Istfa 2003
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Istfa 2003
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Author : ASM International
language : en
Publisher: ASM International
Release Date : 2003-01-01
Istfa 2003 written by ASM International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-01-01 with Technology & Engineering categories.
Microelectronics Fialure Analysis Desk Reference Seventh Edition
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Author : Tejinder Gandhi
language : en
Publisher: ASM International
Release Date : 2019-11-01
Microelectronics Fialure Analysis Desk Reference Seventh Edition written by Tejinder Gandhi and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-11-01 with Technology & Engineering categories.
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Microelectronics Failure Analysis
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Author : EDFAS Desk Reference Committee
language : en
Publisher: ASM International
Release Date : 2011
Microelectronics Failure Analysis written by EDFAS Desk Reference Committee and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with Technology & Engineering categories.
Includes bibliographical references and index.
Microelectronics Failure Analysis
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Author :
language : en
Publisher: ASM International
Release Date : 2004-01-01
Microelectronics Failure Analysis written by and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004-01-01 with Technology & Engineering categories.
For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Thirty Fourth International Symposium For Testing And Failure Analysis
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Author : ASM International
language : en
Publisher: ASM International
Release Date : 2008-01-01
Thirty Fourth International Symposium For Testing And Failure Analysis written by ASM International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-01-01 with Technology & Engineering categories.
Materials And Reliability Handbook For Semiconductor Optical And Electron Devices
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Author : Osamu Ueda
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-09-22
Materials And Reliability Handbook For Semiconductor Optical And Electron Devices written by Osamu Ueda and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-09-22 with Science categories.
Materials and Reliability Handbook for Semiconductor Optical and Electron Devices provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature. The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.
Spintronics Handbook Second Edition Spin Transport And Magnetism
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Author : Evgeny Y. Tsymbal
language : en
Publisher: CRC Press
Release Date : 2019-06-26
Spintronics Handbook Second Edition Spin Transport And Magnetism written by Evgeny Y. Tsymbal and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-06-26 with Science categories.
Spintronics Handbook, Second Edition offers an update on the single most comprehensive survey of the two intertwined fields of spintronics and magnetism, covering the diverse array of materials and structures, including silicon, organic semiconductors, carbon nanotubes, graphene, and engineered nanostructures. It focuses on seminal pioneering work, together with the latest in cutting-edge advances, notably extended discussion of two-dimensional materials beyond graphene, topological insulators, skyrmions, and molecular spintronics. The main sections cover physical phenomena, spin-dependent tunneling, control of spin and magnetism in semiconductors, and spin-based applications. Features: Presents the most comprehensive reference text for the overlapping fields of spintronics (spin transport) and magnetism. Covers the full spectrum of materials and structures, from silicon and organic semiconductors to carbon nanotubes, graphene, and engineered nanostructures. Extends coverage of two-dimensional materials beyond graphene, including molybdenum disulfide and study of their spin relaxation mechanisms Includes new dedicated chapters on cutting-edge topics such as spin-orbit torques, topological insulators, half metals, complex oxide materials and skyrmions. Discusses important emerging areas of spintronics with superconductors, spin-wave spintronics, benchmarking of spintronics devices, and theory and experimental approaches to molecular spintronics. Evgeny Tsymbal's research is focused on computational materials science aiming at the understanding of fundamental properties of advanced ferromagnetic and ferroelectric nanostructures and materials relevant to nanoelectronics and spintronics. He is a George Holmes University Distinguished Professor at the Department of Physics and Astronomy of the University of Nebraska-Lincoln (UNL), Director of the UNL’s Materials Research Science and Engineering Center (MRSEC), and Director of the multi-institutional Center for NanoFerroic Devices (CNFD). Igor Žutić received his Ph.D. in theoretical physics at the University of Minnesota. His work spans a range of topics from high-temperature superconductors and ferromagnetism that can get stronger as the temperature is increased, to prediction of various spin-based devices. He is a recipient of 2006 National Science Foundation CAREER Award, 2005 National Research Council/American Society for Engineering Education Postdoctoral Research Award, and the National Research Council Fellowship (2003-2005). His research is supported by the National Science Foundation, the Office of Naval Research, the Department of Energy, and the Airforce Office of Scientific Research.
New Approaches To Image Processing Based Failure Analysis Of Nano Scale Ulsi Devices
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Author : Zeev Zalevsky
language : en
Publisher: William Andrew
Release Date : 2013-11-13
New Approaches To Image Processing Based Failure Analysis Of Nano Scale Ulsi Devices written by Zeev Zalevsky and has been published by William Andrew this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-13 with Technology & Engineering categories.
New Approaches to Image Processing Based Failure Analysis of Nano-Scale ULSI Devices introduces the reader to transmission and scanning microscope image processing for metal and non-metallic microstructures. Engineers and scientists face the pressing problem in ULSI development and quality assurance: microscopy methods can't keep pace with the continuous shrinking of feature size in microelectronics. Nanometer scale sizes are below the resolution of light, and imaging these features is nearly impossible even with electron microscopes, due to image noise. This book presents novel "smart" image processing methods, applications, and case studies concerning quality improvement of microscope images of microelectronic chips and process optimization. It explains an approach for high-resolution imaging of advanced metallization for micro- and nanoelectronics. This approach obviates the time-consuming preparation and selection of microscope measurement and sample conditions, enabling not only better electron-microscopic resolution, but also more efficient testing and quality control. This in turn leads to productivity gains in design and development of nano-scale ULSI chips. The authors also present several approaches for super-resolving low-resolution images to improve failure analysis of microelectronic chips. - Acquaints users with new software-based approaches to enhance high-resolution microscope imaging of microchip structures - Demonstrates how these methods lead to productivity gains in the development of ULSI chips - Presents several techniques for the superresolution of images, enabling engineers and scientists to improve their results in failure analysis of microelectronic chips
Proceedings
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Author :
language : en
Publisher:
Release Date : 2005
Proceedings written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Electronic apparatus and appliances categories.
Proceedings Of The International Symposium On The Physical Failure Analysis Of Integrated Circuits
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Author :
language : en
Publisher:
Release Date : 2005
Proceedings Of The International Symposium On The Physical Failure Analysis Of Integrated Circuits written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Integrated circuits categories.