Avoiding Inelastic Strains In Solder Joint Interconnections Of Ic Devices
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Avoiding Inelastic Strains In Solder Joint Interconnections Of Ic Devices
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Author : Ephraim Suhir
language : en
Publisher:
Release Date : 2020
Avoiding Inelastic Strains In Solder Joint Interconnections Of Ic Devices written by Ephraim Suhir and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020 with Failure analysis (Engineering) categories.
"The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. It helps the reader predict and minimize, at the design stage and using analytical modeling concepts and approaches, the stresses and strains in solder joint interconnects of IC devices"--
Avoiding Inelastic Strains In Solder Joint Interconnections Of Ic Devices
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Author : Ephraim Suhir
language : en
Publisher: CRC Press
Release Date : 2021-01-28
Avoiding Inelastic Strains In Solder Joint Interconnections Of Ic Devices written by Ephraim Suhir and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-01-28 with Technology & Engineering categories.
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.
Applied Mechanics Reviews
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Author :
language : en
Publisher:
Release Date : 1985
Applied Mechanics Reviews written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1985 with Mechanics, Applied categories.
Solid Mechanics Research Trends And Oppotunities
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Author :
language : en
Publisher:
Release Date : 1985
Solid Mechanics Research Trends And Oppotunities written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1985 with Mechanics, Applied categories.
Electrical Electronics Abstracts
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Author :
language : en
Publisher:
Release Date : 1997
Electrical Electronics Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Electrical engineering categories.
Metals Abstracts
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Author :
language : en
Publisher:
Release Date : 1992
Metals Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with Metallurgy categories.
Design And Reliability Of Solders And Solder Interconnections
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Author : Rao K. Mahidhara
language : en
Publisher: Minerals, Metals, & Materials Society
Release Date : 1997
Design And Reliability Of Solders And Solder Interconnections written by Rao K. Mahidhara and has been published by Minerals, Metals, & Materials Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Technology & Engineering categories.
The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliability such as microstructural stability in service, creep, fatigue, creep/fatigue interactions, and thermomechanical fatigue of bulk solders and solder joints.
Fundamentals Of Lead Free Solder Interconnect Technology
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Author : Tae-Kyu Lee
language : en
Publisher: Springer
Release Date : 2014-11-05
Fundamentals Of Lead Free Solder Interconnect Technology written by Tae-Kyu Lee and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-11-05 with Technology & Engineering categories.
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Mechanics Of Solder Alloy Interconnects
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Author : Darrel R. Frear
language : en
Publisher: Springer Science & Business Media
Release Date : 1994-01-31
Mechanics Of Solder Alloy Interconnects written by Darrel R. Frear and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994-01-31 with Computers categories.
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.
Assembly And Reliability Of Lead Free Solder Joints
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Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2020-05-29
Assembly And Reliability Of Lead Free Solder Joints written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-05-29 with Technology & Engineering categories.
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.