Design And Reliability Of Solders And Solder Interconnections
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Design And Reliability Of Solders And Solder Interconnections
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Author : Rao K. Mahidhara
language : en
Publisher: Minerals, Metals, & Materials Society
Release Date : 1997
Design And Reliability Of Solders And Solder Interconnections written by Rao K. Mahidhara and has been published by Minerals, Metals, & Materials Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Technology & Engineering categories.
The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliability such as microstructural stability in service, creep, fatigue, creep/fatigue interactions, and thermomechanical fatigue of bulk solders and solder joints.
Lead Free Solder Interconnect Reliability
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Author : Dongkai Shangguan
language : en
Publisher: ASM International
Release Date : 2005
Lead Free Solder Interconnect Reliability written by Dongkai Shangguan and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Technology & Engineering categories.
Lead Free Soldering In Electronics
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Author : Katsuaki Suganuma
language : en
Publisher: CRC Press
Release Date : 2003-12-11
Lead Free Soldering In Electronics written by Katsuaki Suganuma and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-12-11 with Technology & Engineering categories.
Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics. A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices! Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses: Soldering inspection and design Mechanical evaluation in electronics Lead-free solder paste and reflow soldering Wave soldering Plating lead-free soldering in electronics Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.
Reliability Of Microtechnology
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Author : Johan Liu
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-02-07
Reliability Of Microtechnology written by Johan Liu and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-02-07 with Technology & Engineering categories.
Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also includes exercises and detailed solutions at the end of each chapter.
Handbook Of Lead Free Solder Technology For Microelectronic Assemblies
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Author : Karl J. Puttlitz
language : en
Publisher: CRC Press
Release Date : 2004-02-27
Handbook Of Lead Free Solder Technology For Microelectronic Assemblies written by Karl J. Puttlitz and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-02-27 with Technology & Engineering categories.
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.
Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging
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Author : Ephraim Suhir
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-05-26
Micro And Opto Electronic Materials And Structures Physics Mechanics Design Reliability Packaging written by Ephraim Suhir and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-05-26 with Technology & Engineering categories.
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Brazing And Soldering 2012
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Author : Robbin Gourley
language : en
Publisher: ASM International
Release Date : 2012-01-01
Brazing And Soldering 2012 written by Robbin Gourley and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-01-01 with Technology & Engineering categories.
The Crc Handbook Of Thermal Engineering
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Author : Frank Kreith
language : en
Publisher: Springer Science & Business Media
Release Date : 2000-02-01
The Crc Handbook Of Thermal Engineering written by Frank Kreith and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-02-01 with Technology & Engineering categories.
This book is unique in its in-depth coverage of heat transfer and fluid mechanics including numerical and computer methods, applications, thermodynamics and fluid mechanics. It will serve as a comprehensive resource for professional engineers well into the new millennium. Some of the material will be drawn from the "Handbook of Mechanical Engineering," but with expanded information in such areas as compressible flow and pumps, conduction, and desalination.
Brazing And Soldering
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Author : John J. Stephens
language : en
Publisher: ASM International
Release Date : 2006-01-01
Brazing And Soldering written by John J. Stephens and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-01-01 with Technology & Engineering categories.
Investigations On Microstructure And Mechanical Properties Of The Cu Pb Free Solder Joint Interfaces
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Author : Qingke Zhang
language : en
Publisher: Springer
Release Date : 2015-10-31
Investigations On Microstructure And Mechanical Properties Of The Cu Pb Free Solder Joint Interfaces written by Qingke Zhang and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-10-31 with Science categories.
This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.