Advanced Metallization Conference In 1998 Amc 1998 Volume 14

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Advanced Metallization Conference In 1998 Amc 1998 Volume 14
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Author : Gurtej S. Sandhu
language : en
Publisher: Materials Research Society
Release Date : 2000-02-01
Advanced Metallization Conference In 1998 Amc 1998 Volume 14 written by Gurtej S. Sandhu and has been published by Materials Research Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-02-01 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Advanced Metallization Conference 1999 Amc 1999 Volume 15
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Author : Mihal E. Gross
language : en
Publisher:
Release Date : 2000
Advanced Metallization Conference 1999 Amc 1999 Volume 15 written by Mihal E. Gross and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Technology & Engineering categories.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Probing Crystal Plasticity At The Nanoscales
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Author : Arief Suriadi Budiman
language : en
Publisher: Springer
Release Date : 2014-12-27
Probing Crystal Plasticity At The Nanoscales written by Arief Suriadi Budiman and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-12-27 with Technology & Engineering categories.
This Brief highlights the search for strain gradients and geometrically necessary dislocations as a possible source of strength for two cases of deformation of materials at small scales: nanoindented single crystal copper and uniaxially compressed single crystal submicron gold pillars. When crystalline materials are mechanically deformed in small volumes, higher stresses are needed for plastic flow. This has been called the "Smaller is Stronger" phenomenon and has been widely observed. studies suggest that plasticity in one case is indeed controlled by the GNDs (strain gradient hardening), whereas in the other, plasticity is not controlled by strain gradients or sub-structure hardening, but rather by dislocation source starvation, wherein smaller volumes are stronger because fewer sources of dislocations are available (dislocation starvation hardening).
Index Of Conference Proceedings
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Author : British Library. Document Supply Centre
language : en
Publisher:
Release Date : 2003
Index Of Conference Proceedings written by British Library. Document Supply Centre and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Conference proceedings categories.
Advanced Metallization Conference In
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Author :
language : en
Publisher:
Release Date : 2007
Advanced Metallization Conference In written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Integrated circuits categories.
Tribology In Chemical Mechanical Planarization
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Author : Hong Liang
language : en
Publisher: CRC Press
Release Date : 2005-03-01
Tribology In Chemical Mechanical Planarization written by Hong Liang and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-03-01 with Technology & Engineering categories.
Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology.
Design Rules In A Semiconductor Foundry
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Author : Eitan N. Shauly
language : en
Publisher: CRC Press
Release Date : 2022-11-30
Design Rules In A Semiconductor Foundry written by Eitan N. Shauly and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-11-30 with Technology & Engineering categories.
Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.
Semiconductor Wafer Bonding Vii Science Technology And Applications
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Author :
language : en
Publisher: The Electrochemical Society
Release Date : 2003
Semiconductor Wafer Bonding Vii Science Technology And Applications written by and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Technology & Engineering categories.
Thin Film Materials Processes And Reliability
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Author : G. S. Mathad
language : en
Publisher: The Electrochemical Society
Release Date : 2003
Thin Film Materials Processes And Reliability written by G. S. Mathad and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Technology & Engineering categories.
Semiconductor Wafer Bonding
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Author : H. Baumgart
language : en
Publisher: The Electrochemical Society
Release Date : 2002
Semiconductor Wafer Bonding written by H. Baumgart and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Technology & Engineering categories.