Advanced Thermal Design Of Electronic Equipment
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Advanced Thermal Design Of Electronic Equipment
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Author : Ralph Remsburg
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-06-27
Advanced Thermal Design Of Electronic Equipment written by Ralph Remsburg and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-06-27 with Technology & Engineering categories.
The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli cation of advanced thermal management techniques requires a background in fluid dynamics.
Thermal Design Of Electronic Equipment
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Author : Ralph Remsburg
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Thermal Design Of Electronic Equipment written by Ralph Remsburg and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Advanced Materials For Thermal Management Of Electronic Packaging
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Author : Xingcun Colin Tong
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-01-05
Advanced Materials For Thermal Management Of Electronic Packaging written by Xingcun Colin Tong and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-01-05 with Technology & Engineering categories.
The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Heat Transfer
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Author : Younes Shabany
language : en
Publisher: CRC Press
Release Date : 2009-12-17
Heat Transfer written by Younes Shabany and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-12-17 with Science categories.
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Air Cooling Technology For Electronic Equipment
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Author : Sung Jin Kim
language : en
Publisher: CRC Press
Release Date : 2020-07-24
Air Cooling Technology For Electronic Equipment written by Sung Jin Kim and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-07-24 with Technology & Engineering categories.
Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
The Thermal Design Of High Temperature Electronic Parts And Equipments
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Author : John B. Coleman
language : en
Publisher:
Release Date : 1959
The Thermal Design Of High Temperature Electronic Parts And Equipments written by John B. Coleman and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1959 with Electronic apparatus and appliances categories.
Thermal Management Of Microelectronic Equipment
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Author : Lian-Tuu Yeh
language : en
Publisher: American Society of Mechanical Engineers
Release Date : 2002
Thermal Management Of Microelectronic Equipment written by Lian-Tuu Yeh and has been published by American Society of Mechanical Engineers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Science categories.
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
Design Manual Of Natural Methods Of Cooling Electronic Equipment
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Author : James P. Welsh
language : en
Publisher:
Release Date : 1962
Design Manual Of Natural Methods Of Cooling Electronic Equipment written by James P. Welsh and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1962 with Airplanes categories.
Advances In Thermal Modeling Of Electronic Components And Systems
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Author : Avram Bar Cohen
language : en
Publisher: Advances in Thermal Modeling o
Release Date : 1997-12-31
Advances In Thermal Modeling Of Electronic Components And Systems written by Avram Bar Cohen and has been published by Advances in Thermal Modeling o this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997-12-31 with Technology & Engineering categories.
This volume of the series focuses on air cooling technology. Begins with a review of techniques used in thermal analysis of natural convection electronic systems, and continues with the presentation of a methodology for thermal modeling of air cooled components mounted on printed circuit boards. Gov
Thermal Computations For Electronic Equipment
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Author : Gordon N. Ellison
language : en
Publisher:
Release Date : 1989
Thermal Computations For Electronic Equipment written by Gordon N. Ellison and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with Science categories.