Copper Interconnects New Contact Metallurgies Structures And Low K Interlevel Dielectrics

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Copper Interconnects New Contact Metallurgies Structures And Low K Interlevel Dielectrics

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Author :
language : en
Publisher: The Electrochemical Society
Release Date : 2003

Copper Interconnects New Contact Metallurgies Structures And Low K Interlevel Dielectrics written by and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Electronic packaging categories.

Copper Interconnects New Contact Metallurgies Structures And Low K Interlevel Dielectrics Ii

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Author : G. S. Mathad
language : en
Publisher: The Electrochemical Society
Release Date : 2003

Copper Interconnects New Contact Metallurgies Structures And Low K Interlevel Dielectrics Ii written by G. S. Mathad and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Science categories.

Copper Interconnects New Contact Metallurgies Structures And Low K Inter Level Dielectrics

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Author : G. Mathad
language : en
Publisher: The Electrochemical Society
Release Date : 2009-03

Copper Interconnects New Contact Metallurgies Structures And Low K Inter Level Dielectrics written by G. Mathad and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-03 with Science categories.

The papers included in this issue of ECS Transactions were originally presented in the symposium ¿Low k Inter-Level Metal Dielectrics and New Contact and Barrier Metallurgies/Structures¿, held during the PRiME 2008 joint international meeting of The Electrochemical Society and The Electrochemical Society of Japan, with the technical cosponsorship of the Japan Society of Applied Physics, the Korean Electrochemical Society, the Electrochemistry Division of the Royal Australian Chemical Institute, and the Chinese Society of Electrochemistry. This meeting was held in Honolulu, Hawaii, from October 12 to 17, 2008.

Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications

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Author : Yosi Shacham-Diamand
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-09-19

Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications written by Yosi Shacham-Diamand and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-09-19 with Science categories.

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

Copper Interconnects New Contact Metallurgies Structures And Low K Inter Level Dielectrics

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Author : Electrochemical Society
language : en
Publisher:
Release Date : 2008

Copper Interconnects New Contact Metallurgies Structures And Low K Inter Level Dielectrics written by Electrochemical Society and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008 with Technology & Engineering categories.

Chemical Mechanical Planarization Iv

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Author : R. L. Opila
language : en
Publisher: The Electrochemical Society
Release Date : 2001

Chemical Mechanical Planarization Iv written by R. L. Opila and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Technology & Engineering categories.

Cleaning Technology In Semiconductor Device Manufacturing

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Author :
language : en
Publisher:
Release Date : 2003

Cleaning Technology In Semiconductor Device Manufacturing written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Semiconductor wafers categories.

Cleaning Technology In Semiconductor Device Manufacturing Viii

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Author : Jerzy Rużyłło
language : en
Publisher: The Electrochemical Society
Release Date : 2004

Cleaning Technology In Semiconductor Device Manufacturing Viii written by Jerzy Rużyłło and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Technology & Engineering categories.

Electrochemical Processes In Ulsi And Mems

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Author : Hariklia Deligianni
language : en
Publisher: The Electrochemical Society
Release Date : 2005

Electrochemical Processes In Ulsi And Mems written by Hariklia Deligianni and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with Computers categories.

Meeting Abstracts

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Author : Electrochemical Society
language : en
Publisher:
Release Date : 2002

Meeting Abstracts written by Electrochemical Society and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Electrochemistry categories.