Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture
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Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture
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Author : E-H Wong
language : en
Publisher: Woodhead Publishing
Release Date : 2015-05-23
Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture written by E-H Wong and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-05-23 with Technology & Engineering categories.
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. - Discusses how the reliability of packaging components is a prime concern to electronics manufacturers - Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques - Includes program files and macros for additional study
Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture Effects Of Temperature Moisture And Mechanical Driving Forces
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Author :
language : en
Publisher:
Release Date :
Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture Effects Of Temperature Moisture And Mechanical Driving Forces written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
Cyber Physical Systems Design And Application For Industry 4 0
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Author : Alla G. Kravets
language : en
Publisher: Springer Nature
Release Date : 2021-03-25
Cyber Physical Systems Design And Application For Industry 4 0 written by Alla G. Kravets and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-03-25 with Technology & Engineering categories.
This book consists of chapters dedicated to the questions of cyber-physical system design and its usage for the chemical industry and new material design. Also, the contribution of the book covers scientific research and their results for cyber-physical systems design and application in the energy domain and solutions regarding engineering education for cyber-physical systems design. The book offers unique content for researchers and practitioners who are looking for new knowledge and skills in the framework of Industry 4.0 solutions. The book also benefits researchers and practitioners in chemistry and new material design and manufacturing to understand how cyber-physical systems can be applied to increase efficiency and performance. The target audience of the book are practitioners, enterprises representatives, scientists, Ph.D. and master students who perform scientific research or applications of cyber-physical systems in the concept of Industry 4.0.
Road To Scientific Success The Inspiring Life Stories Of Prominent Researchers Volume 3
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Author : Deborah D L Chung
language : en
Publisher: World Scientific
Release Date : 2023-05-12
Road To Scientific Success The Inspiring Life Stories Of Prominent Researchers Volume 3 written by Deborah D L Chung and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-05-12 with Science categories.
The book is unique in its emphasis on the road to scientific success rather than the science itself. Scientists communicate much on their science through research publications, but they tend to talk much less, if at all, on the challenges encountered on the road to success. Information on the road to scientific success is helpful to people that are considering embarking on the journey on this road or are in the middle of the journey on this road. These people need inspiration and encouragement. Unless the information is recorded, it would be lost.The objectives of this book series are to:
Trends In The Development Of Quality Training Of Future Specialists
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Author :
language : uk
Publisher: International Science Group
Release Date : 2024-05-21
Trends In The Development Of Quality Training Of Future Specialists written by and has been published by International Science Group this book supported file pdf, txt, epub, kindle and other format this book has been release on 2024-05-21 with Language Arts & Disciplines categories.
Proceedings of the XX International Scientific and Practical Conference
Proceedings Of The International Symposium On Microelectronics
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Author :
language : en
Publisher:
Release Date : 1997
Proceedings Of The International Symposium On Microelectronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Hybrid integrated circuits categories.
1997 International Symposium On Microelectronics
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Author :
language : en
Publisher: International Society for Hybrid Microelectronics
Release Date : 1997
1997 International Symposium On Microelectronics written by and has been published by International Society for Hybrid Microelectronics this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Technology & Engineering categories.
Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF).
High Temperature Electronics
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Author : F. Patrick McCluskey
language : en
Publisher: CRC Press
Release Date : 1996-12-13
High Temperature Electronics written by F. Patrick McCluskey and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-12-13 with Technology & Engineering categories.
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Nanomaterials And Polymer Nanocomposites
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Author : Niranjan Karak
language : en
Publisher: Elsevier
Release Date : 2018-10-24
Nanomaterials And Polymer Nanocomposites written by Niranjan Karak and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-24 with Technology & Engineering categories.
Nanomaterials and Polymer Nanocomposites: Raw Materials to Applications brings together the most recent research in nanoparticles and polymer nanocomposites for a range of applications. The book's coverage is comprehensive, starting with synthesis techniques, then moving to characterization and applications of several different classes of nanomaterial and nanoparticle in nanocomposites. By presenting different nanomaterials, such as metal and metal oxides, clay and POSS, carbon nanotubes, cellulose and bio-based polymers in a structured manner, the book enables an efficient comparison of properties and capabilities for these advanced materials, making it relevant both for researchers in an academic environment and also industrial R&D. This book is particularly distinctive because it centers on the raw materials on which the nanocomposites are based, the biological properties of the range of materials discussed, and the environmental and economic considerations of different polymer systems. - Presents a thorough, up-to-date review of the latest advances and developments in the field of nanomaterials and polymer nanocomposites, with a particular focus on raw materials - Includes comprehensive coverage from historical backgrounds, synthesis techniques, characterization, and a detailed look at new and emerging applications for polymer nanocomposites - Provides a range of different material classes, including metal and metal oxides, biopolymers, graphene and cellulose, among others
Semiconductor Packaging
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Author : Andrea Chen
language : en
Publisher: CRC Press
Release Date : 2016-04-19
Semiconductor Packaging written by Andrea Chen and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-19 with Technology & Engineering categories.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.