Adhesion In Microelectronics
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Adhesion In Microelectronics
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Author : K. L. Mittal
language : en
Publisher: John Wiley & Sons
Release Date : 2014-08-25
Adhesion In Microelectronics written by K. L. Mittal and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-08-25 with Technology & Engineering categories.
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings
Adhesives Technology For Electronic Applications
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Author : James J. Licari
language : en
Publisher: William Andrew
Release Date : 2011-06-24
Adhesives Technology For Electronic Applications written by James J. Licari and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-06-24 with Technology & Engineering categories.
Approx.512 pages Approx.512 pages
Ire Bonding In Microelectronics
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Author : George G. Harman
language : en
Publisher: McGraw Hill Professional
Release Date : 1997
Ire Bonding In Microelectronics written by George G. Harman and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Technology & Engineering categories.
The first edition of this work is considered a classic reference in the field. This new edition updates the entire work and adds 100 pages of information covering new materials and techniques such as fine pitch
Wire Bonding In Microelectronics
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Author : George Harman
language : en
Publisher: McGraw Hill Professional
Release Date : 2009-06-05
Wire Bonding In Microelectronics written by George Harman and has been published by McGraw Hill Professional this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-06-05 with Technology & Engineering categories.
The Industry Standard Guide to Wire Bonding--Fully Updated The definitive resource on the critical process of connecting semiconductors with their packages, Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today's small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you'll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more. COVERAGE INCLUDES: Ultrasonic bonding systems and technologies, including high-frequency systems Bonding wire metallurgy and characteristics, including copper wire Wire bond testing Gold-aluminum intermetallic compounds and other interface reactions Gold and nickel-based bond pad plating materials and problems Cleaning to improve bondability and reliability Mechanical problems in wire bonding High-yield, fifine-pitch, specialized-looping, soft-substrate, and extremetemperature wire bonds Copper, low-dielectric-constant (Cu/Lo-k) technology and problems Wire bonding process modeling and simulation CD includes all the book's full-color figures plus animations
Reliability And Yield Problems Of Wire Bonding In Microelectronics
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Author : George G. Harman
language : en
Publisher: International Society of Hybrid
Release Date : 1989-01-01
Reliability And Yield Problems Of Wire Bonding In Microelectronics written by George G. Harman and has been published by International Society of Hybrid this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989-01-01 with Technology & Engineering categories.
Adhesive Bonding In Photonics Assembly And Packaging
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Author : B. G. Yacobi
language : en
Publisher: American Scientific Publishers
Release Date : 2003
Adhesive Bonding In Photonics Assembly And Packaging written by B. G. Yacobi and has been published by American Scientific Publishers this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Technology & Engineering categories.
Interfacial Compatibility In Microelectronics
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Author : Tomi Laurila
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-01-10
Interfacial Compatibility In Microelectronics written by Tomi Laurila and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-01-10 with Technology & Engineering categories.
Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.
Adhesive Bonding In Photonic Assembly And Packaging
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Author :
language : en
Publisher:
Release Date : 2003-01-01
Adhesive Bonding In Photonic Assembly And Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-01-01 with Technology & Engineering categories.
Adhesive Bonding in Photonics Assembly and Packaging deals with basic principles and the most up to date technology of adhesive bonding used for photonics assembly and packaging. Adhesive bonding is extensively employed in a wide variety of applications in microelectronics and photonics assemblies and packaging, manufacturing of optoelectronic and fiber-optic components, and of medical devices. For such a wide variety of applications, it is important to identify and develop compatible and reliable adhesive bonding techniques targeting specific applications. Photocuring of adhesives is becoming one of the most preferred methods due to the advantages related to the capabilities of instant cure, cure-on-demand, increased production speed, and ease of automation. It is critical to understand the adhesion, optical, thermal, mechanical and chemical properties of such adhesives. The main objective of this book is to provide a complete coverage of adhesive bonding used in photonics assembly and packaging.
Advanced Adhesives In Electronics
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Author : M O Alam
language : en
Publisher: Elsevier
Release Date : 2011-05-25
Advanced Adhesives In Electronics written by M O Alam and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-05-25 with Technology & Engineering categories.
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
Bonding In Microsystem Technology
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Author : Jan A. Dziuban
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-01-30
Bonding In Microsystem Technology written by Jan A. Dziuban and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-01-30 with Science categories.
This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.