Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture Effects Of Temperature Moisture And Mechanical Driving Forces
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Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture
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Author : E-H Wong
language : en
Publisher: Woodhead Publishing
Release Date : 2015-05-23
Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture written by E-H Wong and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-05-23 with Technology & Engineering categories.
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. - Discusses how the reliability of packaging components is a prime concern to electronics manufacturers - Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques - Includes program files and macros for additional study
Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture Effects Of Temperature Moisture And Mechanical Driving Forces
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Author :
language : en
Publisher:
Release Date :
Robust Design Of Microelectronics Assemblies Against Mechanical Shock Temperature And Moisture Effects Of Temperature Moisture And Mechanical Driving Forces written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
Power Electronic Packaging
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Author : Yong Liu
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-02-15
Power Electronic Packaging written by Yong Liu and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-15 with Technology & Engineering categories.
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
High Temperature Electronics
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Author : F. Patrick McCluskey
language : en
Publisher: CRC Press
Release Date : 1996-12-13
High Temperature Electronics written by F. Patrick McCluskey and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-12-13 with Technology & Engineering categories.
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
Semiconductor Gas Sensors
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Author : Raivo Jaaniso
language : en
Publisher: Woodhead Publishing
Release Date : 2019-09-24
Semiconductor Gas Sensors written by Raivo Jaaniso and has been published by Woodhead Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-09-24 with Technology & Engineering categories.
Semiconductor Gas Sensors, Second Edition, summarizes recent research on basic principles, new materials and emerging technologies in this essential field. Chapters cover the foundation of the underlying principles and sensing mechanisms of gas sensors, include expanded content on gas sensing characteristics, such as response, sensitivity and cross-sensitivity, present an overview of the nanomaterials utilized for gas sensing, and review the latest applications for semiconductor gas sensors, including environmental monitoring, indoor monitoring, medical applications, CMOS integration and chemical warfare agents. This second edition has been completely updated, thus ensuring it reflects current literature and the latest materials systems and applications. - Includes an overview of key applications, with new chapters on indoor monitoring and medical applications - Reviews developments in gas sensors and sensing methods, including an expanded section on gas sensor theory - Discusses the use of nanomaterials in gas sensing, with new chapters on single-layer graphene sensors, graphene oxide sensors, printed sensors, and much more
Reliability Of Mems
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Author : Osamu Tabata
language : en
Publisher: John Wiley & Sons
Release Date : 2008-02-04
Reliability Of Mems written by Osamu Tabata and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-02-04 with Technology & Engineering categories.
This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
Semiconductor Packaging
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Author : Andrea Chen
language : en
Publisher: CRC Press
Release Date : 2016-04-19
Semiconductor Packaging written by Andrea Chen and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-19 with Technology & Engineering categories.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Photoplethysmography
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Author : Panicos A. Kyriacou
language : en
Publisher: Academic Press
Release Date : 2021-11-03
Photoplethysmography written by Panicos A. Kyriacou and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-11-03 with Technology & Engineering categories.
Photoplethysmography: Technology, Signal Analysis, and Applications is the first comprehensive volume on the theory, principles, and technology (sensors and electronics) of photoplethysmography (PPG). It provides a detailed description of the current state-of-the-art technologies/optical components enabling the extreme miniaturization of such sensors, as well as comprehensive coverage of PPG signal analysis techniques including machine learning and artificial intelligence. The book also outlines the huge range of PPG applications in healthcare, with a strong focus on the contribution of PPG in wearable sensors and PPG for cardiovascular assessment. - Presents the underlying principles and technology surrounding PPG - Includes applications for healthcare and wellbeing - Focuses on PPG in wearable sensors and devices - Presents advanced signal analysis techniques - Includes cutting-edge research, applications and future directions
Mems Packaging
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Author : Yung-cheng Lee
language : en
Publisher: World Scientific
Release Date : 2018-01-03
Mems Packaging written by Yung-cheng Lee and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-01-03 with Technology & Engineering categories.
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Electrical Electronics Abstracts
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Author :
language : en
Publisher:
Release Date : 1997
Electrical Electronics Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Electrical engineering categories.