Design Of Cmos Millimeter Wave And Terahertz Integrated Circuits With Metamaterials
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Design Of Cmos Millimeter Wave And Terahertz Integrated Circuits With Metamaterials
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Author : Hao Yu
language : en
Publisher: CRC Press
Release Date : 2015-10-19
Design Of Cmos Millimeter Wave And Terahertz Integrated Circuits With Metamaterials written by Hao Yu and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-10-19 with Computers categories.
This book shows that with the use of metamaterials, one can have coherent THz signal generation, amplification, transmission, and detection for phase-arrayed CMOS transistors with significantly improved performance. Offering detailed coverage from device to system, the book describes the design and application of metamaterials in actual CMOS integrated circuits, includes real circuit examples and chip demonstrations with measurement results, and also evaluates system performance after CMOS-based system-on-chip integration. The book reflects the latest research progress and provides a state-of-the-art reference on CMOS-based metamaterial devices and mm-wave and THz systems.
Cmos Integrated Lab On A Chip System For Personalized Biomedical Diagnosis
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Author : Hao Yu
language : en
Publisher: John Wiley & Sons
Release Date : 2018-04-04
Cmos Integrated Lab On A Chip System For Personalized Biomedical Diagnosis written by Hao Yu and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-04-04 with Technology & Engineering categories.
A thorough examination of lab-on-a-chip circuit-level operations to improve system performance A rapidly aging population demands rapid, cost-effective, flexible, personalized diagnostics. Existing systems tend to fall short in one or more capacities, making the development of alternatives a priority. CMOS Integrated Lab-on-a-Chip System for Personalized Biomedical Diagnosis provides insight toward the solution, with a comprehensive, multidisciplinary reference to the next wave of personalized medicine technology. A standard complementary metal oxide semiconductor (CMOS) fabrication technology allows mass-production of large-array, miniaturized CMOS-integrated sensors from multi-modal domains with smart on-chip processing capability. This book provides an in-depth examination of the design and mechanics considerations that make this technology a promising platform for microfluidics, micro-electro-mechanical systems, electronics, and electromagnetics. From CMOS fundamentals to end-user applications, all aspects of CMOS sensors are covered, with frequent diagrams and illustrations that clarify complex structures and processes. Detailed yet concise, and designed to help students and engineers develop smaller, cheaper, smarter lab-on-a-chip systems, this invaluable reference: Provides clarity and insight on the design of lab-on-a-chip personalized biomedical sensors and systems Features concise analyses of the integration of microfluidics and micro-electro-mechanical systems Highlights the use of compressive sensing, super-resolution, and machine learning through the use of smart SoC processing Discusses recent advances in complementary metal oxide semiconductor-integrated lab-on-a-chip systems Includes guidance on DNA sequencing and cell counting applications using dual-mode chemical/optical and energy harvesting sensors The conventional reliance on the microscope, flow cytometry, and DNA sequencing leaves diagnosticians tied to bulky, expensive equipment with a central problem of scale. Lab-on-a-chip technology eliminates these constraints while improving accuracy and flexibility, ushering in a new era of medicine. This book is an essential reference for students, researchers, and engineers working in diagnostic circuitry and microsystems.
High Speed Devices And Circuits With Thz Applications
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Author : Jung Han Choi
language : en
Publisher: CRC Press
Release Date : 2017-09-19
High Speed Devices And Circuits With Thz Applications written by Jung Han Choi and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-09-19 with Science categories.
Presenting the cutting-edge results of new device developments and circuit implementations, High-Speed Devices and Circuits with THz Applications covers the recent advancements of nano devices for terahertz (THz) applications and the latest high-speed data rate connectivity technologies from system design to integrated circuit (IC) design, providing relevant standard activities and technical specifications. Featuring the contributions of leading experts from industry and academia, this pivotal work: Discusses THz sensing and imaging devices based on nano devices and materials Describes silicon on insulator (SOI) multigate nanowire field-effect transistors (FETs) Explains the theory underpinning nanoscale nanowire metal-oxide-semiconductor field-effect transistors (MOSFETs), simulation methods, and their results Explores the physics of the silicon-germanium (SiGe) heterojunction bipolar transistor (HBT), as well as commercially available SiGe HBT devices and their applications Details aspects of THz IC design using standard silicon (Si) complementary metal-oxide-semiconductor (CMOS) devices, including experimental setups for measurements, detection methods, and more An essential text for the future of high-frequency engineering, High-Speed Devices and Circuits with THz Applications offers valuable insight into emerging technologies and product possibilities that are attractive in terms of mass production and compatibility with current manufacturing facilities.
Plasmonic Metamaterials And Electromagnetic Devices
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Author : Zhen Liao
language : en
Publisher: Frontiers Media SA
Release Date : 2022-08-25
Plasmonic Metamaterials And Electromagnetic Devices written by Zhen Liao and has been published by Frontiers Media SA this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-08-25 with Science categories.
Antenna Technology For Terahertz Wireless Communication
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Author : Uri Nissanov
language : en
Publisher: Springer Nature
Release Date : 2023-07-11
Antenna Technology For Terahertz Wireless Communication written by Uri Nissanov and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-07-11 with Technology & Engineering categories.
This book discusses terahertz (THz) wireless communication, particularly for 6G enabling technologies, including antenna design, and channel modeling with channel characteristics for the success of reliable 6G wireless communication. The authors describe THz microstrip antenna technologies with different substrates and introduce some useful substrates to reduce the conductor and substrate losses at the THz frequencies. The discussion also includes the design of the THz unit-cell microstrip antenna and the techniques to boost the microstrip antennas' gain, directivity, and impedance bandwidth (BW), which influence the wireless communication range which is highly affected by the path losses of atmospheric conditions, and transmit and receive data rates, respectively. Moreover, this book discusses the multi-beam and beamforming THz antenna technologies with the multi-user-multiple-input-multiple-output (MU-MIMO) features. Additionally, this book describes the reconfigurable capabilities, artificial intelligence, machine learning, and deep learning technologies that will influence the success of 6G wireless communication and the authors suggest a remedy for integrating multiple radios into the system-on-chip (SoC) design.
Antenna In Package Technology And Applications
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Author : Duixian Liu
language : en
Publisher: John Wiley & Sons
Release Date : 2020-03-31
Antenna In Package Technology And Applications written by Duixian Liu and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-03-31 with Technology & Engineering categories.
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Active Metamaterials
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Author : Saroj Rout
language : en
Publisher: Springer
Release Date : 2017-01-21
Active Metamaterials written by Saroj Rout and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-01-21 with Technology & Engineering categories.
This book covers the theoretical background, experimental methods and implementation details to engineer for communication and imaging application, terahertz devices using metamaterials, in mainstream semiconductor foundry processes. This book will provide engineers and physicists an authoritative reference to construct such devices with minimal background. The authors describe the design and construction of electromagnetic (EM) devices for terahertz frequencies (108-1010 cycles/sec) using artificial materials that are a fraction of the wavelength of the incident EM wave, resulting in an effective electric and magnetic properties (permittivity and permeability) that are unavailable in natural materials.
Advanced Millimeter Wave Technologies
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Author : Duixian Liu
language : en
Publisher: John Wiley & Sons
Release Date : 2009-03-03
Advanced Millimeter Wave Technologies written by Duixian Liu and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-03-03 with Technology & Engineering categories.
This book explains one of the hottest topics in wireless and electronic devices community, namely the wireless communication at mmWave frequencies, especially at the 60 GHz ISM band. It provides the reader with knowledge and techniques for mmWave antenna design, evaluation, antenna and chip packaging. Addresses practical engineering issues such as RF material evaluation and selection, antenna and packaging requirements, manufacturing tolerances, antenna and system interconnections, and antenna One of the first books to discuss the emerging research and application areas, particularly chip packages with integrated antennas, wafer scale mmWave phased arrays and imaging Contains a good number of case studies to aid understanding Provides the antenna and packaging technologies for the latest and emerging applications with the emphases on antenna integrations for practical applications such as wireless USB, wireless video, phase array, automobile collision avoidance radar, and imaging
Fundamentals Of High Frequency Cmos Analog Integrated Circuits
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Author : Duran Leblebici
language : en
Publisher: Springer Nature
Release Date : 2021-03-10
Fundamentals Of High Frequency Cmos Analog Integrated Circuits written by Duran Leblebici and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-03-10 with Technology & Engineering categories.
This textbook is ideal for senior undergraduate and graduate courses in RF CMOS circuits, RF circuit design, and high-frequency analog circuit design. It is aimed at electronics engineering students and IC design engineers in the field, wishing to gain a deeper understanding of circuit fundamentals, and to go beyond the widely-used automated design procedures. The authors employ a design-centric approach, in order to bridge the gap between fundamental analog electronic circuits textbooks and more advanced RF IC design texts. The structure and operation of the building blocks of high-frequency ICs are introduced in a systematic manner, with an emphasis on transistor-level operation, the influence of device characteristics and parasitic effects, and input–output behavior in the time and frequency domains. This second edition has been revised extensively, to expand some of the key topics, to clarify the explanations, and to provide extensive design examples and problems. New material has been added for basic coverage of core topics, such as wide-band LNAs, noise feedback concept and noise cancellation, inductive-compensated band widening techniques for flat-gain or flat-delay characteristics, and basic communication system concepts that exploit the convergence and co-existence of Analog and Digital building blocks in RF systems. A new chapter (Chapter 5) has been added on Noise and Linearity, addressing key topics in a comprehensive manner. All of the other chapters have also been revised and largely re-written, with the addition of numerous, solved design examples and exercise problems.
Systems Level Packaging For Millimeter Wave Transceivers
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Author : Mladen Božanić
language : en
Publisher: Springer
Release Date : 2019-03-26
Systems Level Packaging For Millimeter Wave Transceivers written by Mladen Božanić and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-03-26 with Technology & Engineering categories.
This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.