Design And Reliability Of Solders And Solder Interconnections
DOWNLOAD
Download Design And Reliability Of Solders And Solder Interconnections PDF/ePub or read online books in Mobi eBooks. Click Download or Read Online button to get Design And Reliability Of Solders And Solder Interconnections book now. This website allows unlimited access to, at the time of writing, more than 1.5 million titles, including hundreds of thousands of titles in various foreign languages. If the content not found or just blank you must refresh this page
Design And Reliability Of Solders And Solder Interconnections
DOWNLOAD
Author : Rao K. Mahidhara
language : en
Publisher: Minerals, Metals, & Materials Society
Release Date : 1997
Design And Reliability Of Solders And Solder Interconnections written by Rao K. Mahidhara and has been published by Minerals, Metals, & Materials Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Electronic packaging categories.
The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliability such as microstructural stability in service, creep, fatigue, creep/fatigue interactions, and thermomechanical fatigue of bulk solders and solder joints.
Fundamentals Of Lead Free Solder Interconnect Technology
DOWNLOAD
Author : Tae-Kyu Lee
language : en
Publisher: Springer
Release Date : 2014-11-05
Fundamentals Of Lead Free Solder Interconnect Technology written by Tae-Kyu Lee and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-11-05 with Technology & Engineering categories.
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.
Assembly And Reliability Of Lead Free Solder Joints
DOWNLOAD
Author : John H. Lau
language : en
Publisher: Springer Nature
Release Date : 2020-05-29
Assembly And Reliability Of Lead Free Solder Joints written by John H. Lau and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-05-29 with Technology & Engineering categories.
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
Lead Free Solder
DOWNLOAD
Author : John Hock Lye Pang
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-10-15
Lead Free Solder written by John Hock Lye Pang and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-10-15 with Technology & Engineering categories.
Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.
Solder Joint Reliability
DOWNLOAD
Author : John H. Lau
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-27
Solder Joint Reliability written by John H. Lau and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-27 with Technology & Engineering categories.
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Lead Free Solder Interconnect Reliability
DOWNLOAD
Author : Dongkai Shangguan
language : en
Publisher: ASM International
Release Date : 2005
Lead Free Solder Interconnect Reliability written by Dongkai Shangguan and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Technology & Engineering categories.
Solder Joint Reliability
DOWNLOAD
Author : John H. Lau
language : en
Publisher: Springer Science & Business Media
Release Date : 1991-05-31
Solder Joint Reliability written by John H. Lau and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991-05-31 with Computers categories.
Looks at how solder joint reliability is influenced by flux reactions, solder paste, reflow methods, wave soldering, and cleaning. Explores failure mechanisms and includes practical methods for testing, analysis, and life prediction of solder joints subjected to conditions of fatigue, creep, stress relaxation, shock, and vibration. For engineers and designers involved in electronics packaging. Annotation copyrighted by Book News, Inc., Portland, OR
Solder Joint Reliability Of Bga Csp Flip Chip And Fine Pitch Smt Assemblies
DOWNLOAD
Author : John H. Lau
language : en
Publisher: McGraw-Hill Professional Publishing
Release Date : 1997
Solder Joint Reliability Of Bga Csp Flip Chip And Fine Pitch Smt Assemblies written by John H. Lau and has been published by McGraw-Hill Professional Publishing this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Technology & Engineering categories.
This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry's need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balancing concepts and practical applications, the authors explain the fundamentals of solder joint reliability and present creative, robust packaging techniques for cost-effective interconnection.
Lead Free Soldering In Electronics
DOWNLOAD
Author : Katsuaki Suganuma
language : en
Publisher: CRC Press
Release Date : 2003-12-11
Lead Free Soldering In Electronics written by Katsuaki Suganuma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-12-11 with Technology & Engineering categories.
Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics. A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices! Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses: Soldering inspection and design Mechanical evaluation in electronics Lead-free solder paste and reflow soldering Wave soldering Plating lead-free soldering in electronics Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.
A Guide To Lead Free Solders
DOWNLOAD
Author : John W. Evans
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-01-05
A Guide To Lead Free Solders written by John W. Evans and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-01-05 with Technology & Engineering categories.
The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.