2018 Ieee International Symposium On The Physical And Failure Analysis Of Integrated Circuits Ipfa
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2018 Ieee International Symposium On The Physical And Failure Analysis Of Integrated Circuits Ipfa
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Author : IEEE Staff
language : en
Publisher:
Release Date : 2018-07-16
2018 Ieee International Symposium On The Physical And Failure Analysis Of Integrated Circuits Ipfa written by IEEE Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-07-16 with categories.
IPFA 2018 is devoted to the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability
2018 Ieee International Symposium On The Physical And Failure Analysis Of Integrated Circuits Ipfa
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Author :
language : en
Publisher:
Release Date : 2018
2018 Ieee International Symposium On The Physical And Failure Analysis Of Integrated Circuits Ipfa written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018 with categories.
Istfa 2018 Proceedings From The 44th International Symposium For Testing And Failure Analysis
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Author : ASM International
language : en
Publisher: ASM International
Release Date : 2018-12-01
Istfa 2018 Proceedings From The 44th International Symposium For Testing And Failure Analysis written by ASM International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-12-01 with Technology & Engineering categories.
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Istfa 2019 Proceedings Of The 45th International Symposium For Testing And Failure Analysis
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Author : ASM International
language : en
Publisher: ASM International
Release Date : 2019-12-01
Istfa 2019 Proceedings Of The 45th International Symposium For Testing And Failure Analysis written by ASM International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-12-01 with Technology & Engineering categories.
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Proceedings Of The Green Materials And Electronic Packaging Interconnect Technology Symposium
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Author : Nurul Razliana Abdul Razak
language : en
Publisher: Springer Nature
Release Date : 2025-03-11
Proceedings Of The Green Materials And Electronic Packaging Interconnect Technology Symposium written by Nurul Razliana Abdul Razak and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-03-11 with Science categories.
This book highlights a comprehensive exposition of recent advancements and research in green materials and electronic packaging interconnect technology. It features peer reviewed articles from the Electronic Packaging Interconnect Technology Symposium (EPITS) 2024, and delves into pivotal areas of electronics packaging, ranging from micro to nano-scale domains. Topics explored include advancements in green materials and technology, interconnect solutions at both chip and package levels, surface coatings, and broader innovations in electronic packaging materials. EPITS provides a platform for the global exchange of innovative concepts and the advancement of cutting-edge research in electronic packaging by uniting multi-disciplinary specialists from academia, business, and government. This initiative directs focus towards recent remarkable breakthroughs in electronic materials and anticipates future trends and requirements in the field. This proceedings provides readers with an understanding of the potential and problems associated with electronic packaging and green materials, which is advancing the development of more environmentally friendly and effective electronic systems.
Icae 2023
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Author : Nur Cahyono Kushardianto
language : en
Publisher: European Alliance for Innovation
Release Date : 2024-01-19
Icae 2023 written by Nur Cahyono Kushardianto and has been published by European Alliance for Innovation this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-01-19 with Technology & Engineering categories.
We are delighted to provide the proceedings of the sixth International Conference on Applied Engineering (ICAE), 2023, which was conducted in Batam on November 7th, 2023. This conference, which has as its theme "Synergizing Green Economy, Sustainable Development, and Digitalization for a Prosperous Future," is a significant international assembly that seeks to integrate technological innovation, economic expansion, and environmental sustainability. An ensemble of stakeholders, comprising policymakers, entrepreneurs, and experts, assembles to examine the mutually beneficial correlation that exists between digital advancements and a green economy. The acceptance rate for ICAE 2023 stands at 25%, leading to the selection of 28 substantial papers. The conference featured three distinct tracks: Informatics, Electronics, and Mechanicals. Two keynote addresses were delivered in conjunction with the outstanding technical paper presentations at the technical program. The keynote addresses were delivered by Dr. Ir. Basuki Rahmatul Alam, Chair of the IEEE EDS Indonesia Chapter and Senior Member of IEEE, and Dr. MK Radhakrishnan, Technical Consultant at NanoRel LLP in Singapore and Vice President of IEEE EDS. Coordination effectiveness with the steering committee was crucial to guaranteeing the conference's success. We wish to convey our profound gratitude for their consistent guidance and support that accompanied the entire undertaking. The ICAE Chair Committee deserves special recognition for their conscientiousness in finalizing the peer-review procedure of technical papers, which ultimately led to the creation of a technical program of exceptional quality. Furthermore, we would like to express our sincere appreciation to the Conference Managers and all the authors who submitted their papers for the ICAE 2023 conference for their invaluable assistance. Additionally, we appreciate the assistance of the EAI staff in facilitating the production of this publication.
Fundamentals Of Electromigration Aware Integrated Circuit Design
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Author : Jens Lienig
language : en
Publisher: Springer
Release Date : 2018-02-23
Fundamentals Of Electromigration Aware Integrated Circuit Design written by Jens Lienig and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-02-23 with Technology & Engineering categories.
The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
Electrostatic Discharge
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Author : Steven Voldman
language : en
Publisher: BoD – Books on Demand
Release Date : 2019-10-02
Electrostatic Discharge written by Steven Voldman and has been published by BoD – Books on Demand this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-10-02 with Science categories.
As we enter the nanoelectronics era, electrostatic discharge (ESD) phenomena is an important issue for everything from micro-electronics to nanostructures. This book provides insight into the operation and design of micro-gaps and nanogenerators with chapters on low capacitance ESD design in advanced technologies, electrical breakdown in micro-gaps, nanogenerators from ESD, and theoretical prediction and optimization of triboelectric nanogenerators. The information contained herein will prove useful for for engineers and scientists that have an interest in ESD physics and design.
Nanocrystals In Nonvolatile Memory
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Author : Writam Banerjee
language : en
Publisher: CRC Press
Release Date : 2018-10-09
Nanocrystals In Nonvolatile Memory written by Writam Banerjee and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-09 with Science categories.
In recent years, utilization of the abundant advantages of quantum physics, quantum dots, quantum wires, quantum wells, and nanocrystals has attracted considerable scientific attention in the field of nonvolatile memory. Nanocrystals are the driving element that have brought the nonvolatile flash memory technology to a distinguished height. However, new approaches are still required to strengthen this technology for future applications. This book details the methods of fabrication of nanocrystals and their application in baseline nonvolatile memory and emerging nonvolatile memory technologies. The chapters have been written by renowned experts of the field and will provide an in-depth understanding of these technologies. The book is a valuable tool for research and development sectors associated with electronics, semiconductors, nanotechnology, material sciences, solid state memories, and electronic devices.
Circadian Rhythms For Future Resilient Electronic Systems
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Author : Xinfei Guo
language : en
Publisher: Springer
Release Date : 2019-06-12
Circadian Rhythms For Future Resilient Electronic Systems written by Xinfei Guo and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-06-12 with Technology & Engineering categories.
This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware; Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow; Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems; Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both; Includes coverage of resilient aspects of emerging applications such as IoT.