Advanced Fabrication Techniques For Designing Nanoscale Mosfet
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Advanced Fabrication Techniques For Designing Nanoscale Mosfet
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Author : Suei Huey Wong
language : en
Publisher:
Release Date : 2007
Advanced Fabrication Techniques For Designing Nanoscale Mosfet written by Suei Huey Wong and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Metal oxide semiconductor field-effect transistors categories.
Advanced Nanoscale Mosfet Architectures
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Author : Kalyan Biswas
language : en
Publisher: John Wiley & Sons
Release Date : 2024-07-03
Advanced Nanoscale Mosfet Architectures written by Kalyan Biswas and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-07-03 with Technology & Engineering categories.
Comprehensive reference on the fundamental principles and basic physics dictating metal–oxide–semiconductor field-effect transistor (MOSFET) operation Advanced Nanoscale MOSFET Architectures provides an in-depth review of modern metal–oxide–semiconductor field-effect transistor (MOSFET) device technologies and advancements, with information on their operation, various architectures, fabrication, materials, modeling and simulation methods, circuit applications, and other aspects related to nanoscale MOSFET technology. The text begins with an introduction to the foundational technology before moving on to describe challenges associated with the scaling of nanoscale devices. Other topics covered include device physics and operation, strain engineering for highly scaled MOSFETs, tunnel FET, graphene based field effect transistors, and more. The text also compares silicon bulk and devices, nanosheet transistors and introduces low-power circuit design using advanced MOSFETs. Additional topics covered include: High-k gate dielectrics and metal gate electrodes for multi-gate MOSFETs, covering gate stack processing and metal gate modification Strain engineering in 3D complementary metal-oxide semiconductors (CMOS) and its scaling impact, and strain engineering in silicon–germanium (SiGe) FinFET and its challenges and future perspectives TCAD simulation of multi-gate MOSFET, covering model calibration and device performance for analog and RF applications Description of the design of an analog amplifier circuit using digital CMOS technology of SCL for ultra-low power VLSI applications Advanced Nanoscale MOSFET Architectures helps readers understand device physics and design of new structures and material compositions, making it an important resource for the researchers and professionals who are carrying out research in the field, along with students in related programs of study.
Regular Nanofabrics In Emerging Technologies
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Author : M. Haykel Ben Jamaa
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-03-24
Regular Nanofabrics In Emerging Technologies written by M. Haykel Ben Jamaa and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-03-24 with Technology & Engineering categories.
Regular Nanofabrics in Emerging Technologies gives a deep insight into both fabrication and design aspects of emerging semiconductor technologies, that represent potential candidates for the post-CMOS era. Its approach is unique, across different fields, and it offers a synergetic view for a public of different communities ranging from technologists, to circuit designers, and computer scientists. The book presents two technologies as potential candidates for future semiconductor devices and systems and it shows how fabrication issues can be addressed at the design level and vice versa. The reader either for academic or research purposes will find novel material that is explained carefully for both experts and non-initiated readers. Regular Nanofabrics in Emerging Technologies is a survey of post-CMOS technologies. It explains processing, circuit and system level design for people with various backgrounds.
Strain Engineered Mosfets
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Author : C.K. Maiti
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Strain Engineered Mosfets written by C.K. Maiti and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
Currently strain engineering is the main technique used to enhance the performance of advanced silicon-based metal-oxide-semiconductor field-effect transistors (MOSFETs). Written from an engineering application standpoint, Strain-Engineered MOSFETs introduces promising strain techniques to fabricate strain-engineered MOSFETs and to methods to assess the applications of these techniques. The book provides the background and physical insight needed to understand new and future developments in the modeling and design of n- and p-MOSFETs at nanoscale. This book focuses on recent developments in strain-engineered MOSFETS implemented in high-mobility substrates such as, Ge, SiGe, strained-Si, ultrathin germanium-on-insulator platforms, combined with high-k insulators and metal-gate. It covers the materials aspects, principles, and design of advanced devices, fabrication, and applications. It also presents a full technology computer aided design (TCAD) methodology for strain-engineering in Si-CMOS technology involving data flow from process simulation to process variability simulation via device simulation and generation of SPICE process compact models for manufacturing for yield optimization. Microelectronics fabrication is facing serious challenges due to the introduction of new materials in manufacturing and fundamental limitations of nanoscale devices that result in increasing unpredictability in the characteristics of the devices. The down scaling of CMOS technologies has brought about the increased variability of key parameters affecting the performance of integrated circuits. This book provides a single text that combines coverage of the strain-engineered MOSFETS and their modeling using TCAD, making it a tool for process technology development and the design of strain-engineered MOSFETs.
