Die Attach Materials For High Temperature Applications In Microelectronics Packaging
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Die Attach Materials For High Temperature Applications In Microelectronics Packaging
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Author : Kim S. Siow
language : en
Publisher:
Release Date : 2019
Die Attach Materials For High Temperature Applications In Microelectronics Packaging written by Kim S. Siow and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019 with Microelectronic packaging categories.
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys.
Die Attach Materials For High Temperature Applications In Microelectronics Packaging
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Author : Kim S. Siow
language : en
Publisher: Springer
Release Date : 2019-01-29
Die Attach Materials For High Temperature Applications In Microelectronics Packaging written by Kim S. Siow and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-01-29 with Technology & Engineering categories.
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Organic And Inorganic Light Emitting Diodes
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Author : T.D. Subash
language : en
Publisher: CRC Press
Release Date : 2023-06-19
Organic And Inorganic Light Emitting Diodes written by T.D. Subash and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-06-19 with Science categories.
This book covers a comprehensive range of topics on the physical mechanisms of LEDs (light emitting diodes), scattering effects, challenges in fabrication and efficient enhancement techniques in organic and inorganic LEDs. It deals with various reliability issues in organic/inorganic LEDs like trapping and scattering effects, packaging failures, efficiency droops, irradiation effects, thermal degradation mechanisms, and thermal degradation processes. Features: Provides insights into the improvement of performance and reliability of LEDs Highlights the optical power improvement mechanisms in LEDs Covers the challenges in fabrication and packaging of LEDs Discusses pertinent failures and degradation mechanisms Includes droop minimization techniques This book is aimed at researchers and graduate students in LEDs, illumination engineering, optoelectronics, and polymer/organic materials.
Harsh Environment Electronics
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Author : Ahmed Sharif
language : en
Publisher: John Wiley & Sons
Release Date : 2019-03-19
Harsh Environment Electronics written by Ahmed Sharif and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-03-19 with Technology & Engineering categories.
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
Rf And Microwave Microelectronics Packaging Ii
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Author : Ken Kuang
language : en
Publisher: Springer
Release Date : 2017-03-09
Rf And Microwave Microelectronics Packaging Ii written by Ken Kuang and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-03-09 with Technology & Engineering categories.
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Advances In Manufacturing Engineering
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Author : Seyed Sattar Emamian
language : en
Publisher: Springer Nature
Release Date : 2020-08-31
Advances In Manufacturing Engineering written by Seyed Sattar Emamian and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-08-31 with Technology & Engineering categories.
This book presents selected papers from the 5th International Conference on Mechanical, Manufacturing and Plant Engineering (ICMMPE 2019), held in Kuala Lumpur, Malaysia. It highlights the latest advances in the area, brings together researchers and professionals in the field and provides a valuable platform for exchanging ideas and fostering collaboration. Joining technologies could be change to manufacturing technologies. Addressing real-world problems concerning joining technologies that are at the heart of various manufacturing sectors, the respective papers present the outcomes of the latest experimental and numerical work on problems in soldering, arc welding and solid-state joining technologies. technologies. technologies. technologies. technologies. technologies. technologies. technologies. technologies. technologies. technologies.
Thermal Stress And Strain In Microelectronics Packaging
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Author : John Lau
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Thermal Stress And Strain In Microelectronics Packaging written by John Lau and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
High Temperature Electronics
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Author : F. Patrick McCluskey
language : en
Publisher: CRC Press
Release Date : 1996-12-13
High Temperature Electronics written by F. Patrick McCluskey and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-12-13 with Technology & Engineering categories.
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Advanced Driver Assistance Systems And Autonomous Vehicles
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Author : Yan Li
language : en
Publisher: Springer Nature
Release Date : 2022-10-28
Advanced Driver Assistance Systems And Autonomous Vehicles written by Yan Li and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-10-28 with Technology & Engineering categories.
This book provides a comprehensive reference for both academia and industry on the fundamentals, technology details, and applications of Advanced Driver-Assistance Systems (ADAS) and autonomous driving, an emerging and rapidly growing area. The book written by experts covers the most recent research results and industry progress in the following areas: ADAS system design and test methodologies, advanced materials, modern automotive technologies, artificial intelligence, reliability concerns, and failure analysis in ADAS. Numerous images, tables, and didactic schematics are included throughout. This essential book equips readers with an in-depth understanding of all aspects of ADAS, providing insights into key areas for future research and development. • Provides comprehensive coverage of the state-of-the-art in ADAS • Covers advanced materials, deep learning, quality and reliability concerns, and fault isolation and failure analysis • Discusses ADAS system design and test methodologies, novel automotive technologies • Features contributions from both academic and industry authors, for a complete view of this important technology
Advanced Electronic Packaging
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Author : Richard K. Ulrich
language : en
Publisher: John Wiley & Sons
Release Date : 2006-02-24
Advanced Electronic Packaging written by Richard K. Ulrich and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-02-24 with Technology & Engineering categories.
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.