A Scientific Guide To Surface Mount Technology

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A Scientific Guide To Surface Mount Technology

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Author : Colin Lea
language : en
Publisher:
Release Date : 1988

A Scientific Guide To Surface Mount Technology written by Colin Lea and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1988 with Technology & Engineering categories.

A Guide To Lead Free Solders

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Author : John W. Evans
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-01-05

A Guide To Lead Free Solders written by John W. Evans and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-01-05 with Technology & Engineering categories.

The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.

Smt Soldering Handbook

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Author : RUDOLF STRAUSS
language : en
Publisher: Elsevier
Release Date : 1998-02-24

Smt Soldering Handbook written by RUDOLF STRAUSS and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-02-24 with Technology & Engineering categories.

Surface Mount Technology has had a profound influence on the electronics industry, and has led to the use of new materials, techniques and manufacturing processes. Since the first edition of this book was written, electronic assemblies have continued to become still smaller and more complex, while soldering still remains the dominant connecting technique. This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology. It also covers component placement, the post-CFC technology of cleaning after soldering, and the principles and methods of quality control and rework. New sections deal with Ball-Grid-Array (BGA) technology, lead-free solders, no-clean fluxes, and the current standard specifications for solders and fluxes. Dr Rudolf Strauss has spent most of his working life with a leading manufacturer of solders and fluxes. He was responsible for a number of innovations including the concept of wave soldering, and for many years has been active as lecturer, consultant, and technical author. His book explains the principles of soldering and surface mount technology in practical terms and plain language, free from jargon. It is addressed to the man, or woman, who has to do the job, but it will also be of help in planning manufacturing strategy and in making purchasing decisions relating to consumables and equipment. - Written by founding father of SMT technology - Standard specifications have been fully updated - New chapter covering Ball Grid Array (BGA) technology

Reflow Soldering Processes

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Author : Ning-Cheng Lee
language : en
Publisher: Newnes
Release Date : 2002-01-11

Reflow Soldering Processes written by Ning-Cheng Lee and has been published by Newnes this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002-01-11 with Technology & Engineering categories.

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Electronic Failure Analysis Handbook

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Author : Perry L. Martin
language : en
Publisher: McGraw Hill Professional
Release Date : 1999

Electronic Failure Analysis Handbook written by Perry L. Martin and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Technology & Engineering categories.

Annotation "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance."--BOOK JACKET. Title Summary field provided by Blackwell North America, Inc. All Rights Reserved.

Soldering In Electronics Assembly

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Author : MIKE JUDD
language : en
Publisher: Elsevier
Release Date : 1999-03-26

Soldering In Electronics Assembly written by MIKE JUDD and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999-03-26 with Technology & Engineering categories.

Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. - A practical guide for the industry covering all the main soldering processes currently in use - Cleaning, faults, troubleshooting and standards are all major topics - Considers safety and solder process quality assessment

Newnes Electronics Assembly Handbook

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Author : Keith Brindley
language : en
Publisher: Elsevier
Release Date : 2016-06-30

Newnes Electronics Assembly Handbook written by Keith Brindley and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-06-30 with Technology & Engineering categories.

Newnes Electronics Assembly Handbook

Manual Soldering Guidebook

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Author : Ratan Sengupta
language : en
Publisher: Sankalp Publication
Release Date :

Manual Soldering Guidebook written by Ratan Sengupta and has been published by Sankalp Publication this book supported file pdf, txt, epub, kindle and other format this book has been release on with Education categories.

: This guide book has been prepared, based on my 35 + years’ experience on conducting training on Electronic PCB Assembly, both in the capacity of a Trainer and Consultant, solving assembly problems. I have realized that electronic manufacturing Industries, especially in MSME Sector, do not realize the fact that their system long term Reliability is a direct function of each Solder joint quality, and hence, a basic Induction training on soldering technique is absent from their HR Training Plan. Through this guide book, I have tried to share my experience with more than 300 Electronic Manufacturing Units in India, with a massage that if you wish to wish to produce Long Term Reliable System to your clients, please do not forget to emphasis on basic Manual Soldering. This book contains: 1. SOLDERING: INTRODUCTION AND BASIC THEORIES 2. SOLDERING MATERIALS (SOLDER, FLUX, CLEANING SOLVENT) 3. SOLDERING TOOLS 4. SOLDERING IRON & SOLDERING BITS 4. SAFETY PRECAUTIONS BEFORE STARTING SOLDERING PROCESS 6. STEP BY STEP SOLDERING PROCESS Part I: Through hole Component Part II: Surface Mount Devises 7.PWA INSPECTION TOOLS& EQUIPMENT 8. COMMON MANNUAL SOLDER JOINT DEFECTS & THEIR PREVENTION Annex-A: LEAD FREE SOLDERING Annex- B: BIBLOGRAPHY The book all also cover the Manual Soldering competitions, arranged by different Industry Association, like IPC.

The Electronic Packaging Handbook

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Author : Glenn R. Blackwell
language : en
Publisher: CRC Press
Release Date : 2017-12-19

The Electronic Packaging Handbook written by Glenn R. Blackwell and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.

The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.

The Electrical Engineering Handbook Second Edition

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Author : Richard C. Dorf
language : en
Publisher: CRC Press
Release Date : 1997-09-26

The Electrical Engineering Handbook Second Edition written by Richard C. Dorf and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-09-26 with Technology & Engineering categories.

In 1993, the first edition of The Electrical Engineering Handbook set a new standard for breadth and depth of coverage in an engineering reference work. Now, this classic has been substantially revised and updated to include the latest information on all the important topics in electrical engineering today. Every electrical engineer should have an opportunity to expand his expertise with this definitive guide. In a single volume, this handbook provides a complete reference to answer the questions encountered by practicing engineers in industry, government, or academia. This well-organized book is divided into 12 major sections that encompass the entire field of electrical engineering, including circuits, signal processing, electronics, electromagnetics, electrical effects and devices, and energy, and the emerging trends in the fields of communications, digital devices, computer engineering, systems, and biomedical engineering. A compendium of physical, chemical, material, and mathematical data completes this comprehensive resource. Every major topic is thoroughly covered and every important concept is defined, described, and illustrated. Conceptually challenging but carefully explained articles are equally valuable to the practicing engineer, researchers, and students. A distinguished advisory board and contributors including many of the leading authors, professors, and researchers in the field today assist noted author and professor Richard Dorf in offering complete coverage of this rapidly expanding field. No other single volume available today offers this combination of broad coverage and depth of exploration of the topics. The Electrical Engineering Handbook will be an invaluable resource for electrical engineers for years to come.