Design And Process Integration For Microelectronic Manufacturing Ii
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Design And Process Integration For Microelectronic Manufacturing
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Author :
language : en
Publisher:
Release Date : 2006
Design And Process Integration For Microelectronic Manufacturing written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Integrated circuits categories.
Design And Process Integration For Microelectronic Manufacturing Ii Sic
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Author : Lars W. Liebmann
language : en
Publisher: SPIE-International Society for Optical Engineering
Release Date : 2004
Design And Process Integration For Microelectronic Manufacturing Ii Sic written by Lars W. Liebmann and has been published by SPIE-International Society for Optical Engineering this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Business & Economics categories.
Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Design And Process Integration For Microelectronic Manufacturing Ii
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Author :
language : en
Publisher:
Release Date : 2004
Design And Process Integration For Microelectronic Manufacturing Ii written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with categories.
Eda For Ic Implementation Circuit Design And Process Technology
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Author : Luciano Lavagno
language : en
Publisher: CRC Press
Release Date : 2018-10-03
Eda For Ic Implementation Circuit Design And Process Technology written by Luciano Lavagno and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-10-03 with Technology & Engineering categories.
Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.
Design Rules In A Semiconductor Foundry
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Author : Eitan N. Shauly
language : en
Publisher: CRC Press
Release Date : 2022-11-30
Design Rules In A Semiconductor Foundry written by Eitan N. Shauly and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-11-30 with Technology & Engineering categories.
Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.
Handbook Of Algorithms For Physical Design Automation
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Author : Charles J. Alpert
language : en
Publisher: CRC Press
Release Date : 2008-11-12
Handbook Of Algorithms For Physical Design Automation written by Charles J. Alpert and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-11-12 with Computers categories.
The physical design flow of any project depends upon the size of the design, the technology, the number of designers, the clock frequency, and the time to do the design. As technology advances and design-styles change, physical design flows are constantly reinvented as traditional phases are removed and new ones are added to accommodate changes in
Semiconductors
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Author : Artur Balasinski
language : en
Publisher: CRC Press
Release Date : 2018-09-03
Semiconductors written by Artur Balasinski and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-09-03 with Computers categories.
Because of the continuous evolution of integrated circuit manufacturing (ICM) and design for manufacturability (DfM), most books on the subject are obsolete before they even go to press. That’s why the field requires a reference that takes the focus off of numbers and concentrates more on larger economic concepts than on technical details. Semiconductors: Integrated Circuit Design for Manufacturability covers the gradual evolution of integrated circuit design (ICD) as a basis to propose strategies for improving return-on-investment (ROI) for ICD in manufacturing. Where most books put the spotlight on detailed engineering enhancements and their implications for device functionality, in contrast, this one offers, among other things, crucial, valuable historical background and roadmapping, all illustrated with examples. Presents actual test cases that illustrate product challenges, examine possible solution strategies, and demonstrate how to select and implement the right one This book shows that DfM is a powerful generic engineering concept with potential extending beyond its usual application in automated layout enhancements centered on proximity correction and pattern density. This material explores the concept of ICD for production by breaking down its major steps: product definition, design, layout, and manufacturing. Averting extended discussion of technology, techniques, or specific device dimensions, the author also avoids the clumsy chapter architecture that can hinder other books on this subject. The result is an extremely functional, systematic presentation that simplifies existing approaches to DfM, outlining a clear set of criteria to help readers assess reliability, functionality, and yield. With careful consideration of the economic and technical trade-offs involved in ICD for manufacturing, this reference addresses techniques for physical, electrical, and logical design, keeping coverage fresh and concise for the designers, manufacturers, and researchers defining product architecture and research programs.
Chips And Change
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Author : Clair Brown
language : en
Publisher: MIT Press
Release Date : 2011-08-19
Chips And Change written by Clair Brown and has been published by MIT Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-08-19 with Business & Economics categories.
How the chip industry has responded to a series of crises over the past twenty-five years, often reinventing itself and shifting the basis for global competitive advantage. For decades the semiconductor industry has been a driver of global economic growth and social change. Semiconductors, particularly the microchips essential to most electronic devices, have transformed computing, communications, entertainment, and industry. In Chips and Change, Clair Brown and Greg Linden trace the industry over more than twenty years through eight technical and competitive crises that forced it to adapt in order to continue its exponential rate of improved chip performance. The industry's changes have in turn shifted the basis on which firms hold or gain global competitive advantage. These eight interrelated crises do not have tidy beginnings and ends. Most, in fact, are still ongoing, often in altered form. The U.S. semiconductor industry's fear that it would be overtaken by Japan in the 1980s, for example, foreshadows current concerns over the new global competitors China and India. The intersecting crises of rising costs for both design and manufacturing are compounded by consumer pressure for lower prices. Other crises discussed in the book include the industry's steady march toward the limits of physics, the fierce competition that keeps its profits modest even as development costs soar, and the global search for engineering talent. Other high-tech industries face crises of their own, and the semiconductor industry has much to teach about how industries are transformed in response to such powerful forces as technological change, shifting product markets, and globalization. Chips and Change also offers insights into how chip firms have developed, defended, and, in some cases, lost global competitive advantage.
Electronic Design Automation For Ic Implementation Circuit Design And Process Technology
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Author : Luciano Lavagno
language : en
Publisher: CRC Press
Release Date : 2017-02-03
Electronic Design Automation For Ic Implementation Circuit Design And Process Technology written by Luciano Lavagno and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-02-03 with Technology & Engineering categories.
The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.
Design Of Cost Efficient Interconnect Processing Units
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Author : Marcello Coppola
language : en
Publisher: CRC Press
Release Date : 2020-10-14
Design Of Cost Efficient Interconnect Processing Units written by Marcello Coppola and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-10-14 with Technology & Engineering categories.
Streamlined Design Solutions Specifically for NoC To solve critical network-on-chip (NoC) architecture and design problems related to structure, performance and modularity, engineers generally rely on guidance from the abundance of literature about better-understood system-level interconnection networks. However, on-chip networks present several distinct challenges that require novel and specialized solutions not found in the tried-and-true system-level techniques. A Balanced Analysis of NoC Architecture As the first detailed description of the commercial Spidergon STNoC architecture, Design of Cost-Efficient Interconnect Processing Units: Spidergon STNoC examines the highly regarded, cost-cutting technology that is set to replace well-known shared bus architectures, such as STBus, for demanding multiprocessor system-on-chip (SoC) applications. Employing a balanced, well-organized structure, simple teaching methods, numerous illustrations, and easy-to-understand examples, the authors explain: how the SoC and NoC technology works why developers designed it the way they did the system-level design methodology and tools used to configure the Spidergon STNoC architecture differences in cost structure between NoCs and system-level networks From professionals in computer sciences, electrical engineering, and other related fields, to semiconductor vendors and investors – all readers will appreciate the encyclopedic treatment of background NoC information ranging from CMPs to the basics of interconnection networks. The text introduces innovative system-level design methodology and tools for efficient design space exploration and topology selection. It also provides a wealth of key theoretical and practical MPSoC and NoC topics, such as technological deep sub-micron effects, homogeneous and heterogeneous processor architectures, multicore SoC, interconnect processing units, generic NoC components, and embeddings of common communication patterns.