Nanoscale Bulk Mosfet Design And Process Technology For Reduced Variability
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Author : Xin Sun
language : en
Publisher:
Release Date : 2010
Nanoscale Bulk Mosfet Design And Process Technology For Reduced Variability written by Xin Sun and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with categories.
Nanoelectronic Circuit Design
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Author : Niraj K. Jha
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-12-21
Nanoelectronic Circuit Design written by Niraj K. Jha and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-12-21 with Technology & Engineering categories.
This book is about large-scale electronic circuits design driven by nanotechnology, where nanotechnology is broadly defined as building circuits using nanoscale devices that are either implemented with nanomaterials (e.g., nanotubes or nanowires) or following an unconventional method (e.g., FinFET or III/V compound-based devices). These nanoscale devices have significant potential to revolutionize the fabrication and integration of electronic systems and scale beyond the perceived scaling limitations of traditional CMOS. While innovations in nanotechnology originate at the individual device level, realizing the true impact of electronic systems demands that these device-level capabilities be translated into system-level benefits. This is the first book to focus on nanoscale circuits and their design issues, bridging the existing gap between nanodevice research and nanosystem design.
Novel Nanoscale Mosfet With Tcad
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Author : Intekhab Amin
language : de
Publisher: LAP Lambert Academic Publishing
Release Date : 2012-08
Novel Nanoscale Mosfet With Tcad written by Intekhab Amin and has been published by LAP Lambert Academic Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-08 with categories.
Scaling of MOSFET is being carried out through several dcades and we moved from micron to nano scale region. Scaling improves performance but at the same time it has some adverse effect, because as MOSFET is scaled down the source and drain come so close to each other so that the gate is loosing control over the channel is called short channel effect. Here work have been carried by doing engineering fabrication technique to reduce its SCE under 40nm channel length of an engineered device and is compared the non engineered device of having same technology to have better short channel immunity of an engineered device as compared to that of non engineered device. Since scaling means scaling of its supply voltage also if not then electric field will become a severe factor creates impact ionization and hence its performance by creating electron-holes pair so supply voltage has to be scaled down to reduce peak electric field.Its high frequency small signal analysis is also carried and compared.
Innovative Applications Of Nanowires For Circuit Design
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Author : Raj, Balwinder
language : en
Publisher: IGI Global
Release Date : 2020-11-20
Innovative Applications Of Nanowires For Circuit Design written by Raj, Balwinder and has been published by IGI Global this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-11-20 with Technology & Engineering categories.
Nanowires are an important sector of circuit design whose applications in very-large-scale integration design (VLSI) have huge impacts for bringing revolutionary advancements in nanoscale devices, circuits, and systems due to improved electronic properties of the nanowires. Nanowires are potential devices for VLSI circuits and system applications and are highly preferred in novel nanoscale devices due to their high mobility and high-driving capacity. Although the knowledge and resources for the fabrication of nanowires is currently limited, it is predicted that, with the advancement of technology, conventional fabrication flow can be used for nanoscale devices, specifically nanowires. Innovative Applications of Nanowires for Circuit Design provides relevant theoretical frameworks that include device physics, modeling, circuit design, and the latest developments in experimental fabrication in the field of nanotechnology. The book covers advanced modeling concepts of nanowires along with their role as a key enabler for innovation in GLSI devices, circuits, and systems. While highlighting topics such as design, simulation, types and applications, and performance analysis of nanowires, this book is ideally intended for engineers, practitioners, stakeholders, academicians, researchers, and students interested in electronics engineering, nanoscience, and nanotechnology.
Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications
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Author : Yosi Shacham-Diamand
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-09-19
Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications written by Yosi Shacham-Diamand and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-09-19 with Science categories.
