Mechanics Of Microelectronics
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Mechanics Of Microelectronics
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Author : G. Q. Zhang
language : en
Publisher:
Release Date : 2006
Mechanics Of Microelectronics written by G. Q. Zhang and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with categories.
Mechanics Of Microelectronics
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Author : G.Q. Zhang
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-08-25
Mechanics Of Microelectronics written by G.Q. Zhang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-08-25 with Technology & Engineering categories.
This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture
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Author : E-H Wong
language : en
Publisher: Woodhead Publishing
Release Date : 2015-05-23
Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture written by E-H Wong and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-05-23 with Technology & Engineering categories.
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study
Benefiting From Thermal And Mechanical Simulation In Micro Electronics
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Author : G.Q. Zhang
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-06-29
Benefiting From Thermal And Mechanical Simulation In Micro Electronics written by G.Q. Zhang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-06-29 with Technology & Engineering categories.
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro-electronics; the state-of-the-art methodologies for thermal & mechanical simulation and optimization of micro-electronics; and the perspectives of future simulation and optimization methodology development. Main areas covered are:- LIST type="5" The impact of simulation on industry profitability Approaches to simulation The state-of-the-art methodologies of simulation Design optimization by simulation £/LIST£ Benefiting from Thermal and Mechanical Simulation in Micro-Electronics is suitable for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
Mechanics Of Microelectronics
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Author : G.Q. Zhang
language : en
Publisher: Springer
Release Date : 2006-06-23
Mechanics Of Microelectronics written by G.Q. Zhang and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-06-23 with Technology & Engineering categories.
This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Mechanical Behavior Of Materials In Microelectronic And Fiber Optic Systems
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Author : American Society of Mechanical Engineers. Winter Annual Meeting
language : en
Publisher:
Release Date : 1989
Mechanical Behavior Of Materials In Microelectronic And Fiber Optic Systems written by American Society of Mechanical Engineers. Winter Annual Meeting and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with Finite element method categories.
The overwhelming majority of studies in microelectronics and fiber-optics are experimental. Not too many apply numerical, mainly finite-element, methods to analyze microelectronics and fiber-optic structures. There is a very small number of papers using analytical modeling. At the same time application of powerful and well-developed analytical methods of engineering mechanics often enables one to obtain valuable prior information of the mechanical behavior of materials and structures, to interpret empirical data, and to extrapolate the accumulated experience on new designs. As a rule, application of rational analytical modeling results in substantial savings of time and expense. The review, based primarily on materials science problems related to the mechanical behavior of materials in microelectronics and fiber-optics, and lending themselves to analytical solutions.
How Do Mechanics And Thermo Mechanics Affect Microelectronic Products
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Author : Vincent Fiori
language : en
Publisher:
Release Date : 2010
How Do Mechanics And Thermo Mechanics Affect Microelectronic Products written by Vincent Fiori and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with categories.
The work reported here aims to provide to the reader some features on several items related to the microelectronic industry. The content is built in order to, even for non expert of the semiconductor fields, allow a comprehensive understanding of the technology development problematic. Its range from general considerations, to applications and researches on mechanical challenges. These later have been investigated in the last few years within STMicroelectronics. Hence, starting from a general description of the microelectronic device market, the main processes of chip manufacturing are depicted. Then, focus is put on mechanical and thermo mechanical phenomena occurring during manufacturing and qualification tests. Challenges of such mechanisms are presented, and the need for a deep understanding of the physics is highlighted. Requirements for numerical tools, and the industrial context, are justified underlining the need for smart compromises. Specific numerical methods have been developed, implemented and tested. Results have been faced to experimental results for correlation purposes, allowing additional insights and virtual prototyping. This work proposes, trough a selection of applications, to briefly show results on FEoL, BEoL and packaging features of the device. Extracted from team publications, typical examples of strain engineering and fracture mechanics investigations are presented. Their added values are highlighted. This thesis would help people to get familiar with some methods to deal on mechanical and thermo mechanical topics in a technology development framework of the microelectronic industry.
Structural Analysis In Microelectronic And Fiber Optic Systems
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Author : Ephraim Suhir
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Structural Analysis In Microelectronic And Fiber Optic Systems written by Ephraim Suhir and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Science categories.
This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been or can be applied in various stress-strain problems encountered in "high technology" engineering and some related areas, such as materials science and solid-state physics. The following major objectives are pursued in Structural Analysis in Microelectronic and Fiber-Optic Systems: Identify structural elements typical for microelectronic and fiber-optic systems and devices, and introduce the student to the basic concepts of the mechanical behavior of microelectronic and fiber-optic struc tures, subjected to thermally induced or external loading. Select, advance, and present methods for analyzing stresses and deflections developed in microelectronic and fiber-optic structures; demonstrate the effectiveness of the methods and approaches of the classical struc tural analysis in the diverse mechanical problems of microelectronics and fiber optics; and give students of engineering, as well as practicing engineers and designers, a thorough understanding of the main princi ples involved in the analytical evaluation of the mechanical behavior of microelectronic and fiber-optic systems.
Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging
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Author : Ephraim Suhir
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-05-26
Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging written by Ephraim Suhir and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-05-26 with Technology & Engineering categories.
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
A Thermodynamics Based Damage Mechanics Framework For Fatigue Analysis Of Microelectronics Solder Joints With Size Effects
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Author :
language : en
Publisher:
Release Date : 2006
A Thermodynamics Based Damage Mechanics Framework For Fatigue Analysis Of Microelectronics Solder Joints With Size Effects written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with categories.