Dielectric Films For Advanced Microelectronics
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Dielectric Films For Advanced Microelectronics
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Author : Mikhail Baklanov
language : en
Publisher: John Wiley & Sons
Release Date : 2007-04-04
Dielectric Films For Advanced Microelectronics written by Mikhail Baklanov and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-04-04 with Technology & Engineering categories.
The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
Advanced Interconnects For Ulsi Technology
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Author : Mikhail Baklanov
language : en
Publisher: John Wiley & Sons
Release Date : 2012-02-17
Advanced Interconnects For Ulsi Technology written by Mikhail Baklanov and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-02-17 with Technology & Engineering categories.
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Foundations Of Nanotechnology Volume Two
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Author : Sabu Thomas
language : en
Publisher: CRC Press
Release Date : 2014-10-24
Foundations Of Nanotechnology Volume Two written by Sabu Thomas and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-10-24 with Science categories.
The collection of topics in this book reflects the diversity of recent advances in nanoelements formation and interactions in nanosystems with a broad perspective that is useful for scientists as well as for graduate students and engineers. One of the main tasks in making nanocomposites is building the dependence of the structure and shape of the n
Glancing Angle Deposition Of Thin Films
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Author : Matthew M. Hawkeye
language : en
Publisher: John Wiley & Sons
Release Date : 2014-07-03
Glancing Angle Deposition Of Thin Films written by Matthew M. Hawkeye and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-07-03 with Technology & Engineering categories.
This book provides a highly practical treatment of Glancing Angle Deposition (GLAD), a thin film fabrication technology optimized to produce precise nanostructures from a wide range of materials. GLAD provides an elegant method for fabricating arrays of nanoscale helices, chevrons, columns, and other porous thin film architectures using physical vapour deposition processes such as sputtering or evaporation. The book gathers existing procedures, methodologies, and experimental designs into a single, cohesive volume which will be useful both as a ready reference for those in the field and as a definitive guide for those entering it. It covers: Development and description of GLAD techniques for nanostructuring thin films Properties and characterization of nanohelices, nanoposts, and other porous films Design and engineering of optical GLAD films including fabrication and testing, and chiral films Post-deposition processing and integration to optimize film behaviour and structure Deposition systems and requirements for GLAD fabrication A patent survey, extensive relevant literature, and a survey of GLAD's wide range of material properties and diverse applications.
Cmos Plasma And Process Damage
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Author : Kirk Prall
language : en
Publisher: Springer Nature
Release Date : 2025-05-16
Cmos Plasma And Process Damage written by Kirk Prall and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2025-05-16 with Technology & Engineering categories.
This book discusses the complex technology of building CMOS computer chips and covers some of the unusual problems that can occur during chip manufacturing. Readers will learn how plasma and process damage results from the high-energy processes that are used in chip manufacturing, causing harm to the chips, functional failure and reliability problems.
Thin Film Solar Cells
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Author : Jef Poortmans
language : en
Publisher: John Wiley & Sons
Release Date : 2006-10-02
Thin Film Solar Cells written by Jef Poortmans and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-10-02 with Science categories.
Thin-film solar cells are either emerging or about to emerge from the research laboratory to become commercially available devices finding practical various applications. Currently no textbook outlining the basic theoretical background, methods of fabrication and applications currently exist. Thus, this book aims to present for the first time an in-depth overview of this topic covering a broad range of thin-film solar cell technologies including both organic and inorganic materials, presented in a systematic fashion, by the scientific leaders in the respective domains. It covers a broad range of related topics, from physical principles to design, fabrication, characterization, and applications of novel photovoltaic devices.
Nanodevices And Nanomaterials For Ecological Security
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Author : Yuri N. Shunin
language : en
Publisher: Springer
Release Date : 2012-06-05
Nanodevices And Nanomaterials For Ecological Security written by Yuri N. Shunin and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-06-05 with Science categories.
This book is devoted to a wide range of problems concerning applications of nanomaterials and nanodevices as effective solutions to modern ecological problems. Leading experts in nanoscience and nanotechnology present the key theoretical, experimental and implementation issues related to the creation and utilization of novel nanoscale devices to help ensure ecological security. The authors discuss appropriate nanotechnologies for minimizing various types of risk: to human life, technogenic risk, or indeed terrorist threats. Particular emphasis is placed on defining and studying the required materials properties, and – in the field – on nanoscale devices for sensors and monitoring.
Fabrication Of Nanostructures By Plasma Electrolysis
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Author : Mahmood Aliofkhazraei
language : en
Publisher: John Wiley & Sons
Release Date : 2011-09-22
Fabrication Of Nanostructures By Plasma Electrolysis written by Mahmood Aliofkhazraei and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-09-22 with Technology & Engineering categories.
In this handbook and ready reference, the authors introduce the concept of plasma electrolysis, explaining how the coatings are characterized and discussing their mechanical and corrosion properties. They then go on to look at specific industrial applications of this powerful and low-cost method, including aerospace, the biomaterials industry as well as in the oil and gas industry.
Porous Media
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Author : Kambiz Vafai
language : en
Publisher: CRC Press
Release Date : 2010-08-24
Porous Media written by Kambiz Vafai and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-08-24 with Medical categories.
Presenting state-of-the-art research advancements, Porous Media: Applications in Biological Systems and Biotechnology explores innovative approaches to effectively apply existing porous media technologies to biomedical applications. In each peer-reviewed chapter, world-class scientists and engineers collaborate to address significant problems and d
Failure Analysis
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Author : Marius Bazu
language : en
Publisher: John Wiley & Sons
Release Date : 2011-03-08
Failure Analysis written by Marius Bazu and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-03-08 with Technology & Engineering categories.
Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.