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Advanced Mosfet Structures And Processes For Sub 7 Nm Cmos Technologies
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Author : Peng Zheng
language : en
Publisher:
Release Date : 2016
Advanced Mosfet Structures And Processes For Sub 7 Nm Cmos Technologies written by Peng Zheng and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016 with categories.
The remarkable proliferation of information and communication technology (ICT) - which has had dramatic economic and social impact in our society - has been enabled by the steady advancement of integrated circuit (IC) technology following Moore's Law, which states that the number of components (transistors) on an IC "chip" doubles every two years. Increasing the number of transistors on a chip provides for lower manufacturing cost per component and improved system performance. The virtuous cycle of IC technology advancement (higher transistor density -> lower cost / better performance -> semiconductor market growth -> technology advancement -> higher transistor density etc.) has been sustained for 50 years. Semiconductor industry experts predict that the pace of increasing transistor density will slow down dramatically in the sub-20 nm (minimum half-pitch) regime. Innovations in transistor design and fabrication processes are needed to address this issue. The FinFET structure has been widely adopted at the 14/16 nm generation of CMOS technology. Gate-all-around (GAA) FETs are anticipated to be adopted in future generations, to enable ultimate gate-length scaling. This work firstly benchmarks the performance of GAA MOSFETs against that of the FinFETs at 10 nm gate length (anticipated for 4/3 nm CMOS technology). Variability in transistor performance due to systematic and random variations is estimated with the aid of technology computer-aided design (TCAD) three-dimensional (3-D) device simulations, for both device structures. The yield of six-transistor (6-T) SRAM cells implemented with these advanced MOSFET structures is then investigated via a calibrated physically based compact model. The benefits of GAA MOSFET technology for lowering the minimum operating voltage (Vmin) and area of 6-T SRAM cells to facilitate increased transistor density following Moore's Law are assessed. In order to achieve similar (or even better) layout area efficiency as a FinFET, a GAA FET must comprise stacked nanowires (NWs), which would add significant fabrication process complexity. This is because stacked NWs are formed by epitaxial growth of relatively thick (>10 nm) Si1-xGex sacrificial layers between Si channel layers to accommodate gate-dielectric/gate-metal/gate-dielectric layers in-between the NWs, so that fin structures with very high aspect ratio (>10:1 height:width) must be etched prior to selective removal of the Si1-xGex layers. Also, it will be more difficult to implement multiple gate-oxide thicknesses with GAA FET technology for system-on-chip (SoC) applications. In this work, a novel stacked MOSFET design, the inserted-oxide FinFET (iFinFET), is proposed to mitigate these issues. With enhanced performance due to improved electrostatic integrity and minimal added process complexity, iFinFET provides a pathway for future CMOS technology scaling. Advancements in lithography have been key to sustaining Moore's Law. Due to the low transmittance of blank mask materials and/or the availability of high-intensity light sources for wavelengths shorter than 193 nm, the semiconductor industry has resorted to "multiple-patterning" techniques to increase the density of linear features patterned on a chip. The additional cost due to extra lithography or deposition and etch processes associated with multiple-patterning techniques threaten to bring Moore's Law to an end, stunting the growth of the entire ICT industry. This work proposes an innovative cost-efficient patterning method via tilted ion implantation (TII) for achieving sub-lithographic features and/or doubling the density of features, one that is capable of achieving arbitrarily small feature size, self-aligned to pre-existing features on the surface. The proposed technique can be used to pattern IC layers in both front-end-of-line (FEOL) and low-temperature back-end-of-line (BEOL) processes. With feature size below 10 nm experimentally demonstrated, TII-enhanced patterning offers a cost-effective pathway to extend the era of Moore's Law. The primary reason for increasing the number of components per IC, enabled by advancement of IC manufacturing technology, was (and still) is lower cost. Although different opinions are held throughout industry regarding the "cost-per-transistor" trend, reduction in IC manufacturing cost is the key challenge as technology advances to extend Moore's Law. This work summarizes a survey regarding IC manufacturing cost throughout the semiconductor industry. Two case studies reveal that the iFinFET technology and TII double patterning technique have significant economic merit in future technology nodes, especially beyond the 7 nm technology node where the industry does not yet have clear solutions. The proposed technologies can enable the semiconductor industry to extend the era of Moore's Law, with broad economic and social benefit to society.