Characterization And Metrology For Ulsi Technology 2000
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Characterization And Metrology For Ulsi Technology 2005
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Author : David G. Seiler
language : en
Publisher: American Institute of Physics
Release Date : 2005-09-29
Characterization And Metrology For Ulsi Technology 2005 written by David G. Seiler and has been published by American Institute of Physics this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-09-29 with Computers categories.
The worldwide semiconductor community faces increasingly difficult challenges in the era of silicon nanotechnology and beyond. The magnitude of these challenges demands special attention from the metrology and analytical measurements community. New paradigms must be found. Adequate research and development for new metrology concepts are urgently needed. Characterization and metrology are key enablers for developing new semiconductor technology and in improving manufacturing. This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continuing the advances in semiconductor technology. It covers major aspects of process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics. The book also covers emerging nano-devices and the corresponding metrology challenges that arise.
Characterization And Metrology For Ulsi Technology 2000
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Author : David G. Seiler
language : en
Publisher: American Institute of Physics
Release Date : 2001-03-01
Characterization And Metrology For Ulsi Technology 2000 written by David G. Seiler and has been published by American Institute of Physics this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001-03-01 with Technology & Engineering categories.
The worldwide semiconductor community faces increasingly difficult challenges as it moves into the manufacturing of chips with feature sizes approaching 100 nm. Some of the challenges are materials-related, such as transistors with high-k dielectrics and on-chip interconnects made from copper and low-k dielectrics. The magnitude of these challenges demands special attention from those in the metrology and analytical measurements community. Characterization and metrology are key enablers for developing semiconductor process technology and in improving manufacturing. This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continue the advances in semiconductor technology. It covers major aspects of the process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics. It provides a concise and effective portrayal of industry characterization needs and some of the problems that must be addressed by industry, academia, and government to continue the dramatic progress in semiconductor technology. It also provides a basis for stimulating practical perspectives and new ideas for research and development.
Journal Of Research Of The National Institute Of Standards And Technology
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Author :
language : en
Publisher:
Release Date : 2006
Journal Of Research Of The National Institute Of Standards And Technology written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Measurement categories.
Reports NIST research and development in the physical and engineering sciences in which the Institute is active. These include physics, chemistry, engineering, mathematics, and computer sciences. Emphasis on measurement methodology and the basic technology underlying standardization.
Nistir
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Author :
language : en
Publisher:
Release Date : 2001
Nistir written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with categories.
Characterization And Metrology For Ulsi Technology 2000
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Author : David G. Seiler
language : en
Publisher:
Release Date : 2001
Characterization And Metrology For Ulsi Technology 2000 written by David G. Seiler and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Electronic books categories.
Istfa 2003
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Author : ASM International
language : en
Publisher: ASM International
Release Date : 2003-01-01
Istfa 2003 written by ASM International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-01-01 with Technology & Engineering categories.
Semiconductor Material And Device Characterization
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Author : Dieter K. Schroder
language : en
Publisher: John Wiley & Sons
Release Date : 2015-06-29
Semiconductor Material And Device Characterization written by Dieter K. Schroder and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-06-29 with Technology & Engineering categories.
This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.
Handbook Of Silicon Wafer Cleaning Technology
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Author : Karen Reinhardt
language : en
Publisher: William Andrew
Release Date : 2008-12-10
Handbook Of Silicon Wafer Cleaning Technology written by Karen Reinhardt and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-12-10 with Technology & Engineering categories.
The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included. - Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits - As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries - Covers processes and equipment, as well as new materials and changes required for the surface conditioning process - Editors are two of the top names in the field and are both extensively published - Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol
Semiconductor Silicon 2002
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Author : Howard R. Huff
language : en
Publisher: The Electrochemical Society
Release Date : 2002
Semiconductor Silicon 2002 written by Howard R. Huff and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Science categories.
High Dielectric Constant Materials
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Author : Howard Huff
language : en
Publisher: Springer Science & Business Media
Release Date : 2005-11-02
High Dielectric Constant Materials written by Howard Huff and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005-11-02 with Technology & Engineering categories.
Issues relating to the high-K gate dielectric are among the greatest challenges for the evolving International Technology Roadmap for Semiconductors (ITRS). More than just an historical overview, this book will assess previous and present approaches related to scaling the gate dielectric and their impact, along with the creative directions and forthcoming challenges that will define the future of gate dielectric scaling technology. Topics include: an extensive review of Moore's Law, the classical regime for SiO2 gate dielectrics; the transition to silicon oxynitride gate dielectrics; the transition to high-K gate dielectrics (including the drive towards equivalent oxide thickness in the single-digit nanometer regime); and future directions and issues for ultimate technology generation scaling. The vision, wisdom, and experience of the team of authors will make this book a timely, relevant, and interesting, resource focusing on fundamentals of the 45 nm Technology Generation and beyond.