Attachment Materials For Electronic Assembly Requirements For Soldering Pastes For High Quality Interconnects In Electronics Assembly
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Attachment Materials For Electronic Assembly Requirements For Soldering Pastes For High Quality Interconnects In Electronics Assembly
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Author : British Standards Institute Staff
language : en
Publisher:
Release Date : 1914-06-30
Attachment Materials For Electronic Assembly Requirements For Soldering Pastes For High Quality Interconnects In Electronics Assembly written by British Standards Institute Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1914-06-30 with categories.
Electronic equipment and components, Electronic engineering, Electrical connections, Bonding, Soldering, Soldered connectors, Solders, Pastes, Quality control, Quality assurance, Classification systems
Harsh Environment Electronics
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Author : Ahmed Sharif
language : en
Publisher: John Wiley & Sons
Release Date : 2019-08-05
Harsh Environment Electronics written by Ahmed Sharif and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-08-05 with Technology & Engineering categories.
Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.
Chinese Standard Gb Gb T Gbt Jb Jb T Yy Hj Nb Hg Qc Sl Sn Sh Jjf Jjg Cj Tb Yd Ys Ny Fz Jg Qb Sj Sy Dl Aq Cb Gy Jc Jr Jt
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Author : https://www.chinesestandard.net
language : en
Publisher: https://www.chinesestandard.net
Release Date : 2018-01-01
Chinese Standard Gb Gb T Gbt Jb Jb T Yy Hj Nb Hg Qc Sl Sn Sh Jjf Jjg Cj Tb Yd Ys Ny Fz Jg Qb Sj Sy Dl Aq Cb Gy Jc Jr Jt written by https://www.chinesestandard.net and has been published by https://www.chinesestandard.net this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-01-01 with Law categories.
This document provides the comprehensive list of Chinese National Standards and Industry Standards (Total 17,000 standards).
Attachment Materials For Electronic Assembly Requirements For Electronic Grade Solder Alloys And Fluxed And Non Fluxed Solid Solder For Electronic Soldering Applications
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Author : British Standards Institute Staff
language : en
Publisher:
Release Date : 1918-03-28
Attachment Materials For Electronic Assembly Requirements For Electronic Grade Solder Alloys And Fluxed And Non Fluxed Solid Solder For Electronic Soldering Applications written by British Standards Institute Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1918-03-28 with categories.
Electronic equipment and components, Electronic engineering, Quality control, Bars (materials), Classification systems, Soldering, Fluxes (materials), Particulate materials, Bonding, Quality assurance, Test methods, Pastes, Electrical connections, Solders
Interconnect Reliability In Advanced Memory Device Packaging
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Author : Chong Leong, Gan
language : en
Publisher: Springer Nature
Release Date : 2023-05-30
Interconnect Reliability In Advanced Memory Device Packaging written by Chong Leong, Gan and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-05-30 with Computers categories.
This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously. This book discusses the reliability and technical challenges of first-level interconnect materials, packaging processes, advanced specialty reliability testing, and characterization of interconnects. It also examines the reliability of wire bonding, lead-free solder joints such as reliability testing and data analyses, design for reliability in hybrid packaging and HBM packaging, and failure analyses. The specialty of this book is that the materials covered are not only for second-level interconnects, but also for packaging assembly on first-level interconnects and for the semiconductor back-end on 2.5D and 3D memory interconnects. This book can be used as a text for college and graduate students who have the potential to become our future leaders, scientists, and engineers in the electronics and semiconductor industry.
Science Abstracts
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Author :
language : en
Publisher:
Release Date : 1995
Science Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995 with Electrical engineering categories.
Die Attach Materials For High Temperature Applications In Microelectronics Packaging
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Author : Kim S. Siow
language : en
Publisher: Springer
Release Date : 2019-01-29
Die Attach Materials For High Temperature Applications In Microelectronics Packaging written by Kim S. Siow and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-01-29 with Technology & Engineering categories.
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Adhesives Technology For Electronic Applications
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Author : James J. Licari
language : en
Publisher: William Andrew
Release Date : 2011-06-24
Adhesives Technology For Electronic Applications written by James J. Licari and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-06-24 with Technology & Engineering categories.
Approx.512 pages Approx.512 pages
Attachment Materials For Electronic Assembly Requirements For Electronic Grade Solder Alloys And Fluxed And Non Fluxed Solid Solders For Electronic Soldering Applications
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Author : British Standards Institute Staff
language : en
Publisher:
Release Date : 2007-07-31
Attachment Materials For Electronic Assembly Requirements For Electronic Grade Solder Alloys And Fluxed And Non Fluxed Solid Solders For Electronic Soldering Applications written by British Standards Institute Staff and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-07-31 with categories.
Electronic equipment and components, Electronic engineering, Electrical connections, Bonding, Soldering, Solders, Fluxes (materials), Bars (materials), Particulate materials, Pastes, Classification systems, Quality control, Quality assurance, Test methods
Structural Dynamics Of Electronic And Photonic Systems
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Author : Ephraim Suhir
language : en
Publisher: John Wiley & Sons
Release Date : 2011-04-04
Structural Dynamics Of Electronic And Photonic Systems written by Ephraim Suhir and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-04-04 with Technology & Engineering categories.
The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.