part 2
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Author : Willem Dirk van Driel
language : en
Publisher: Springer
Release Date : 2017-07-11
Solid State Lighting Reliability Part 2 written by Willem Dirk van Driel and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-07-11 with Technology & Engineering categories.
In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.
Timing Performance Of Nanometer Digital Circuits Under Process Variations
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Author : Victor Champac
language : en
Publisher: Springer
Release Date : 2018-04-18
Timing Performance Of Nanometer Digital Circuits Under Process Variations written by Victor Champac and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-04-18 with Technology & Engineering categories.
This book discusses the digital design of integrated circuits under process variations, with a focus on design-time solutions. The authors describe a step-by-step methodology, going from logic gates to logic paths to the circuit level. Topics are presented in comprehensively, without overwhelming use of analytical formulations. Emphasis is placed on providing digital designers with understanding of the sources of process variations, their impact on circuit performance and tools for improving their designs to comply with product specifications. Various circuit-level “design hints” are highlighted, so that readers can use then to improve their designs. A special treatment is devoted to unique design issues and the impact of process variations on the performance of FinFET based circuits. This book enables readers to make optimal decisions at design time, toward more efficient circuits, with better yield and higher reliability.
Handbook Of Silicon Based Mems Materials And Technologies
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Author : Markku Tilli
language : en
Publisher: Elsevier
Release Date : 2020-04-17
Handbook Of Silicon Based Mems Materials And Technologies written by Markku Tilli and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-04-17 with Technology & Engineering categories.
Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures. The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students. - Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits - Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures - Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements - Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors