Design Fabrication And Characterization Of Ultra High Speed Inp Gaassb Inp Double Heterojunction Bipolar Transistors
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Design Fabrication And Characterization Of Ultra High Speed Inp Gaassb Inp Double Heterojunction Bipolar Transistors
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Author : Martin W. Dvorak
language : en
Publisher:
Release Date : 2001
Design Fabrication And Characterization Of Ultra High Speed Inp Gaassb Inp Double Heterojunction Bipolar Transistors written by Martin W. Dvorak and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2001 with Bipolar transistors categories.
Characterization Simulation And Optimization Of Type Ii Gaassb Based Double Heterojunction Bipolar Transistors
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Author : Nick Gengming Tao
language : en
Publisher:
Release Date : 2006
Characterization Simulation And Optimization Of Type Ii Gaassb Based Double Heterojunction Bipolar Transistors written by Nick Gengming Tao and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with Bipolar transisitors categories.
In recent years, GaAsSb/InP double heterojunction bipolar transistors (DHBTs) have been demonstrated to be promising alternatives to InP/InGaAs HBTs, for next generation microwave/millimeter wave applications and optoelectronic integrated circuits (OEICs). However, GaAsSb-based DHBTs featuring the novel base material and type-II band alignment have not been well studied. This thesis investigated type-II GaAsSb DHBTs in the following aspects: periphery surface recombination current, Kirk effect, two dimensional (2D) simulation and device optimization. The present work provided insights into device operation, and guidances for further device development. A series of physical models and parameters was implemented in 2D device simulations using ISE TCAD. Band gap narrowing (BGN) in the bases was characterized by comparing experimental and simulated results. Excellent agreements between the measured and simulated DC and RF results were achieved. Emitter size effects associated with the surface recombination current were experimentally characterized for emitter sizes of 0.5 by 6 to 80 by 80 square micrometer. The 2D simulations by implementing surface state models revealed the mechanism for the surface recombination current. Two device structures were proposed to diminish surface recombination current. Numerical simulations for type-II GaAsSb-InP base-collector (BC) junctions showed that conventional base "push-out" does not occur at high injection levels, and instead the electric field at the BC junction is reversed and an electron barrier at the base side evolves. The electron barrier was found to play an important role in the Kirk effect, and the electron tunnelling through the barrier delays the onset of the Kirk effect. This novel mechanism was supported by the measurement for GaAsSb/InP DHBTs with two base doping levels. The study also showed that the magnitude of the electric field at the BC junction at zero collector current directly affects onset of the Kirk effect. Finally, optimizations for the emitter, base and collector were carried out through 2D simulations. A thin InAlAs emitter, an (Al)GaAsSb compositionally graded base with band gap variance of 0.1eV, and a high n-type delta doping in the collector were proposed to simultaneously achieve high frequency performance, high Kirk current density and high breakdown voltage.
Ieice Transactions On Electronics
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Author :
language : en
Publisher:
Release Date : 2003
Ieice Transactions On Electronics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Electronics categories.
Chemical Abstracts
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Author :
language : en
Publisher:
Release Date : 2002
Chemical Abstracts written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Chemistry categories.
Inp Gaassb Inp Double Heterojunction Bipolar Transistors
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Author : C. R. Bolgnesi
language : en
Publisher:
Release Date : 2002
Inp Gaassb Inp Double Heterojunction Bipolar Transistors written by C. R. Bolgnesi and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with categories.
InP/GaAsSb/InP double heterojunction bipolar transistors (DHBTs) are some of the fastest bipolar transistors ever fabricated, with current gain cutoff and maximum oscillation frequencies simultaneously exceeding 300 GHz while maintaining breakdown voltages BV(sub ceo> 6V I. InP/GaAsSb/InP DHBTs are particularly appealing because excellent device figures of merit are achievable with relatively simple structures involving abrupt junctions and uniform doping levels and compositions. This is a tremendous manufacturability advantage and the reason why some organizations have moved aggressively toward GaAsSb DHBT production despite a relative scarcity of information on the physical properties of the GaAsSb alloy in comparison to GalnAs. The present paper reviews some of the key concepts associated with the use of GaAsSb base layers, and discusses the physical operation InP/GaAsSb/InP DHBTs. In particular, we will describe the implications of the staggered band lineup at the E/B and B/C heterojunctions for charge storage in the devices, and show that InP/GaAsSb/InP DHBTs offer inherent advantages from that point of view. We will also show that GaAsSb based DHBTs can be expected to display better scalability than GainAs-based devices because of their inherently superior base Ohmic contacts.
Dissertation Abstracts International
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Author :
language : en
Publisher:
Release Date : 2007
Dissertation Abstracts International written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Dissertations, Academic categories.
Journal Of The Physical Society Of Japan
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Author :
language : en
Publisher:
Release Date : 2002
Journal Of The Physical Society Of Japan written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Physics categories.
Japanese Journal Of Applied Physics
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Author :
language : en
Publisher:
Release Date : 2002
Japanese Journal Of Applied Physics written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Physics categories.
Reliability Study Of Ingap Gaas Heterojunction Bipolar Transistor Mmic Technology By Characterization Modeling And Simulation
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Author : Xiang Liu
language : en
Publisher:
Release Date : 2011
Reliability Study Of Ingap Gaas Heterojunction Bipolar Transistor Mmic Technology By Characterization Modeling And Simulation written by Xiang Liu and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011 with Bipolar transistors categories.
Recent years have shown real advances of microwave monolithic integrated circuits (MMICs) for millimeter-wave frequency systems, such as wireless communication, advanced imaging, remote sensing and automotive radar systems, as MMICs can provide the size, weight and performance required for these systems. Traditionally, GaAs pseudomorphic high electron mobility transistor (pHEMT) or InP based MMIC technology has dominated in millimeter-wave frequency applications because of their high f[subscript T] and f[subscript max] as well as their superior noise performance. But these technologies are very expensive. Thus, for low cost and high performance applications, InGaP/GaAs heterojunction bipolar transistors (HBTs) are quickly becoming the preferred technology to be used due to their inherently excellent characteristics. These features, together with the need for only one power supply to bias the device, make InGaP/GaAs HBTs very attractive for the design of high performance fully integrated MMICs. With the smaller dimensions for improving speed and functionality of InGaP/GaAs HBTs, which dissipate large amount of power and result in heat flux accumulated in the device junction, technology reliability issues are the first concern for the commercialization. As the thermally triggered instabilities often seen in InGaP/GaAs HBTs, a carefully derived technique to define the stress conditions of accelerated life test has been employed in our study to acquire post-stress device characteristics for the projection of long-term device performance degradation pattern. To identify the possible origins of the post-stress device behaviors observed experimentally, a two dimensional (2-D) TCAD numerical device simulation has been carried out. Using this approach, it is suggested that the acceptor-type trapping states located in the emitter bulk are responsible for the commonly seen post-stress base current instability over the moderate base-emitter voltage region. HBT-based MMIC performance is very sensitive to the variation of core device characteristics and the reliability issues put the limit on its radio frequency (RF) behaviors. While many researchers have reported the observed stress-induced degradations of GaAs HBT characteristics, there has been little published data on the full understanding of stress impact on the GaAs HBT-based MMICs. If care is not taken to understand this issue, stress-induced degradation paths can lead to built-in circuit failure during regular operations. However, detection of this failure may be difficult due to the circuit complexity and lead to erroneous data or output conditions. Thus, a practical and analytical methodology has been developed to predict the stress impacts on HBT-based MMICs. It provides a quick way and guidance for the RF design engineer to evaluate the circuit performance with reliability considerations. Using the present existing EDA tools (Cadance SpectreRF and Agilent ADS) with the extracted pre- and post-stress transistor models, the electrothermal stress effects on InGaP/GaAs HBT-based RF building blocks including power amplifier (PA), low-noise amplifier (LNA) and oscillator have been systematically evaluated. This provides a potential way for the RF/microwave industry to save tens of millions of dollars annually in testing costs. The world now stands at the threshold of the age of advanced GaAs HBT MMIC technology and researchers have been exploring here for years. The reliability of GaAs HBT technology is no longer the post-design evaluation, but the pre-design consideration. The successful and fruitful results of this dissertation provide methods and guidance for the RF designers to achieve more reliable RF circuits with advanced GaAs HBT technology in the future.
Design And Fabrication Of Ingan Gan Heterojunction Bipolar Transistors For Microwave Power Amplifiers
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Author : David Martin Keogh
language : en
Publisher:
Release Date : 2006
Design And Fabrication Of Ingan Gan Heterojunction Bipolar Transistors For Microwave Power Amplifiers written by David Martin Keogh and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006 with categories.
The GaN material system is widely recognized for its opto-electronic properties, with the recent commercialization of blue, green, and violet light emitting devices, but also has enormous potential for high power applications across a range of frequencies. The combination of high breakdown field, high electron saturation velocity, and high thermal conductivity, make it especially useful for delivering high power at high frequencies for wireless base stations, emerging WiMAX technology, and satellite communications. Though HEMTs have shown impressive performance, HBTs have many advantages as compared to HEMTs, and therefore represent an important technology. Bipolar technology, however, has not achieved the same level of success as HEMTs, as a result of some important technological obstacles. For example, the main issue with GaN-based HBTs is the issue of acceptor impurity activation, which is typically less than 1% for GaN, limiting free hole concentrations to less than 1x1018 cm-3. Through the use of InGaN alloys in the base of an HBT, however, it is possible to achieve doping levels greater than 1x1019 cm-3, with higher mobilities and less lattice damage, enabling a high performance RF device. This dissertation embodies the design, fabrication, and characterization of InGaN/GaN HBTs under DC and RF conditions. Design of the epitaxial layer structure accounts for the piezo-electric and polarization effects present in the nitrides, which is critical for proper device operation. Furthermore, the DC and RF performance is simulated using physically based TCAD device design software to estimate the performance of an InGaN/GaN HBT. In addition, the performance of a fully-matched Class-B power amplifier is simulated at 1 GHz. Processing of InGaN/GaN HBTs was a significant portion of this thesis, and as such, a robust scheme for their fabrication was developed. Dry-etching was accomplished using Inductively Coupled Plasma (ICP), and the effects of etch conditions on the characteristics of the device explored. Also, boiling KOH solutions were found to be useful for improving the surface quality after dry-etching, and as part of a digital etching process. The final process enabled the successful fabrication of InGaN/GaN HBTs with excellent DC performance, and a maximum cut-off frequency of 0.8 GHz.