Bibliography Of Microelectronics And Electronics Packaging And Interconnection References 1986 1989
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Bibliography Of Microelectronics And Electronics Packaging And Interconnection References 1986 1989
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Author : John F. Graves
language : en
Publisher:
Release Date : 1990
Bibliography Of Microelectronics And Electronics Packaging And Interconnection References 1986 1989 written by John F. Graves and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Technology & Engineering categories.
Microelectronic Packaging
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Author : A. H. Agajanian
language : en
Publisher: Springer
Release Date : 2012-11-17
Microelectronic Packaging written by A. H. Agajanian and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-11-17 with Technology & Engineering categories.
Microelectronic packaging protects and supports electronic devices and circuits and provides connections to the other parts of the system. The protection function avoids mechanical, electrical, chemical, contamination, and photo-optical damage, degeneration, and causes of malfunction. Hybrid microelectronic circuits and subsystem packages support the substrates; the substrate contains the circuit elements, (semiconductor devices or IC chips, deposited or chip resistors and capacitors, and attached inductors), as well as deposited and bonded interconnection wires. The connections to other parts of the system include electrical leads, heat removal paths, and mounting functions. At present, in order to meet the demands of VLSI, the emphasis is on packages with higher densities while maintaining performance, reliability, and low cost. This book is a comprehensive bibliography of over 3000 refer ences of the world literature in microelectronic packaging. It is compiled to assist the workers in the field in comparing their work with that done by others. For easy access to the needed references, the book is divided into many sections and subsections (see Contents). A comprehensive subject index is also given to assure easy access to the needed data. The book cites a number of books and review articles for the beginner in the field who wishes to become familiar with the subject. Novel technologies, such as bubble domain and multilayer ceramic packaging are highlighted. The literature from January 1976 to December 1978 is covered.
Microelectronic Packaging
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Author : A. H. Agajanian
language : en
Publisher: Springer
Release Date : 2013-05-14
Microelectronic Packaging written by A. H. Agajanian and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-05-14 with Technology & Engineering categories.
Microelectronic packaging protects and supports electronic devices and circuits and provides connections to the other parts of the system. The protection function avoids mechanical, electrical, chemical, contamination, and photo-optical damage, degeneration, and causes of malfunction. Hybrid microelectronic circuits and subsystem packages support the substrates; the substrate contains the circuit elements, (semiconductor devices or IC chips, deposited or chip resistors and capacitors, and attached inductors), as well as deposited and bonded interconnection wires. The connections to other parts of the system include electrical leads, heat removal paths, and mounting functions. At present, in order to meet the demands of VLSI, the emphasis is on packages with higher densities while maintaining performance, reliability, and low cost. This book is a comprehensive bibliography of over 3000 refer ences of the world literature in microelectronic packaging. It is compiled to assist the workers in the field in comparing their work with that done by others. For easy access to the needed references, the book is divided into many sections and subsections (see Contents). A comprehensive subject index is also given to assure easy access to the needed data. The book cites a number of books and review articles for the beginner in the field who wishes to become familiar with the subject. Novel technologies, such as bubble domain and multilayer ceramic packaging are highlighted. The literature from January 1976 to December 1978 is covered.
Robust Electronic Design Reference Book No Special Title
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Author : John R. Barnes
language : en
Publisher: Springer Science & Business Media
Release Date : 2004
Robust Electronic Design Reference Book No Special Title written by John R. Barnes and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Technology & Engineering categories.
If you design electronics for a living, you need Robust Electronic Design Reference Book. Written by a working engineer, who has put over 115 electronic products into production at Sycor, IBM, and Lexmark, Robust Electronic Design Reference covers all the various aspects of designing and developing electronic devices and systems that: -Work. -Are safe and reliable. -Can be manufactured, tested, repaired, and serviced. -May be sold and used worldwide. -Can be adapted or enhanced to meet new and changing requirements.
Semiconductor Packaging
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Author : Andrea Chen
language : en
Publisher: CRC Press
Release Date : 2016-04-19
Semiconductor Packaging written by Andrea Chen and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-04-19 with Technology & Engineering categories.
In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
Springer Handbook Of Experimental Solid Mechanics
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Author : William N. Sharpe, Jr.
language : en
Publisher: Springer Science & Business Media
Release Date : 2008-12-04
Springer Handbook Of Experimental Solid Mechanics written by William N. Sharpe, Jr. and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-12-04 with Mathematics categories.
The Springer Handbook of Experimental Solid Mechanics documents both the traditional techniques as well as the new methods for experimental studies of materials, components, and structures. The emergence of new materials and new disciplines, together with the escalating use of on- and off-line computers for rapid data processing and the combined use of experimental and numerical techniques have greatly expanded the capabilities of experimental mechanics. New exciting topics are included on biological materials, MEMS and NEMS, nanoindentation, digital photomechanics, photoacoustic characterization, and atomic force microscopy in experimental solid mechanics. Presenting complete instructions to various areas of experimental solid mechanics, guidance to detailed expositions in important references, and a description of state-of-the-art applications in important technical areas, this thoroughly revised and updated edition is an excellent reference to a widespread academic, industrial, and professional engineering audience.
Microelectronics Packaging Handbook
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Author : R.R. Tummala
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Microelectronics Packaging Handbook written by R.R. Tummala and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Heterogeneous Integrations
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Author : John H. Lau
language : en
Publisher: Springer
Release Date : 2019-04-03
Heterogeneous Integrations written by John H. Lau and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-04-03 with Technology & Engineering categories.
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Electrical Conductive Adhesives With Nanotechnologies
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Author : Yi (Grace) Li
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-10-08
Electrical Conductive Adhesives With Nanotechnologies written by Yi (Grace) Li and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-10-08 with Technology & Engineering categories.
“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.
Plastic Encapsulated Microelectronics
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Author : Michael Pecht
language : en
Publisher: Wiley-Interscience
Release Date : 1995-02-20
Plastic Encapsulated Microelectronics written by Michael Pecht and has been published by Wiley-Interscience this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995-02-20 with Business & Economics categories.
Until now, professionals in search of detailed information about the latest developments in PEM design and production have had to waste valuable time browsing through countless professional journals, monographs, and databases.