Apm Microtech

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Apm Microtech

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Author :
language : en
Publisher:
Release Date : 2010

Apm Microtech written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with Electronic packaging categories.

Materials For Advanced Packaging

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Author : Daniel Lu
language : en
Publisher: Springer
Release Date : 2016-11-18

Materials For Advanced Packaging written by Daniel Lu and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-18 with Technology & Engineering categories.

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Adhesion In Microelectronics

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Author : K. L. Mittal
language : en
Publisher: John Wiley & Sons
Release Date : 2014-08-25

Adhesion In Microelectronics written by K. L. Mittal and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-08-25 with Technology & Engineering categories.

This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings

Lead Free Solders

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Author : K. Subramanian
language : en
Publisher: John Wiley & Sons
Release Date : 2012-03-06

Lead Free Solders written by K. Subramanian and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-03-06 with Technology & Engineering categories.

Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers: Phase diagrams and alloy development Effect of minor alloying additions Composite approaches including nanoscale reinforcements Mechanical issues affecting reliability Reliability under impact loading Thermomechanical fatigue Chemical issues affecting reliability Whisker growth Electromigration Thermomigration Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.

Concise Encyclopedia Of High Performance Silicones

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Author : Atul Tiwari
language : en
Publisher: John Wiley & Sons
Release Date : 2014-04-03

Concise Encyclopedia Of High Performance Silicones written by Atul Tiwari and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-04-03 with Technology & Engineering categories.

The encyclopedia will be an invaluable source of information for researchers and students from diverse backgrounds including physics, chemistry, materials science and surface engineering, biotechnology, pharmacy, medical science, and biomedical engineering.

Diffusion And Defect Data

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Author :
language : en
Publisher:
Release Date : 2001

Diffusion And Defect Data written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Crystals categories.

Components And Sub Assemblies

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Author : C.G. Wedgwood
language : en
Publisher: Elsevier
Release Date : 2013-10-22

Components And Sub Assemblies written by C.G. Wedgwood and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-22 with Technology & Engineering categories.

Please note this is a Short Discount publication. Access both contact and company information on all 4950 European manufacturers, distributors and agents for 550 electronics components and sub–assembly product classifications throughout West and East Europe in one comprehensive Volume. Applications: • Sourcing of specific product types through local distributors or manufacturers • Location of new regional channels of distribution or identification of new European business partners • Competitor tracking • Sales lead generation Entries include: • Key names executives • Full address, telephone and fax details • Size indications including number of employees • Products • Manufacturers represented and agency status