32nd International Imaps Ieee Cpmt Poland Conference
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32nd International Imaps Ieee Cpmt Poland Conference
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Author : IMAPS.
language : en
Publisher:
Release Date : 2008
32nd International Imaps Ieee Cpmt Poland Conference written by IMAPS. and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with categories.
32nd International Imaps Ieee Cpmt Poland Conference Warszawa Pu Tusk 21 24 September 2008
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Author : International Microelectronics and Packaging Society Poland Chapter
language : en
Publisher:
Release Date : 2008
32nd International Imaps Ieee Cpmt Poland Conference Warszawa Pu Tusk 21 24 September 2008 written by International Microelectronics and Packaging Society Poland Chapter and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Electronic packaging categories.
Thirty Third International Conference Imaps Cpmt Ieee Poland
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Author : Piotr Kowalik
language : en
Publisher:
Release Date : 2009
Thirty Third International Conference Imaps Cpmt Ieee Poland written by Piotr Kowalik and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009 with Electronic packaging categories.
Xxxii International Conference Of Imaps Ieee Cpmt Poland Pu Tusk 21 24 September 2008
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Author :
language : en
Publisher:
Release Date : 2008
Xxxii International Conference Of Imaps Ieee Cpmt Poland Pu Tusk 21 24 September 2008 written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with categories.
Imaps Cpmt 2014 Poland
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Author : Agata Skwarek
language : en
Publisher:
Release Date : 2015-07-28
Imaps Cpmt 2014 Poland written by Agata Skwarek and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-07-28 with categories.
The 38th IMAPS-CPMT Poland International Conference was held in Rzeszów-Czarna and took place between the 21st and 24th September 2014. This event was organized by Rzeszów University of Technology. The scope of the Conference covered 'everything in electronics between the chip and the system'. In this special e-book of Circuit World, seven papers have been collected, covering the processes and procedures associated with interconnections and printed circuit boards and their design and manufacture.
Microwave Materials And Applications 2 Volume Set
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Author : Mailadil T. Sebastian
language : en
Publisher: John Wiley & Sons
Release Date : 2017-05-08
Microwave Materials And Applications 2 Volume Set written by Mailadil T. Sebastian and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-05-08 with Technology & Engineering categories.
The recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intelligent transport systems has increased the need for low-loss dielectric materials and modern fabrication techniques. These materials have excellent electrical, dielectric, and thermal properties and have enormous potential, especially in wireless communication, flexible electronics, and printed electronics. Microwave Materials and Applications discusses the methods commonly employed for measuring microwave dielectric properties, the various attempts reported to solve problems of materials chemistry and crystal structure, doping, substitution, and composite formation, highlighting the processing techniques, morphology influences, and applications of microwave materials whilst summarizing many of the recent technical research accomplishments in the area of microwave dielectrics and applications Chapters examine: Oxide ceramics for dielectric resonators and substrates HTCC, LTCC and ULTCC tapes for substrates Polymer ceramic composites for printed circuit boards Elastomer-ceramic composites for flexible electronics Dielectric inks EMI shielding materials Microwave ferrites A comprehensive Appendix presents the fundamental properties for more than 4000 low-loss dielectric ceramics, their composition, crystal structure, and their microwave dielectric properties. Microwave Materials and Applications presents a comprehensive view of all aspects of microwave materials and applications, making it useful for scientists, industrialists, engineers, and students working on current and emerging applications of wireless communications and consumer electronics.
Printed Films
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Author : Maria Prudenziati
language : en
Publisher: Elsevier
Release Date : 2012-08-30
Printed Films written by Maria Prudenziati and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-08-30 with Technology & Engineering categories.
Whilst printed films are currently used in varied devices across a wide range of fields, research into their development and properties is increasingly uncovering even greater potential. Printed films provides comprehensive coverage of the most significant recent developments in printed films and their applications.Materials and properties of printed films are the focus of part one, beginning with a review of the concepts, technologies and materials involved in their production and use. Printed films as electrical components and silicon metallization for solar cells are discussed, as are conduction mechanisms in printed film resistors, and thick films in packaging and microelectronics. Part two goes on to review the varied applications of printed films in devices. Printed resistive sensors are considered, as is the role of printed films in capacitive, piezoelectric and pyroelectric sensors, mechanical micro-systems and gas sensors. The applications of printed films in biosensors, actuators, heater elements, varistors and polymer solar cells are then explored, followed by a review of screen printing for the fabrication of solid oxide fuel cells and laser printed micro- and meso-scale power generating devices.With its distinguished editors and international team of expert contributors, Printed films is a key text for anyone working in such fields as microelectronics, fuel cell and sensor technology in both industry and academia. Provides a comprehensive analysis of the most significant recent developments in printed films and their applications Reviews the concepts, properties, technologies and materials involved in the production and use of printed films Analyses the varied applications of printed films in devices, including printed restrictive sensors for physical quantities and printed thick film mechanical micro-systems (MEMS), among others
International Conference Imaps Poland 2001 25
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Author : Jerzy Potencki
language : en
Publisher:
Release Date : 2001
International Conference Imaps Poland 2001 25 written by Jerzy Potencki and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with categories.
Przewodnik Bibliograficzny
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Author :
language : pl
Publisher:
Release Date : 2008
Przewodnik Bibliograficzny written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Poland categories.
More Than Moore 2 5d And 3d Sip Integration
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Author : Riko Radojcic
language : en
Publisher: Springer
Release Date : 2017-02-08
More Than Moore 2 5d And 3d Sip Integration written by Riko Radojcic and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-02-08 with Technology & Engineering categories.
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore’s Law regime. Technical tradeoffs, from architecture down to manufacturing processes, associated with the 2.5D and 3D integration technologies, as well as the business and product management considerations encountered when faced by disruptive technology options, are presented. Coverage includes a discussion of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and Outsourced Assembly and Test (OSAT) barriers to implementation of disruptive technology options. This book is a must-read for any IC product team that is considering getting off the Moore’s Law track, and leveraging some of the More-than-Moore technology options for their next microelectronic product.