Ceramic Substrates And Packages For Electronic Applications
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Ceramic Substrates And Packages For Electronic Applications
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Author : Man F. Yan
language : en
Publisher:
Release Date : 1989
Ceramic Substrates And Packages For Electronic Applications written by Man F. Yan and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with Technology & Engineering categories.
Ceramic Interconnect Technology Handbook
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Author : Fred D. Barlow, III
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Ceramic Interconnect Technology Handbook written by Fred D. Barlow, III and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Advanced Electronic Packaging
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Author : Richard K. Ulrich
language : en
Publisher: John Wiley & Sons
Release Date : 2006-02-24
Advanced Electronic Packaging written by Richard K. Ulrich and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-02-24 with Technology & Engineering categories.
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
Advanced Organics For Electronic Substrates And Packages
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Author : Andrew E Fletcher
language : en
Publisher: Elsevier
Release Date : 2013-10-22
Advanced Organics For Electronic Substrates And Packages written by Andrew E Fletcher and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-10-22 with Science categories.
Advanced Organics for Electronic Substrates and Packages provides information on packaging, which is one of the most technologically intensive activities in the electronics industry. The electronics packaging community has realized that while semiconductor devices continue to be improved upon for performance, cost, and reliability, it is the interconnection or packaging of these devices that will limit the performance of the systems. Technology must develop packaging for transistor chips, with high levels of performance and integration providing cooling, power, and interconnection, and yet preserve the performance of the semiconductors with minimum package delay to the system. Trends in each of the major packaging technologies include chip level connection, providing the required connections between the chip and the semiconductor package. The power distribution to the chip and heat removal from the chip; first level packages providing all the necessary wiring; interconnections and power distribution; first-to-second level interconnections; and second level packages providing all the necessary wiring, connections, power distribution, and power supply connection are included as well. This book is a useful and informative reference to students or individuals studying or conducting research within the field of electronic engineering.
Materials In Microelectronic And Optoelectronic Packaging
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Author : Hung C. Ling
language : en
Publisher:
Release Date : 1993
Materials In Microelectronic And Optoelectronic Packaging written by Hung C. Ling and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Technology & Engineering categories.
Uses Of Ceramics In Microelectronics
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Author : W. R. Bratschun
language : en
Publisher:
Release Date : 1971
Uses Of Ceramics In Microelectronics written by W. R. Bratschun and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1971 with Electronic ceramics categories.
"This survey is one of a series issued by the National Aeronautics and Space Administration as part of its Technology Utilization Program to disseminate information useful for general industrial applications. Uses of Ceramics in Microelectronics is addressed to management personnel concerned with electronic circuitry. It describes advances in the state of the art of passive components (insulators, resistors, and capacitors) of electronic devices. Requirements for the exploration of space have accelerated such advances, and they can be helpful in many additional ways. The electronics industry has become highly dependent on the interface between materials and devices. Improvements in passive components have kept pace with advances in active devices. Unanticipated benefits in design flexibility and tolerances to adverse environments have been discovered. Mass production of passive components can bring about wider use of ceramics in microelectronic systems. Both industrial processes and consumer products can thereby be improved. In the final chapter the authors have examined the interface between materials and devices as it affects microcircuitry, and have shown how technology is transferable from the aerospace community to many broad tasks in fulfilling human needs."--Foreword.
Multilayer Ceramic Substrate Technology For Vlsi Package Multichip Module
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Author : K. Otsuka
language : en
Publisher: Springer Science & Business Media
Release Date : 1993-04-30
Multilayer Ceramic Substrate Technology For Vlsi Package Multichip Module written by K. Otsuka and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993-04-30 with Technology & Engineering categories.
This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.
Ceramic Interconnect Technology Handbook
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Author : Fred D. Barlow, III
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Ceramic Interconnect Technology Handbook written by Fred D. Barlow, III and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect material today. Most available information about ceramic electronics is either outdated or focused on their materials science characteristics. The Ceramic Interconnect Technology Handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies. Collecting contributions from an outstanding panel of experts, this book offers an up-to-date overview of modern ceramic electronics, from design and material selection to manufacturing and implementation. Beginning with an overview of the development, properties, advantages, and applications of ceramics, coverage spans electrical design, testing, simulation, thermomechanical design, screen printing, multilayer ceramics, photo-defined and photo-imaged films, copper interconnects for ceramic substrates, and integrated passive devices in ceramic substrates. It also offers a detailed review of the surface, thermal, mechanical, and electrical properties of various ceramics as well as the processing of high- and low-temperature cofired ceramic (HTCC and LTCC) substrates. Opening new vistas and avenues of advancement, the Ceramic Interconnect Technology Handbook is the only source for comprehensive discussion and analysis of nearly every facet of ceramic interconnect technology and applications.
Handbook Of Electronic Package Design
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Author : Michael Pecht
language : en
Publisher: CRC Press
Release Date : 2018-10-24
Handbook Of Electronic Package Design written by Michael Pecht and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-24 with Technology & Engineering categories.
Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development
Characterization Of Ceramics
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Author : Ronald E. Loehman
language : en
Publisher: Momentum Press
Release Date : 2010
Characterization Of Ceramics written by Ronald E. Loehman and has been published by Momentum Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with Science categories.
Ceramics are, in a general definition, materials that consist of man-made, inorganic, non-metallic solid material - either existing in a crystalline state or non-crystalline state (i.e., glasses). Materials characterization techniques are used to ensure the structural and surface integrity of ceramics for their use in a wide variety of applications, from thermal resistance to advanced electronic and optical technologies like fiber optics to structural uses. This book presents those techniques along with views on future trends in ceramics processing and advanced characterization technologies particularly appropriate to ceramics materials. Readers will find more on: Ceramic Materials preparation routes, including powder preparation by solution techniques and gas-phase techniques Formation techniques for ceramic films and coatings, thick films and bulk ceramics A review of ceramic microstructure, reactions, phase behavior, mechanical properties and electronic and magnetic ceramics